PAA.M0.4GL.AC65G Equivalent & Substitute Parts

Part Overview

The PAA.M0.4GL.AC65G is a 4-position circular connector plug with male pins and solder cup termination, manufactured by LEMO. This connector is designed for applications requiring reliable circular connection interfaces in automotive, industrial, medical, and testing equipment environments. The part is currently active in production with 787 units in stock. Substitute parts are identified to provide alternative sourcing options when the primary part is unavailable or when design requirements permit equivalent functionality.

Substiute Parts

PAA.M0.4GL.AC65G

LEMOIn Stock: 825PAA.M0.4GL.AC65G Datasheet

Current PartRFQ

S11MA7-P04MJG0-6570

ODUIn Stock: 947S11MA7-P04MJG0-6570 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The substitute part S11MA7-P04MJG0-6570 (ODU MEDI-SNAP®) is identified as an equivalent based on the following critical parameters that determine substitution compatibility:

• Connector Type & Configuration: Both parts are 4-position circular connector plugs with male pins and solder cup termination
• Fastening Mechanism: Both utilize push-pull fastening with detent lock capability
• Contact Finish: Both feature gold-plated mating surfaces
• Shell Material: Both use polysulfone (PSU) construction
• Insert Material: Both employ polyetheretherketone (PEEK) inserts
• Ingress Protection: Both provide IP50 dust protection rating
• Mounting Style: Both are free-hanging, in-line configurations
• Compliance: Both are ROHS3 compliant and REACH unaffected
• Cable Opening Dimensions: Both accommodate 0.209" ~ 0.256" (5.30mm ~ 6.50mm) cable sizes

Parameter Comparison

Engineering Selection Recommendations

Both the PAA.M0.4GL.AC65G and S11MA7-P04MJG0-6570 are active production parts with ROHS3 compliance and REACH unaffected status, making them suitable for regulated applications in industrial, medical, and automotive sectors.

The PAA.M0.4GL.AC65G supports an extended operating temperature range of -50°C to 150°C, making it the preferred choice for applications requiring sustained operation at elevated temperatures above 120°C.

The S11MA7-P04MJG0-6570 provides a higher current rating of 10A compared to the 8A rating of the LEMO part, offering additional margin for applications with higher current demands or future design flexibility.

Selection between these parts should be based on specific application requirements regarding operating temperature limits and current capacity, with both parts meeting the same compliance and protection standards.

Frequently Asked Questions (FAQ)

Q: Can the S11MA7-P04MJG0-6570 be used as a direct replacement for the PAA.M0.4GL.AC65G?

A: The S11MA7-P04MJG0-6570 is functionally compatible for applications operating within -50°C to 120°C and requiring 10A or less current. Both parts share identical connector configuration, termination type, shell material, insert material, and ingress protection rating. Verify application temperature requirements before substitution.

Q: What are the key differences between these two parts?

A: The primary differences are operating temperature range (LEMO: -50°C to 150°C; ODU: -50°C to 120°C) and current rating (LEMO: 8A; ODU: 10A). The ODU part specifies push-pull fastening without explicit detent lock notation, while the LEMO part includes both features.

Q: Are both parts suitable for medical applications?

A: Yes, both parts list medical applications in their specifications and maintain ROHS3 compliance and REACH unaffected status. However, specific medical device requirements and regulatory pathways should be verified independently.

Q: What is the significance of the cable opening dimensions?

A: Both parts accommodate identical cable opening ranges of 0.209" to 0.256" (5.30mm to 6.50mm), ensuring compatible backshell and cable assembly configurations.

Q: How do the solder cup terminations compare between these parts?

A: Both parts utilize solder cup termination, providing identical PCB assembly and wire attachment methods. No differences in soldering procedures or thermal profiles are indicated.