PCP1302-TD-H Equivalent & Substitute Parts

Part Overview

The PCP1302-TD-H is a P-Channel MOSFET manufactured by onsemi, rated for 60V drain-to-source voltage with 3A continuous drain current at 25°C. The device is housed in a SOT-89/PCP-1 surface mount package and dissipates up to 3.5W at the case temperature. This part is classified as obsolete, making identification of equivalent and substitute components necessary for ongoing design support, production continuity, and system maintenance.

Substiute Parts

PCP1302-TD-H
onsemiIn Stock: 2227PCP1302-TD-H Datasheet
PCP1302-TD-H
Current Part
RD3L140SPTL1
Rohm SemiconductorIn Stock: 5194RD3L140SPTL1 Datasheet
RD3L140SPTL1
Similar

Key Parameters

Parameter Value Unit
FET Type P-Channel
Drain to Source Voltage (Vdss) 60 V
Current - Continuous Drain (Id) @ 25°C 3 A (Ta)
Rds On (Max) @ Id, Vgs 266 mOhm @ 1.5A, 10V
Vgs(th) (Max) @ Id 2.6 V @ 1mA
Gate Charge (Qg) (Max) @ Vgs 6.4 nC @ 10V
Power Dissipation (Max) 3.5 W (Tc)
Operating Temperature (TJ) 150 °C
Mounting Type Surface Mount
Package / Case TO-243AA
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the PCP1302-TD-H is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

  • FET Type: P-Channel topology
  • Drain to Source Voltage (Vdss): 60V minimum rating
  • Gate-Source Voltage (Vgs): ±20V maximum rating
  • Operating Temperature: 150°C maximum junction temperature
  • RoHS3 Compliance and MSL Level 1 classification
  • Surface mount technology with compatible package footprint

Performance Considerations:

  • Continuous drain current (Id) at 25°C must meet or exceed application requirements
  • On-resistance (Rds On) characteristics at specified gate and drain conditions
  • Gate charge (Qg) and input capacitance (Ciss) for switching performance
  • Power dissipation capability relative to thermal design requirements

The RD3L140SPTL1 from Rohm Semiconductor qualifies as a substitute based on matching voltage ratings, gate-source specifications, temperature range, and compliance certifications. The substitute exhibits enhanced electrical performance characteristics while maintaining functional compatibility within the defined parameter envelope.

Parameter Comparison

Parameter PCP1302-TD-H (onsemi) RD3L140SPTL1 (Rohm) Unit
FET Type P-Channel P-Channel
Drain to Source Voltage (Vdss) 60 60 V
Current - Continuous Drain (Id) @ 25°C 3 14 A (Ta)
Rds On (Max) @ Vgs 10V 266 @ 1.5A 84 @ 14A mOhm
Vgs(th) (Max) @ Id 2.6 @ 1mA 3.0 @ 1mA V
Gate Charge (Qg) (Max) @ Vgs 10V 6.4 27 nC
Vgs (Max) ±20 ±20 V
Power Dissipation (Max) 3.5 20 W (Tc)
Operating Temperature (TJ) 150 150 °C
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

PCP1302-TD-H (onsemi) — Obsolete Status: The PCP1302-TD-H is classified as obsolete and no longer in active production. While 2130 pieces remain in current inventory, this part is not recommended for new designs or long-term production commitments. Existing designs utilizing this component should transition to active alternatives to ensure supply chain continuity and future availability.

RD3L140SPTL1 (Rohm Semiconductor) — Active Status: The RD3L140SPTL1 is an active product with 5100 pieces in inventory. This substitute meets all critical electrical specifications, including voltage ratings, gate-source characteristics, and temperature range. Both components maintain ROHS3 compliance and MSL Level 1 classification, ensuring regulatory and environmental compatibility. The RD3L140SPTL1 provides superior continuous drain current (14A versus 3A) and power dissipation capability (20W versus 3.5W), offering enhanced performance headroom for thermal and current-handling requirements.

Package Consideration: The PCP1302-TD-H uses SOT-89/PCP-1 packaging (TO-243AA), while the RD3L140SPTL1 uses TO-252 packaging (DPAK with 2 leads plus tab). PCB layout modifications are required for package transition. Pin configuration and thermal pad placement differ between these packages and must be verified against schematic and layout requirements.

Frequently Asked Questions (FAQ)

Q: Can the RD3L140SPTL1 directly replace the PCP1302-TD-H without circuit modifications?

A: Electrical substitution is valid based on matching voltage ratings, gate-source specifications, and temperature range. However, package geometry differs (SOT-89/PCP-1 versus TO-252). PCB footprint redesign is required. Pin-to-pin functionality is compatible for P-Channel MOSFET operation.

Q: What are the key differences between these two parts?

A: The RD3L140SPTL1 provides higher continuous drain current (14A versus 3A), lower on-resistance (84 mOhm versus 266 mOhm at 10V), and greater power dissipation capability (20W versus 3.5W). Gate charge is higher (27 nC versus 6.4 nC), affecting switching speed. Both maintain identical voltage ratings and temperature specifications.

Q: Is the RD3L140SPTL1 suitable for applications requiring only 3A continuous current?

A: Yes. The RD3L140SPTL1 is rated for 14A continuous drain current, providing substantial margin above 3A requirements. Lower on-resistance reduces power dissipation in the application, improving thermal performance and efficiency.

Q: Are there compliance or regulatory differences between these parts?

A: Both components are ROHS3 compliant and carry MSL Level 1 classification. REACH status is unaffected for both parts. ECCN and HTSUS classifications are identical. No regulatory barriers exist for substitution.

Q: What is the impact of higher gate charge on circuit design?

A: The RD3L140SPTL1 exhibits 4.2 times higher gate charge (27 nC versus 6.4 nC at 10V). Gate driver circuits must supply adequate charge to achieve specified switching performance. Higher gate charge may increase switching losses in high-frequency applications. Circuit validation is necessary to confirm gate driver capability.

Q: Can the PCP1302-TD-H still be used in new designs?

A: The PCP1302-TD-H is obsolete and not recommended for new designs. Long-term supply availability cannot be assured. The RD3L140SPTL1 is an active product with established supply chain support and is the appropriate choice for new development.

Q: What package considerations apply to this substitution?

A: The PCP1302-TD-H uses SOT-89/PCP-1 (TO-243AA) with three leads. The RD3L140SPTL1 uses TO-252 (DPAK) with two leads plus a thermal tab. Pinout, lead spacing, and thermal pad dimensions differ. PCB layout must be redesigned to accommodate the new package geometry. Thermal management characteristics may improve due to the larger thermal tab in TO-252 packaging.

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