PCF8575RGER Equivalent & Substitute Parts

Part Overview

The PCF8575RGER is a 16-bit I/O expander manufactured by Texas Instruments, designed for I2C and SMBus communication at 400 kHz. It operates across a 2.5V to 5.5V supply range and is housed in a 24-VQFN surface mount package with exposed pad. The device features push-pull output configuration with 1mA and 25mA source/sink capability, interrupt output, and power-on reset functionality. With active product status and ROHS3 compliance, substitute parts are identified for applications requiring alternative packaging formats, mounting technologies, or supply voltage ranges while maintaining core I/O expansion functionality.

Substiute Parts

PCF8575RGER

Texas InstrumentsIn Stock: 18554PCF8575RGER Datasheet

Current PartRFQ

MCP23016-I/SP

Microchip TechnologyIn Stock: 1000417MCP23016-I/SP Datasheet

MFR RecommendedRFQ

MCP23016T-I/ML

Microchip TechnologyIn Stock: 3798MCP23016T-I/ML Datasheet

MFR RecommendedRFQ

MCP23016T-I/SO

Microchip TechnologyIn Stock: 3494MCP23016T-I/SO Datasheet

MFR RecommendedRFQ

PCA9535BS,118

NXP SemiconductorsIn Stock: 5832PCA9535BS,118 Datasheet

MFR RecommendedRFQ

PCA9555BS,118

NXP USA Inc.In Stock: 2161PCA9555BS,118 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the PCF8575RGER are qualified based on the following electrical and mechanical parameters:

Core Functional Parameters (Required Match):

• 16 I/O channels
• I2C interface at 400 kHz
• Push-pull output configuration
• Interrupt output capability
• Power-on reset feature
• Operating temperature range -40°C to 85°C
• ROHS3 compliance

Allowable Variations:

• Supply voltage range: Substitutes may operate at 2V minimum (versus 2.5V minimum for main part)
• Package format: Surface mount (SOIC, QFN) or through-hole (DIP) acceptable
• Current output specifications: 25mA sink/source capability required; 10mA or 1mA variations permitted
• Moisture sensitivity level: Variations acceptable based on packaging and storage requirements

Excluded from Substitution:

• SMBus interface requirement (only I2C acceptable for MCP23016 variants)
• Pin count or footprint compatibility not required for functional substitution

Parameter Comparison

Engineering Selection Recommendations

All substitute parts maintain active product status and ROHS3 compliance, ensuring regulatory alignment with the PCF8575RGER. Selection among substitutes depends on packaging and mounting requirements:

For Surface Mount Applications with Compact Footprint: PCA9535BS,118 and PCA9555BS,118 maintain the 24-pin HVQFN package format identical to the main part, providing direct footprint compatibility. Both support I2C and SMBus protocols and operate within the specified temperature and frequency parameters.

For Surface Mount Applications with Larger Package Tolerance: MCP23016T-I/ML offers a 28-pin QFN package with expanded thermal characteristics. MCP23016T-I/SO provides a 28-pin SOIC package suitable for applications where QFN assembly is not available.

For Through-Hole Applications: MCP23016-I/SP is the only through-hole substitute, packaged in 28-pin DIP format. This option is appropriate for legacy designs or applications requiring manual assembly and rework capability.

Supply Voltage Consideration: MCP23016 variants and NXP PCA953x/PCA955x devices operate at minimum 2V supply, providing extended low-voltage operation compared to the PCF8575RGER minimum of 2.5V. This allows substitution in applications with lower supply rails.

SMBus Protocol Requirement: If SMBus protocol support is mandatory, only PCA9535BS,118 and PCA9555BS,118 qualify as substitutes. MCP23016 variants support I2C only.

Frequently Asked Questions (FAQ)

Q: Can MCP23016T-I/SO be used as a direct replacement for PCF8575RGER on the same PCB?

A: No. The MCP23016T-I/SO uses a 28-pin SOIC package versus the 24-pin VQFN of the PCF8575RGER. Pin count, spacing, and footprint differ significantly. PCB layout redesign is required.

Q: Are PCA9535BS,118 and PCA9555BS,118 electrically identical?

A: Both devices share identical electrical specifications, package format (24-HVQFN), and functional parameters. They differ only in manufacturer designation and base product number. Either is functionally equivalent for I2C and SMBus applications.

Q: What is the minimum supply voltage for each substitute?

A: PCF8575RGER operates at 2.5V minimum. MCP23016 variants (all packages) operate at 2V minimum. PCA9535BS,118 and PCA9555BS,118 operate at 2.3V minimum. Substitutes with lower minimum voltage are compatible with PCF8575RGER applications.

Q: Does the MCP23016-I/SP through-hole package affect I2C communication speed?

A: No. All substitutes maintain 400 kHz I2C clock frequency. Package format does not alter communication protocol or speed.

Q: Which substitute offers the best thermal performance?

A: MCP23016T-I/ML in 28-QFN (6x6) package provides the largest exposed pad area for thermal dissipation. However, all substitutes operate within the specified -40°C to 85°C temperature range under normal conditions.

Q: Can I substitute PCF8575RGER with MCP23016T-I/SO in an SMBus-only application?

A: No. MCP23016T-I/SO supports I2C protocol only. For SMBus requirement, use PCA9535BS,118 or PCA9555BS,118.

Q: What is the moisture sensitivity difference between substitutes?

A: PCF8575RGER has MSL 2 (1 Year). MCP23016-I/SP and PCA9535BS,118 and PCA9555BS,118 have MSL 1 (Unlimited), indicating superior moisture resistance. MCP23016T-I/ML has MSL 3 (168 Hours), indicating more stringent moisture control during storage and assembly.