P50L-040P-C-TGF Equivalent & Substitute Parts

Part Overview

The P50L-040P-C-TGF is a 40-position rectangular connector plug manufactured by 3M, featuring center strip contacts with through-hole mounting and gold plating. This connector is part of the Pak 50 series and is currently classified as obsolete. Due to its discontinued status, identifying functionally equivalent active alternatives is essential for ongoing system maintenance, repair, and new design implementations where this connector type is required.

Substiute Parts

P50L-040P-C-TGF

3MIn Stock: 858P50L-040P-C-TGF Datasheet

Current PartRFQ

P50-040P-R1-EA

3MIn Stock: 882P50-040P-R1-EA Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the P50L-040P-C-TGF is determined by the following critical parameters:

• Connector Type: Plug with center strip contacts
• Number of Positions: 40
• Pitch: 0.050" (1.27mm)
• Number of Rows: 2
• Mounting Type: Through hole
• Contact Finish: Gold plating
• Features: Board lock and flange configuration

The substitute part P50-040P-R1-EA meets all these core electrical and mechanical requirements. Both parts share identical position count, pitch spacing, row configuration, mounting methodology, and contact material specifications. The primary distinction lies in product status (active vs. obsolete) and RoHS compliance classification.

Parameter Comparison

Engineering Selection Recommendations

The P50-040P-R1-EA is the manufacturer-recommended substitute for the obsolete P50L-040P-C-TGF. Both connectors maintain functional equivalence across all critical electrical and mechanical parameters: 40-position configuration, 0.050" pitch, 2-row layout, through-hole mounting, gold contact finish, and board lock/flange features.

The substitute part offers the advantage of active product status, ensuring continued availability and supply chain reliability. Additionally, P50-040P-R1-EA achieves RoHS compliance, meeting modern regulatory requirements for new designs and applications subject to environmental standards.

Physical differences exist in contact finish thickness and height above board. The substitute provides increased contact finish thickness (10.0µin versus 2.00µin), which may offer enhanced durability in high-cycle mating applications. The increased height above board (0.421" versus 0.315") must be evaluated against specific PCB layout constraints and mechanical clearance requirements in the target application.

Frequently Asked Questions (FAQ)

Q: Are P50L-040P-C-TGF and P50-040P-R1-EA mechanically interchangeable?

A: Both connectors share identical pitch (0.050"), position count (40), row configuration (2), mounting type (through hole), and feature set (board lock, flange). However, the height above board differs: 0.315" for P50L-040P-C-TGF versus 0.421" for P50-040P-R1-EA. Mechanical interchangeability depends on available vertical clearance in the target assembly.

Q: What is the significance of the contact finish thickness difference?

A: The substitute part P50-040P-R1-EA features 10.0µin gold plating compared to 2.00µin on the original part. Thicker plating generally provides improved wear resistance and corrosion protection, particularly in applications involving frequent mating cycles or harsh environmental exposure.

Q: Does the RoHS compliance difference affect substitution?

A: The P50-040P-R1-EA is RoHS compliant while the P50L-040P-C-TGF is not. For applications subject to RoHS regulations or customer requirements mandating compliance, the substitute part is the appropriate selection. For legacy systems without such constraints, both parts remain functionally equivalent.

Q: Why is the original part obsolete?

A: The P50L-040P-C-TGF belongs to the Pak 50 series (P50L base product), which has been superseded by the active P50 series. The P50-040P-R1-EA represents the current production equivalent within the updated product line.

Q: Can I use P50-040P-R1-EA as a direct replacement in existing designs?

A: Functional compatibility is confirmed across all critical electrical and mechanical parameters. However, the increased height above board (0.421" versus 0.315") must be verified against PCB layout and mechanical clearance specifications. If vertical space is constrained, physical validation is necessary before implementation.