PCF8583BS,518 Equivalent & Substitute Parts

Part Overview

The PCF8583BS,518 is a Real Time Clock (RTC) IC with Clock/Calendar functionality, manufactured by NXP USA Inc. This device integrates a 240-byte NVSRAM, alarm capability, and square wave output in a 20-VQFN Exposed Pad package. The part operates across a 2.5V to 6V supply range with I2C/2-Wire Serial interface.

The PCF8583BS,518 is classified as Obsolete. Equivalent and substitute parts are necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications requiring RTC Clock/Calendar functionality with I2C interface compatibility.

Key Parameters

Parameter	PCF8583BS,518
Type	Clock/Calendar
Interface	I2C, 2-Wire Serial
Memory Size	240B
Time Format	HH:MM:SS:hh (12/24 hr)
Date Format	YY-MM-DD
Features	Alarm, NVSRAM, Square Wave Output
Voltage - Supply	2.5V ~ 6V
Current - Timekeeping (Max)	10µA ~ 50µA @ 1V ~ 5V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
Package / Case	20-VQFN Exposed Pad
Product Status	Obsolete
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution logic for the PCF8583BS,518 is based on the following critical parameters:

Primary Compatibility Criteria:

Interface: I2C, 2-Wire Serial (mandatory match)
Type: Clock/Calendar with alarm and square wave output capability
Operating Temperature: -40°C ~ 85°C (standard industrial range)
RoHS Status: ROHS3 Compliant
Mounting Type: Surface Mount

Secondary Compatibility Criteria:

Memory Size: 240B (preferred) or 56B (acceptable for reduced NVSRAM requirement)
Voltage Supply Range: Overlap with 2.5V ~ 6V (minimum 2.7V acceptable)
Time/Date Format: HH:MM:SS and YY-MM-DD support
Features: Alarm, NVSRAM, Square Wave Output

Package Considerations: Substitute parts are available in multiple package options (8-TSSOP, 8-SOIC, 8-MSOP, 16-SOIC, 10-SMD Module) that differ from the original 20-VQFN. Package selection depends on PCB layout constraints and design requirements.

Substitute parts are grouped by manufacturer (Renesas Electronics, Analog Devices/Maxim Integrated, Abracon LLC) and by package type to facilitate design selection based on specific application requirements.

Parameter Comparison

Parameter	PCF8583BS,518	1337AGDVGI8	1337GDCGI8	1338-31DCGI8	1338-31DVGI8	1339-31DVGI	AB-RTCMC-32.768KHZ-EOZ9-S3-DBT	DS1338C-3#	DS1338C-33#	DS1338U-18+	DS1338U-3+
Type	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar	Clock/Calendar
Interface	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial	I2C, 2-Wire Serial
Memory Size	240B	—	—	56B	56B	—	8B	56B	56B	56B	56B
Time Format	HH:MM:SS:hh (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)	HH:MM:SS (12/24 hr)
Date Format	YY-MM-DD	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd	YY-MM-DD-dd
Features	Alarm, NVSRAM, Square Wave Output	Alarm, Leap Year, Square Wave Output	Alarm, Leap Year, Square Wave Output	Leap Year, NVSRAM, Square Wave Output	Leap Year, NVSRAM, Square Wave Output	Alarm, Leap Year, Square Wave Output, Trickle-Charger	Alarm, EEPROM, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Trickle-Charger	Leap Year, NVSRAM, Square Wave Output	Leap Year, NVSRAM, Square Wave Output	Leap Year, NVSRAM, Square Wave Output	Leap Year, NVSRAM, Square Wave Output
Voltage - Supply	2.5V ~ 6V	1.8V ~ 5.5V	1.8V ~ 5.5V	3.3V ~ 5.5V	3.3V ~ 5.5V	3.3V ~ 5.5V	1.4V ~ 5.5V	2.7V ~ 5.5V	3V ~ 5.5V	1.71V ~ 5.5V	2.7V ~ 5.5V
Current - Timekeeping (Max)	10µA ~ 50µA @ 1V ~ 5V	0.3µA @ 1.3V ~ 1.8V	0.6µA @ 1.3V ~ 1.8V	5µA @ 3.63V ~ 5.5V	5µA @ 3.63V ~ 5.5V	200µA @ 3.63V ~ 5.5V	1.5µA ~ 2.2µA @ 1.4V ~ 5V	200µA @ 3.3V	125µA ~ 200µA @ 3.63V ~ 5.5V	100µA @ 1.89V	200µA @ 3.3V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Package / Case	20-VQFN Exposed Pad	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	10-SMD Module	16-SOIC (0.295", 7.50mm Width)	16-SOIC (0.295", 7.50mm Width)	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	1 (Unlimited)	1 (Unlimited)	3 (168 Hours)	3 (168 Hours)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

All substitute parts listed are Active product status devices, ensuring long-term availability and manufacturing support. All parts maintain ROHS3 Compliance and REACH Unaffected status, meeting regulatory requirements equivalent to the original PCF8583BS,518.

Renesas Electronics 1337 Series (1337AGDVGI8, 1337GDCGI8): These parts offer the lowest timekeeping current consumption (0.3µA to 0.6µA) and extended voltage supply range (1.8V ~ 5.5V). Package options include 8-TSSOP and 8-SOIC. MSL rating of 1 (Unlimited) for the 1337GDCGI8 variant provides superior moisture handling compared to the original part.

