PC28F256P33BFE Equivalent & Substitute Parts

Part Overview

The PC28F256P33BFE is a 256Mbit parallel NOR Flash memory IC manufactured by Micron Technology Inc., designed for non-volatile storage applications requiring parallel interface connectivity. This device operates at 52 MHz with 95 ns access time and is packaged in a 64-EasyBGA (8x10) configuration. The product is currently obsolete, making identification of functionally equivalent alternatives essential for system redesign, legacy support, or component sourcing in applications where this memory architecture remains necessary.

Substiute Parts

PC28F256P33BFE

Micron Technology Inc.In Stock: 4576PC28F256P33BFE Datasheet

Current PartRFQ

MT28EW256ABA1LPC-0SIT

Micron Technology Inc.In Stock: 6906MT28EW256ABA1LPC-0SIT Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PC28F256P33BFE is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

• Memory capacity: 256Mbit
• Memory technology: FLASH - NOR
• Memory interface: Parallel
• Memory organization: 16M x 16 (or compatible 32M x 8 with parallel interface)
• Voltage supply range: Must encompass or be compatible with 2.3V ~ 3.6V
• Operating temperature range: -40°C ~ 85°C
• Mounting type: Surface Mount
• RoHS compliance: ROHS3 Compliant

Performance Parameters (Acceptable Variance):

• Access time: 95 ns or faster
• Clock frequency: 52 MHz or higher
• Write cycle time: 95 ns or faster

The MT28EW256ABA1LPC-0SIT qualifies as a direct substitute based on matching memory capacity, NOR Flash technology, parallel interface, compatible voltage range, identical operating temperature range, surface mount configuration, and equivalent RoHS compliance. Performance improvements (75 ns access time, 60 ns write cycle time) represent forward compatibility.

Parameter Comparison

Engineering Selection Recommendations

The MT28EW256ABA1LPC-0SIT is the qualified substitute for PC28F256P33BFE applications. Selection is based on the following engineering criteria:

Functional Equivalence: Both devices provide 256Mbit parallel NOR Flash memory with identical memory organization options (16M x 16), ensuring data storage capacity and interface compatibility.

Compliance Alignment: Both parts maintain ROHS3 compliance and identical MSL ratings (3, 168 Hours), satisfying regulatory and manufacturing process requirements.

Performance Enhancement: The MT28EW256ABA1LPC-0SIT delivers improved access time (75 ns vs. 95 ns) and write cycle time (60 ns vs. 95 ns), providing forward compatibility without performance degradation.

Active Product Status: The substitute is currently in active production, ensuring long-term availability and supply chain stability compared to the obsolete PC28F256P33BFE.

Voltage Supply Consideration: The substitute operates within 2.7V ~ 3.6V, which overlaps the original 2.3V ~ 3.6V range. Applications requiring operation below 2.7V require circuit-level voltage regulation verification.

Package Footprint Change: The substitute uses 64-LBGA (11x13) packaging versus the original 64-EasyBGA (8x10). PCB layout redesign is required; however, both are 64-pin BGA configurations with identical pin count and compatible signal assignments for parallel Flash memory interfaces.

Frequently Asked Questions (FAQ)

Q: Can MT28EW256ABA1LPC-0SIT directly replace PC28F256P33BFE without PCB modification?

A: Direct socket replacement is not possible due to different BGA package footprints (64-EasyBGA 8x10 vs. 64-LBGA 11x13). PCB layout redesign is required. However, the parallel interface pinout is compatible, and signal routing can be adapted during redesign.

Q: What is the impact of the voltage supply range difference (2.3V ~ 3.6V vs. 2.7V ~ 3.6V)?

A: The substitute does not support operation below 2.7V. If the original design operates at 2.3V or 2.4V, the MT28EW256ABA1LPC-0SIT cannot be used without circuit modification to raise the supply voltage to minimum 2.7V.

Q: Are the memory organizations compatible between these two parts?

A: Yes. The PC28F256P33BFE uses 16M x 16 organization. The MT28EW256ABA1LPC-0SIT supports both 32M x 8 and 16M x 16 organizations, allowing configuration to match the original design.

Q: What is the significance of the package change from 64-EasyBGA to 64-LBGA?

A: Both are 64-pin BGA packages with identical pin counts and compatible signal assignments for parallel Flash memory. The footprint dimensions differ (8x10 mm vs. 11x13 mm), requiring PCB redesign but not affecting electrical compatibility or signal integrity.

Q: Why is the substitute part in active production while the original is obsolete?

A: The MT28EW256ABA1LPC-0SIT represents a newer generation of the same memory architecture from Micron Technology Inc., offering improved performance characteristics and continued manufacturing support. The PC28F256P33BFE has been discontinued as part of normal product lifecycle management.

Q: Are there any temperature rating differences between the two parts?

A: Both parts operate across -40°C ~ 85°C. The original specifies TC (case temperature) while the substitute specifies TA (ambient temperature). Both ratings are equivalent for practical application purposes within this temperature range.

Q: What compliance certifications apply to both parts?

A: Both the PC28F256P33BFE and MT28EW256ABA1LPC-0SIT are ROHS3 compliant and REACH unaffected, with identical MSL ratings of 3 (168 Hours). No compliance barriers exist for substitution.