PCI2050IGHK Equivalent & Substitute Parts

Part Overview

The PCI2050IGHK is a PCI-to-PCI Bridge Interface IC manufactured by Texas Instruments, housed in a 209-BGA MICROSTAR (16x16) package. This specialized interface component facilitates communication between PCI bus segments in legacy and embedded systems. The product is currently classified as obsolete, making identification of functionally equivalent alternatives essential for system maintenance, repair, and redesign applications where continued supply cannot be guaranteed.

Substiute Parts

PCI2050IGHK

Texas InstrumentsIn Stock: 2947PCI2050IGHK Datasheet

Current PartRFQ

PI7C8150BNDIE

Diodes IncorporatedIn Stock: 1276PI7C8150BNDIE Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the PCI2050IGHK is determined by the following critical parameters:

• Application Compatibility: Both parts must support PCI-to-PCI Bridge functionality
• Voltage Supply Range: Substitute must operate within 3V ~ 3.6V supply voltage
• Mounting Type: Surface Mount requirement must be maintained
• Compliance Standards: RoHS3 compliance and REACH unaffected status must be preserved
• Moisture Sensitivity: MSL 3 (168 Hours) classification must be matched or exceeded
• Package Technology: BGA package format with compatible ball grid array configuration

The PI7C8150BNDIE qualifies as a substitute based on these parameters, despite differences in package density (256-BGA vs. 209-BGA) and supplier device package dimensions (17x17 vs. 16x16).

Parameter Comparison

Engineering Selection Recommendations

The PI7C8150BNDIE from Diodes Incorporated is the qualified substitute for the obsolete PCI2050IGHK. Selection of this alternative is supported by:

• Functional Equivalence: Both components perform PCI-to-PCI Bridge interface operations within identical voltage supply parameters (3V ~ 3.6V)
• Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring compatibility with current environmental and safety standards
• Product Availability: The PI7C8150BNDIE maintains active product status with documented inventory availability, addressing the supply discontinuation of the original part
• Packaging Compatibility: Both components utilize surface-mount BGA technology with matching moisture sensitivity classifications (MSL 3, 168 Hours)
• Trade Classification: Identical ECCN (EAR99) and HTSUS (8542.39.0001) codes confirm regulatory alignment

The primary design consideration is the package footprint difference: the PI7C8150BNDIE uses a 256-PBGA (17x17) configuration compared to the original 209-BGA MICROSTAR (16x16). PCB layout modifications may be required to accommodate the increased ball grid density and package dimensions.

Frequently Asked Questions (FAQ)

Q: Can the PI7C8150BNDIE be used as a direct drop-in replacement for the PCI2050IGHK?

A: Functional compatibility is confirmed for PCI-to-PCI Bridge applications within the specified 3V ~ 3.6V supply voltage range. However, the package footprint difference (256-PBGA 17x17 vs. 209-BGA MICROSTAR 16x16) requires PCB redesign. Direct socket substitution is not possible without layout modifications.

Q: What are the key parameters that determine substitution eligibility?

A: Substitution is based on: PCI-to-PCI Bridge application support, 3V ~ 3.6V voltage supply compatibility, surface-mount BGA package technology, ROHS3 compliance, REACH unaffected status, and MSL 3 (168 Hours) moisture sensitivity classification.

Q: Why is the PI7C8150BNDIE recommended despite the package density difference?

A: The substitute meets all critical electrical and compliance parameters. The increased ball grid density (256 vs. 209 balls) and larger package footprint (17x17 vs. 16x16) represent physical differences that do not affect functional equivalence for PCI bridge operations. PCB layout adaptation is the primary engineering consideration.

Q: Are there compliance or certification concerns with using the substitute part?

A: No. Both parts share identical regulatory classifications: ROHS3 compliance, REACH unaffected status, EAR99 ECCN, and 8542.39.0001 HTSUS code. Compliance requirements are fully maintained with the substitute.

Q: What is the moisture sensitivity implication for assembly and storage?

A: Both parts carry MSL 3 (168 Hours) classification, indicating identical moisture sensitivity requirements. Standard IPC-A-610 handling, storage, and reflow procedures apply to both components without differentiation.