PCMF3DFN1X Equivalent & Substitute Parts

Part Overview

The PCMF3DFN1X is a 6-line common mode choke (CMC) surface mount component with integrated TVS diode ESD protection, manufactured by Nexperia USA Inc. This part features a typical DC resistance of 5Ohm and operates across the temperature range of -40°C to 85°C. The component is classified as obsolete, making identification of suitable substitute parts essential for ongoing design support and procurement continuity.

Substiute Parts

PCMF3DFN1X
Nexperia USA Inc.In Stock: 2029PCMF3DFN1X Datasheet
PCMF3DFN1X
Current Part
PCMF3USB3SZ
Nexperia USA Inc.In Stock: 39255PCMF3USB3SZ Datasheet
PCMF3USB3SZ
Similar

Key Parameters

Parameter Value
Manufacturer Part Number PCMF3DFN1X
Manufacturer Nexperia USA Inc.
Series PCM
Filter Type Signal Line
Number of Lines 6
DC Resistance (DCR) (Typ) 5Ohm
Operating Temperature Range -40°C ~ 85°C
Features TVS Diode ESD Protection
Mounting Type Surface Mount
Package / Case 14-XFDFN
Size / Dimension 0.157" L x 0.079" W (4.00mm x 2.00mm)
Height (Max) 0.020" (0.50mm)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the PCMF3DFN1X is determined by the following critical parameters:

  • Functional equivalence: 6-line common mode choke with integrated TVS diode ESD protection
  • Filter type: Signal line filtering application
  • Operating temperature range: -40°C to 85°C minimum
  • Compliance standards: ROHS3 compliance and REACH unaffected status
  • Mounting technology: Surface mount configuration
  • Electrical performance: DC resistance characteristics within acceptable operating parameters

The PCMF3USB3SZ qualifies as a substitute part based on matching functional classification, operating temperature range, compliance certifications, and core electrical characteristics. Variations in package geometry, DC resistance specification, and physical dimensions are documented in the parameter comparison table below.

Parameter Comparison

Parameter PCMF3DFN1X (Main Part) PCMF3USB3SZ (Substitute)
Manufacturer Nexperia USA Inc. Nexperia USA Inc.
Series PCM PCM
Filter Type Signal Line Signal Line
Number of Lines 6 6
DC Resistance (DCR) (Typ) 5Ohm 3Ohm
Operating Temperature Range -40°C ~ 85°C -40°C ~ 85°C
Features TVS Diode ESD Protection TVS Diode ESD Protection
Mounting Type Surface Mount Surface Mount
Package / Case 14-XFDFN 15-UFBGA, WLCSP
Size / Dimension 0.157" L x 0.079" W (4.00mm x 2.00mm) 0.093" L x 0.046" W (2.37mm x 1.17mm)
Height (Max) 0.020" (0.50mm) 0.024" (0.60mm)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active

Engineering Selection Recommendations

The PCMF3USB3SZ is an active product offering from Nexperia USA Inc. and represents the recommended substitute for the obsolete PCMF3DFN1X. Both components maintain identical compliance certifications (ROHS3 compliant, REACH unaffected) and share the same operating temperature specification of -40°C to 85°C.

The primary design consideration is the difference in package technology: the PCMF3DFN1X uses a 14-XFDFN package, while the PCMF3USB3SZ employs a 15-UFBGA/WLCSP package. This transition reflects modern manufacturing practices and enables a more compact footprint (0.093" x 0.046" versus 0.157" x 0.079").

The DC resistance specification differs between the two parts (5Ohm typical for PCMF3DFN1X versus 3Ohm typical for PCMF3USB3SZ). This lower resistance in the substitute part may provide improved signal integrity and reduced insertion loss in signal line filtering applications.

Frequently Asked Questions (FAQ)

Q: Can PCMF3USB3SZ directly replace PCMF3DFN1X in existing designs?

A: Functional substitution is possible based on matching filter type, line count, ESD protection features, and operating temperature range. However, the package change from 14-XFDFN to 15-UFBGA/WLCSP requires PCB layout redesign. The reduced DC resistance (3Ohm versus 5Ohm) may alter circuit performance characteristics and should be evaluated against application requirements.

Q: What is the significance of the package technology difference?

A: The PCMF3DFN1X uses a fine-pitch DFN package, while PCMF3USB3SZ employs a ball grid array (BGA) or wafer-level chip-scale package (WLCSP) technology. These represent different manufacturing and assembly approaches. WLCSP packages typically offer superior electrical performance and smaller form factors but require compatible assembly and rework capabilities.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both PCMF3DFN1X and PCMF3USB3SZ are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.

Q: Why does the substitute part have lower DC resistance?

A: The DC resistance specification reflects the electrical design of each package variant. The lower resistance (3Ohm) in PCMF3USB3SZ may result from improved conductor geometry or material selection in the newer package technology. Application-specific circuit analysis is required to determine compatibility.

Q: What is the inventory status for these parts?

A: PCMF3DFN1X is obsolete with limited availability (2000 Pcs reported). PCMF3USB3SZ is an active product with substantial inventory (39204 Pcs reported), ensuring long-term procurement continuity.

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