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PCF8575DWR Equivalent & Substitute Parts
Part Overview
The PCF8575DWR is a 16-bit I/O expander manufactured by Texas Instruments, designed for I2C and SMBus communication at 400 kHz. This interface component operates across a 2.5V to 5.5V supply range and is housed in a 24-SOIC surface mount package. The device is currently in active production status with full RoHS3 compliance and unlimited moisture sensitivity rating.
Substitute parts are necessary when the original PCF8575DWR is unavailable, when alternative packaging formats are required for specific assembly processes, or when design requirements demand enhanced electrical performance characteristics such as higher output current capability or extended operating temperature ranges.
Substiute Parts
Key Parameters
| Parameter | PCF8575DWR |
|---|---|
| Number of I/O | 16 |
| Interface | I2C, SMBus |
| Clock Frequency | 400 kHz |
| Voltage Supply Range | 2.5V ~ 5.5V |
| Output Type | Push-Pull |
| Current Output Source/Sink | 1mA, 25mA |
| Operating Temperature | -40°C ~ 85°C |
| Package | 24-SOIC (0.295", 7.50mm Width) |
| Interrupt Output | Yes |
| Features | POR |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the PCF8575DWR is determined by the following critical parameters:
Core Functional Requirements:
- 16-bit I/O configuration
- I2C interface at 400 kHz clock frequency
- Push-pull output type
- Interrupt output capability
- Power-on reset (POR) feature
Electrical Compatibility:
- Supply voltage range must encompass or exceed 2.5V ~ 5.5V
- Output current capability must meet or exceed 25mA sink/source
- Operating temperature range must support -40°C ~ 85°C minimum
Physical Compatibility:
- Surface mount technology required for direct PCB replacement
- 24-pin SOIC package preferred for form-factor compatibility
- Alternative packages (28-SOIC, 28-SSOP, 28-QFN, 28-DIP) acceptable for redesign scenarios
Compliance Requirements:
- RoHS3 compliance mandatory
- Moisture sensitivity level 1 or 3 acceptable
Substitute parts meeting these criteria are grouped by manufacturer and package type to facilitate selection based on assembly requirements and supply chain availability.
Parameter Comparison
| Part Number | Manufacturer | I/O Count | Interface | Clock Frequency | Supply Voltage | Output Current (mA) | Operating Temp (°C) | Package | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|
| PCF8575DWR | Texas Instruments | 16 | I2C, SMBus | 400 kHz | 2.5V ~ 5.5V | 1, 25 | -40 ~ 85 | 24-SOIC | Surface Mount |
| MAX7311AWG+ | Analog Devices Inc./Maxim Integrated | 16 | I2C, SMBus | 400 kHz | 2V ~ 5.5V | 31, 43 | -40 ~ 125 | 24-SOIC | Surface Mount |
| MAX7311AWG+T | Analog Devices Inc./Maxim Integrated | 16 | I2C, SMBus | 400 kHz | 2V ~ 5.5V | 31, 43 | -40 ~ 125 | 24-SOIC | Surface Mount |
| MAX7318AWG+ | Analog Devices Inc./Maxim Integrated | 16 | I2C, SMBus | 400 kHz | 2V ~ 5.5V | 31, 43 | -40 ~ 125 | 24-SOIC | Surface Mount |
| MCP23016-I/SO | Microchip Technology | 16 | I2C | 400 kHz | 2V ~ 5.5V | 25 | -40 ~ 85 | 28-SOIC | Surface Mount |
| MCP23016-I/SP | Microchip Technology | 16 | I2C | 400 kHz | 2V ~ 5.5V | 25 | -40 ~ 85 | 28-DIP | Through Hole |
| MCP23016-I/SS | Microchip Technology | 16 | I2C | 400 kHz | 2V ~ 5.5V | 25 | -40 ~ 85 | 28-SSOP | Surface Mount |
| MCP23016T-I/ML | Microchip Technology | 16 | I2C | 400 kHz | 2V ~ 5.5V | 25 | -40 ~ 85 | 28-QFN | Surface Mount |
| MCP23016T-I/SO | Microchip Technology | 16 | I2C | 400 kHz | 2V ~ 5.5V | 25 | -40 ~ 85 | 28-SOIC | Surface Mount |
Engineering Selection Recommendations
Maxim Integrated MAX7311/MAX7318 Series (24-SOIC Direct Replacement)
The MAX7311AWG+ and MAX7318AWG+ devices provide direct 24-SOIC package compatibility with the PCF8575DWR. Both parts maintain identical I/O count, interface protocol, and clock frequency specifications. The MAX series offers enhanced output current capability (31mA/43mA versus 1mA/25mA) and extended operating temperature range (-40°C to 125°C versus -40°C to 85°C). Both variants are RoHS3 compliant with unlimited moisture sensitivity rating. The MAX7311AWG+T variant is available in Tape & Reel packaging for high-volume automated assembly processes.
