PCF8575DGVR Equivalent & Substitute Parts

Part Overview

The PCF8575DGVR is a 16-bit I/O expander with I2C and SMBus interface operating at 400 kHz, manufactured by Texas Instruments in a 24-TVSOP surface mount package. This part is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The PCF8575DGVR provides push-pull output capability with 1mA to 25mA source/sink current, interrupt output, and power-on reset functionality across a 2.5V to 5.5V supply range.

Substiute Parts

PCF8575DGVR
Texas InstrumentsIn Stock: 3216PCF8575DGVR Datasheet
PCF8575DGVR
Current Part
PCF8575PWR
Texas InstrumentsIn Stock: 19433PCF8575PWR Datasheet
PCF8575PWR
MFR Recommended
MCP23016-I/ML
Microchip TechnologyIn Stock: 2045MCP23016-I/ML Datasheet
MCP23016-I/ML
MFR Recommended
MCP23016-I/SO
Microchip TechnologyIn Stock: 1503MCP23016-I/SO Datasheet
MCP23016-I/SO
MFR Recommended
MCP23016-I/SP
Microchip TechnologyIn Stock: 1000417MCP23016-I/SP Datasheet
MCP23016-I/SP
MFR Recommended
MCP23016-I/SS
Microchip TechnologyIn Stock: 1521MCP23016-I/SS Datasheet
MCP23016-I/SS
MFR Recommended
MCP23016T-I/ML
Microchip TechnologyIn Stock: 3798MCP23016T-I/ML Datasheet
MCP23016T-I/ML
MFR Recommended
MCP23016T-I/SS
Microchip TechnologyIn Stock: 856MCP23016T-I/SS Datasheet
MCP23016T-I/SS
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number PCF8575DGVR
Manufacturer Texas Instruments
Number of I/O 16
Interface I2C, SMBus
Clock Frequency 400 kHz
Voltage Supply Range 2.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Output Type Push-Pull
Current Output Source/Sink 1mA, 25mA
Interrupt Output Yes
Package Type 24-TVSOP
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution for the PCF8575DGVR is determined by the following critical parameters:

Functional Requirements:

  • 16-bit I/O expansion capability
  • I2C interface at 400 kHz clock frequency
  • Push-pull output configuration
  • Interrupt output support
  • Power-on reset feature

Electrical Requirements:

  • Supply voltage compatibility: 2.5V ~ 5.5V minimum overlap
  • Output current capability: minimum 25mA sink/source
  • Operating temperature range: -40°C ~ 85°C

Compliance Requirements:

  • ROHS3 compliance
  • Active product status preferred for new designs

The substitute parts are grouped into two categories: direct Texas Instruments alternatives (same manufacturer, different package) and Microchip Technology MCP23016 series alternatives (different manufacturer, equivalent functionality).

Parameter Comparison

Parameter PCF8575DGVR PCF8575PWR MCP23016-I/ML MCP23016-I/SO MCP23016-I/SP MCP23016-I/SS MCP23016T-I/ML MCP23016T-I/SS
Manufacturer Texas Instruments Texas Instruments Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Number of I/O 16 16 16 16 16 16 16 16
Interface I2C, SMBus I2C, SMBus I2C I2C I2C I2C I2C I2C
Clock Frequency 400 kHz 400 kHz 400 kHz 400 kHz 400 kHz 400 kHz 400 kHz 400 kHz
Voltage Supply Range 2.5V ~ 5.5V 2.5V ~ 5.5V 2V ~ 5.5V 2V ~ 5.5V 2V ~ 5.5V 2V ~ 5.5V 2V ~ 5.5V 2V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Output Type Push-Pull Push-Pull Push-Pull Push-Pull Push-Pull Push-Pull Push-Pull Push-Pull
Current Output Source/Sink 1mA, 25mA 1mA, 25mA 25mA 25mA 25mA 25mA 25mA 25mA
Interrupt Output Yes Yes Yes Yes Yes Yes Yes Yes
Package Type 24-TVSOP 24-TSSOP 28-QFN (6x6) 28-SOIC 28-SPDIP 28-SSOP 28-QFN (6x6) 28-SSOP
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Through Hole Surface Mount Surface Mount Surface Mount
Product Status Obsolete Active Active Active Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 3 (168 Hours) 1 (Unlimited)

Engineering Selection Recommendations

Texas Instruments PCF8575PWR is the primary substitute for the obsolete PCF8575DGVR. Both parts share identical electrical specifications, functional capabilities, and compliance certifications. The PCF8575PWR differs only in package format (24-TSSOP versus 24-TVSOP) and maintains active product status. This substitution requires PCB layout modification to accommodate the different package footprint but eliminates any functional redesign.