Renesas Electronics 1338-31 Series (1338-31DCGI8, 1338-31DVGI8): These parts include 56-byte NVSRAM and support battery backup (1.3V ~ 3.7V). Available in 8-SOIC and 8-TSSOP packages. Timekeeping current is 5µA at 3.63V ~ 5.5V. The 1338-31DCGI8 variant features MSL rating of 1 (Unlimited).

Renesas Electronics 1339-31DVGI: This part adds Trickle-Charger functionality and includes Alarm capability. Available in 8-TSSOP package with MSL rating of 3 (168 Hours). Timekeeping current is 200µA at 3.63V ~ 5.5V.

Abracon AB-RTCMC-32.768KHZ-EOZ9-S3-DBT: This integrated RTC module includes TCXO/Crystal, EEPROM, and SRAM in a 10-SMD Module package. Offers the lowest timekeeping current (1.5µA ~ 2.2µA) and widest voltage supply range (1.4V ~ 5.5V). MSL rating of 1 (Unlimited) and includes integrated crystal oscillator.

Analog Devices/Maxim Integrated DS1338 Series (DS1338C-3#, DS1338C-33#, DS1338U-18+, DS1338U-3+): These parts provide 56-byte NVSRAM with battery backup support. Available in 16-SOIC and 8-TSSOP packages. DS1338U-3+ offers the highest inventory availability (42,400 pcs) and supports voltage range 2.7V ~ 5.5V with 200µA timekeeping current at 3.3V. All variants feature MSL rating of 1 (Unlimited).

Frequently Asked Questions (FAQ)

Q: Can the PCF8583BS,518 be directly replaced with any of these substitute parts?

A: Direct replacement depends on package compatibility and PCB layout. All substitute parts maintain I2C/2-Wire Serial interface compatibility and support the required Clock/Calendar functionality with alarm and square wave output. However, package differences (20-VQFN vs. 8-TSSOP, 8-SOIC, 16-SOIC, or 10-SMD Module) require PCB redesign. Electrical compatibility is confirmed across all listed substitutes within the specified operating temperature range (-40°C ~ 85°C).

Q: What is the primary difference between the Renesas 1337 and 1338-31 series?

A: The 1337 series does not include NVSRAM (memory size listed as —), while the 1338-31 series includes 56-byte NVSRAM with battery backup capability (1.3V ~ 3.7V). The original PCF8583BS,518 includes 240-byte NVSRAM. If application requires non-volatile memory retention, the 1338-31 series is preferred. If NVSRAM is not required, the 1337 series offers lower timekeeping current consumption (0.3µA to 0.6µA).

Q: How does the Abracon AB-RTCMC-32.768KHZ-EOZ9-S3-DBT differ from discrete IC solutions?

A: The Abracon part is an integrated RTC module that includes the crystal oscillator (TCXO), EEPROM, and SRAM in a single 10-SMD Module package. This eliminates the need for external crystal components and reduces PCB footprint. It offers the lowest timekeeping current (1.5µA ~ 2.2µA) and widest voltage supply range (1.4V ~ 5.5V). This solution is suitable for applications where component count reduction and power efficiency are critical.

Q: What is the significance of Moisture Sensitivity Level (MSL) rating?

A: MSL rating indicates the maximum time a component can be exposed to moisture before soldering. MSL 1 (Unlimited) parts have no time restriction and are preferred for applications with extended storage or handling periods. MSL 3 (168 Hours) parts must be soldered within 168 hours of package opening. The original PCF8583BS,518 has MSL 3. Several substitutes (1337GDCGI8, 1338-31DCGI8, AB-RTCMC-32.768KHZ-EOZ9-S3-DBT, and all DS1338 variants) offer MSL 1 (Unlimited), providing superior moisture handling.

Q: Which substitute part offers the best power efficiency for battery-backed applications?

A: The Abracon AB-RTCMC-32.768KHZ-EOZ9-S3-DBT offers the lowest timekeeping current at 1.5µA ~ 2.2µA across the 1.4V ~ 5V range. The Renesas 1337AGDVGI8 provides 0.3µA at 1.3V ~ 1.8V, which is lower but limited to a narrower voltage range. For battery-backed designs requiring extended runtime, the Abracon module is recommended due to its integrated crystal and lowest average current consumption across standard operating voltages.

Q: Are all substitute parts available in the same package as the original PCF8583BS,518?

A: No. The original PCF8583BS,518 uses a 20-VQFN Exposed Pad package. Substitute parts are available in smaller packages: 8-TSSOP, 8-SOIC, 8-MSOP, 16-SOIC, and 10-SMD Module. Package selection depends on PCB layout constraints and design requirements. Smaller packages (8-pin variants) reduce PCB footprint but require layout redesign. The 16-SOIC DS1338 variants provide a larger package option if needed.

Q: What compliance certifications are maintained across all substitute parts?

A: All substitute parts maintain ROHS3 Compliance and REACH Unaffected status, matching the regulatory compliance of the original PCF8583BS,518. All parts are classified as Active product status, ensuring continued manufacturing support and long-term availability. ECCN classification is EAR99 and HTSUS code is 8542.39.0001 for all parts.

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