PCM69AP-KG4 Equivalent & Substitute Parts

Part Overview

The PCM69AP-KG4 is an 18-bit audio digital-to-analog converter (DAC) manufactured by Texas Instruments, designed for audio applications requiring PCM data interface support. This component operates with dual-channel output and is housed in a 16-DIP through-hole package. The product is classified as obsolete, making identification of functionally compatible alternatives essential for ongoing system support and new design implementations where legacy component replacement is required.

Substiute Parts

PCM69AP-KG4
Texas InstrumentsIn Stock: 967PCM69AP-KG4 Datasheet
PCM69AP-KG4
Current Part
PCM1793DB
Texas InstrumentsIn Stock: 2243PCM1793DB Datasheet
PCM1793DB
MFR Recommended

Key Parameters

Parameter PCM69AP-KG4
Manufacturer Texas Instruments
Product Status Obsolete
Type DAC, Audio
Number of Channels 2
Resolution (Bits) 18 b
Data Interface PCM
Voltage Supply 5V
Operating Temperature Range -25°C ~ 85°C
Mounting Type Through Hole
Package / Case 16-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitution of the PCM69AP-KG4 is determined by the following critical parameters:

  • Functional Category: Audio DAC with dual-channel output capability
  • Resolution Compatibility: Minimum 18-bit resolution required; higher resolution (24-bit) is acceptable as a forward-compatible upgrade
  • Data Interface: PCM interface is the primary specification; alternative serial interfaces (I2S) are compatible when system firmware supports protocol conversion
  • Supply Voltage: 5V primary supply; dual-voltage support (3V–3.6V and 5V) accommodates flexible power architecture
  • Operating Temperature: -25°C ~ 85°C range must be maintained
  • Regulatory Compliance: RoHS3 and REACH compliance required for modern procurement standards
  • Mounting Consideration: Through-hole to surface-mount transition requires PCB redesign; substitutes with surface-mount packages are acceptable for new designs

The PCM1793DB qualifies as a manufacturer-recommended substitute based on these parameters.

Parameter Comparison

Parameter PCM69AP-KG4 PCM1793DB Compatibility Notes
Manufacturer Texas Instruments Texas Instruments Same manufacturer ensures design continuity
Product Status Obsolete Active Active status ensures long-term availability
Type DAC, Audio DAC, Audio Identical functional category
Number of Channels 2 2 Matched channel configuration
Resolution (Bits) 18 b 24 b PCM1793DB provides higher resolution; backward compatible
Data Interface PCM I2S Different serial protocols; requires interface adapter or firmware modification
Voltage Supply 5V 3V ~ 3.6V, 5V PCM1793DB supports dual-voltage operation; 5V compatible
Operating Temperature Range -25°C ~ 85°C -25°C ~ 85°C Identical temperature specification
Mounting Type Through Hole Surface Mount Different mounting technology; PCB redesign required
Package / Case 16-DIP (0.300", 7.62mm) 28-SSOP (0.209", 5.30mm Width) Different package footprints; not pin-compatible
RoHS Status ROHS3 Compliant ROHS3 Compliant Both meet modern environmental standards
REACH Status REACH Unaffected REACH Unaffected Both comply with chemical substance regulations

Engineering Selection Recommendations

For Legacy System Maintenance: The PCM69AP-KG4 remains the direct replacement when through-hole mounting and PCM interface are mandatory constraints. Existing inventory of 904 units supports near-term requirements.

For New Design Implementation: The PCM1793DB is the recommended substitute, offering active product status with 2220 units in stock. This component provides:

  • Higher resolution (24-bit vs. 18-bit) for improved audio fidelity
  • Active manufacturing status ensuring long-term supply chain stability
  • Dual-voltage supply flexibility (3V–3.6V and 5V)
  • Surface-mount packaging enabling modern PCB design practices
  • Full RoHS3 and REACH compliance

Integration Considerations: Substitution requires evaluation of data interface compatibility. The transition from PCM to I2S protocol necessitates either hardware interface adaptation or firmware modification to support the alternative serial communication standard. The surface-mount package (28-SSOP) requires PCB layout redesign compared to the through-hole 16-DIP footprint.

Frequently Asked Questions (FAQ)

Q: Can the PCM1793DB directly replace the PCM69AP-KG4 without PCB modification?

A: No. The PCM1793DB uses a 28-SSOP surface-mount package versus the 16-DIP through-hole package of the PCM69AP-KG4. Pin-to-pin compatibility does not exist. PCB redesign is required for physical mounting. Additionally, the data interface differs (I2S vs. PCM), requiring interface adaptation or firmware changes.

Q: Is the higher resolution of the PCM1793DB (24-bit vs. 18-bit) a compatibility advantage?

A: Yes. Higher resolution is a forward-compatible upgrade. Systems designed for 18-bit audio will function with 24-bit DAC output. The additional resolution bits provide improved signal-to-noise ratio and dynamic range without compromising legacy system operation.

Q: What is the impact of the different data interfaces (PCM vs. I2S)?

A: PCM and I2S are distinct serial audio protocols. Direct substitution requires either a hardware interface converter or firmware modification to translate between protocols. System architecture must support this conversion before component selection.

Q: Are both components suitable for the same operating temperature range?

A: Yes. Both the PCM69AP-KG4 and PCM1793DB operate across -25°C to 85°C, ensuring thermal compatibility in equivalent environmental conditions.

Q: Does the PCM1793DB support 5V operation like the original component?

A: Yes. The PCM1793DB supports dual-voltage operation (3V–3.6V and 5V), making it compatible with 5V supply systems. This provides additional flexibility for power architecture design.

Q: Are regulatory certifications equivalent between the two components?

A: Yes. Both components are RoHS3 compliant and REACH unaffected, meeting current environmental and chemical substance regulations for procurement and deployment.

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