Microchip Technology MCP23016 Series provides functionally equivalent I/O expansion with the following considerations:

  • All MCP23016 variants maintain 16-bit I/O, 400 kHz I2C operation, and push-pull output configuration
  • Supply voltage range extends to 2V minimum (versus 2.5V for PCF8575), providing broader compatibility
  • Output current capability is specified at 25mA only, without the 1mA option of the PCF8575
  • Package options span surface mount (QFN, SOIC, SSOP) and through-hole (SPDIP) configurations
  • All MCP23016 variants carry active product status and ROHS3 compliance

Packaging Considerations:

  • MCP23016-I/SP (28-SPDIP) is the only through-hole option among substitutes
  • MCP23016-I/ML and MCP23016T-I/ML (28-QFN) offer the smallest footprint
  • MCP23016-I/SO (28-SOIC) and MCP23016-I/SS (28-SSOP) provide mid-range package sizes
  • Tape & Reel packaging (MCP23016T variants) is suitable for high-volume automated assembly

Compliance and Reliability:

All substitute parts maintain ROHS3 compliance and EAR99 export classification. Moisture sensitivity levels range from MSL 1 (unlimited) to MSL 3 (168 hours), with most variants rated MSL 1. The MCP23016T-I/ML variant carries MSL 3 rating, requiring controlled storage conditions.

Frequently Asked Questions (FAQ)

Q: Can PCF8575PWR directly replace PCF8575DGVR without circuit modification?

A: Electrical and functional compatibility is complete. PCB layout modification is required due to package format differences (24-TSSOP versus 24-TVSOP). Both packages are 24-pin surface mount with identical pin assignments and electrical characteristics.

Q: What are the key differences between PCF8575PWR and MCP23016 series substitutes?

A: PCF8575PWR maintains identical specifications to the original PCF8575DGVR, including SMBus support and dual output current ratings (1mA and 25mA). MCP23016 series parts support I2C only (no SMBus), specify 25mA output current exclusively, and offer expanded package options. Both families provide equivalent 16-bit I/O expansion at 400 kHz.

Q: Which MCP23016 variant should be selected for new designs?

A: Selection depends on assembly method and volume requirements. MCP23016-I/SS (28-SSOP) and MCP23016T-I/SS (Tape & Reel variant) are recommended for surface mount automated assembly. MCP23016-I/SP (28-SPDIP) is suitable for through-hole applications. MCP23016-I/ML and MCP23016T-I/ML (28-QFN) minimize board space when footprint is critical.

Q: Are there supply voltage compatibility issues when substituting with MCP23016?

A: MCP23016 series extends minimum supply voltage to 2V, compared to 2.5V for PCF8575. This provides broader compatibility with lower voltage systems. Maximum supply voltage remains 5.5V for both families. Designs operating between 2V and 2.5V require MCP23016 selection.

Q: What is the impact of MSL rating differences on component handling?

A: Most substitute parts carry MSL 1 (unlimited moisture sensitivity level), requiring standard storage conditions. MCP23016T-I/ML carries MSL 3 (168 hours), requiring controlled humidity storage and bake-out procedures before reflow soldering. Standard MSL 1 parts are preferred for inventory management unless specific packaging requirements mandate the Tape & Reel variant.

Q: Is SMBus support critical for substitution decisions?

A: SMBus compatibility is present only in PCF8575 variants (PCF8575DGVR and PCF8575PWR). MCP23016 series supports I2C protocol exclusively. If the application requires SMBus-specific features, PCF8575PWR is the only active substitute. For standard I2C applications, MCP23016 series provides equivalent functionality.

Q: How do package size differences affect PCB redesign effort?

A: PCF8575PWR requires minimal redesign (24-pin surface mount to 24-pin surface mount). MCP23016 series requires more substantial PCB layout changes due to 28-pin packages and different pin assignments. Through-hole MCP23016-I/SP (28-SPDIP) requires the most significant redesign for surface mount applications.

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