Microchip MCP23016 Series (Alternative Package Options)
The MCP23016 family provides functional equivalence with alternative package formats. The MCP23016-I/SO and MCP23016T-I/SO maintain 28-SOIC surface mount configuration suitable for PCB redesign scenarios. The MCP23016-I/SP offers 28-DIP through-hole packaging for legacy or prototype applications. The MCP23016-I/SS provides 28-SSOP surface mount option for space-constrained designs. The MCP23016T-I/ML delivers 28-QFN packaging for compact board layouts. All MCP23016 variants support identical I2C 400 kHz operation, 2V to 5.5V supply range, and 25mA output current. Operating temperature range matches the original PCF8575DWR at -40°C to 85°C. All variants carry RoHS3 compliance and unlimited moisture sensitivity rating.
Packaging and Assembly Considerations
Direct PCB replacement without layout modification requires the MAX7311AWG+ or MAX7318AWG+ in 24-SOIC packaging. Microchip MCP23016 variants require PCB redesign due to 28-pin package configuration. Through-hole MCP23016-I/SP is suitable only for non-automated assembly or prototype applications. Surface mount variants (MCP23016-I/SO, MCP23016-I/SS, MCP23016T-I/ML, MCP23016T-I/SO) are compatible with standard SMT assembly equipment.
Frequently Asked Questions (FAQ)
Q: Can the MAX7311AWG+ replace the PCF8575DWR without PCB modification?
A: Yes. Both devices use identical 24-SOIC packaging with matching pin assignments for I2C interface, power, and ground connections. The MAX7311AWG+ provides enhanced electrical performance with higher output current and extended temperature range while maintaining functional compatibility.
Q: What is the primary difference between MAX7311AWG+ and MAX7311AWG+T?
A: Both parts are electrically identical. The MAX7311AWG+ is supplied in Tube packaging, while the MAX7311AWG+T is supplied in Tape & Reel format. Selection depends on assembly process requirements and volume quantities.
Q: Why do MCP23016 variants require different package designations?
A: The MCP23016 base part is available in multiple package options to accommodate different assembly technologies and board space constraints. The -I/SO variant uses 28-SOIC for surface mount, -I/SP uses 28-DIP for through-hole, -I/SS uses 28-SSOP for compact surface mount, and -I/ML uses 28-QFN for minimal footprint. All variants maintain identical electrical specifications.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All listed substitute parts carry RoHS3 compliance certification, matching the original PCF8575DWR specification.
Q: What is the moisture sensitivity difference between PCF8575DWR and MCP23016T-I/ML?
A: The PCF8575DWR and most MCP23016 variants have MSL 1 (Unlimited). The MCP23016T-I/ML has MSL 3 (168 Hours), requiring controlled storage and handling procedures during assembly. This does not affect functional performance but impacts supply chain logistics.
Q: Can I use MCP23016 parts as drop-in replacements?
A: MCP23016 parts are functionally equivalent but require PCB redesign due to 28-pin packaging versus the original 24-pin configuration. They are suitable for new designs or board revisions but not for direct PCB replacement without layout modification.
Q: What output current should I specify for my application?
A: The PCF8575DWR supports 1mA and 25mA output current. The MAX7311/MAX7318 series supports 31mA and 43mA. The MCP23016 series supports 25mA. Select based on your load requirements. Higher current capability in MAX series provides design margin for demanding applications.
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