ORT82G5-3FN680C Equivalent & Substitute Parts

Part Overview

The ORT82G5-3FN680C is an ORCA® 4 Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 372 I/O pins, 10,368 logic elements, and 113,664 total RAM bits in a 680-BBGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and production continuity.

Substiute Parts

ORT82G5-3FN680C
Lattice Semiconductor CorporationIn Stock: 1028ORT82G5-3FN680C Datasheet
ORT82G5-3FN680C
Current Part
LFE3-35EA-8FN672C
Lattice Semiconductor CorporationIn Stock: 1032LFE3-35EA-8FN672C Datasheet
LFE3-35EA-8FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number ORT82G5-3FN680C
Manufacturer Lattice Semiconductor Corporation
Series ORCA® 4
Product Status Obsolete
Number of Logic Elements/Cells 10,368
Total RAM Bits 113,664
Number of I/O 372
Number of Gates 643,000
Voltage - Supply 1.425V ~ 3.6V
Package / Case 680-BBGA
Supplier Device Package 680-FPBGA (35x35)
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the ORT82G5-3FN680C is determined by compatibility across the following critical parameters:

Functional Capacity Parameters:

  • Logic elements and gate count must meet or exceed the original specification
  • RAM bit capacity must support the original design requirements
  • I/O pin count must be sufficient for signal routing

Electrical Parameters:

  • Supply voltage range must be compatible with system power delivery
  • Operating temperature range must match or exceed the original specification

Physical Parameters:

  • Package type and ball grid array (BGA) footprint must be compatible with PCB layout
  • Mounting type must remain surface mount for manufacturing consistency

Compliance Parameters:

  • REACH and export control classifications (ECCN, HTSUS) must maintain regulatory compliance

The LFE3-35EA-8FN672C from the ECP3 series meets these substitution criteria as an active product with equivalent or superior functional capacity and compliance status.

Parameter Comparison

Parameter ORT82G5-3FN680C (Original) LFE3-35EA-8FN672C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series ORCA® 4 ECP3
Product Status Obsolete Active
Number of Logic Elements/Cells 10,368 33,000
Total RAM Bits 113,664 1,358,848
Number of I/O 372 310
Number of Gates 643,000 Not specified
Voltage - Supply 1.425V ~ 3.6V 1.14V ~ 1.26V
Package / Case 680-BBGA 672-BBGA
Supplier Device Package 680-FPBGA (35x35) 672-FPBGA (27x27)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE3-35EA-8FN672C is designated as the manufacturer-recommended substitute for the obsolete ORT82G5-3FN680C. Selection of this substitute is supported by the following factors:

Product Status: The substitute is an active product with ongoing manufacturer support, ensuring long-term availability and supply chain stability compared to the obsolete original.

Functional Capacity: The ECP3 device provides superior logic element count (33,000 vs. 10,368) and significantly higher RAM capacity (1,358,848 vs. 113,664 bits), enabling designs to maintain or expand functionality.

Compliance Alignment: Both devices share identical REACH status, ECCN classification, and HTSUS codes, maintaining regulatory compliance across supply chain and export requirements.

Thermal Performance: The substitute supports an extended operating temperature range (0°C ~ 85°C vs. 0°C ~ 70°C), providing improved thermal margin for demanding applications.

Packaging Considerations: While the substitute uses a 672-BBGA package (27x27) versus the original 680-BBGA (35x35), both are surface-mount BGA devices. PCB layout redesign is required to accommodate the different footprint and reduced I/O count (310 vs. 372 pins).

Frequently Asked Questions (FAQ)

Q: Can the LFE3-35EA-8FN672C directly replace the ORT82G5-3FN680C without design changes?

A: No. While functionally equivalent in core FPGA capability, the substitute requires PCB layout redesign due to different package dimensions (27x27 vs. 35x35) and reduced I/O pin count (310 vs. 372). Design validation is necessary to confirm signal routing compatibility.

Q: What is the impact of the reduced I/O pin count on system design?

A: The substitute provides 62 fewer I/O pins (310 vs. 372). System designs must evaluate whether all original signal connections can be accommodated within the reduced pin count. This may require signal multiplexing or architectural modifications.

Q: Are the supply voltage ranges compatible?

A: The supply voltage ranges differ significantly. The original operates at 1.425V ~ 3.6V, while the substitute operates at 1.14V ~ 1.26V. Power delivery systems must be redesigned to meet the substitute's narrower, lower voltage specification.

Q: What are the implications of the different operating temperature ranges?

A: The substitute supports a wider operating temperature range (0°C ~ 85°C vs. 0°C ~ 70°C). This provides additional thermal margin and may improve reliability in temperature-sensitive applications.

Q: Are both devices subject to the same regulatory requirements?

A: Yes. Both devices share identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS codes (8542.39.0001), ensuring consistent regulatory compliance.

Q: What is the moisture sensitivity level for both devices?

A: Both devices are classified as MSL 3 with a 168-hour floor life. Identical handling and storage protocols apply to both components.

Request Quote (Ships tomorrow)