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ORT82G5-3FN680C Equivalent & Substitute Parts
Part Overview
The ORT82G5-3FN680C is an ORCA® 4 Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 372 I/O pins, 10,368 logic elements, and 113,664 total RAM bits in a 680-BBGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and production continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | ORT82G5-3FN680C |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | ORCA® 4 |
| Product Status | Obsolete |
| Number of Logic Elements/Cells | 10,368 |
| Total RAM Bits | 113,664 |
| Number of I/O | 372 |
| Number of Gates | 643,000 |
| Voltage - Supply | 1.425V ~ 3.6V |
| Package / Case | 680-BBGA |
| Supplier Device Package | 680-FPBGA (35x35) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution of the ORT82G5-3FN680C is determined by compatibility across the following critical parameters:
Functional Capacity Parameters:
- Logic elements and gate count must meet or exceed the original specification
- RAM bit capacity must support the original design requirements
- I/O pin count must be sufficient for signal routing
Electrical Parameters:
- Supply voltage range must be compatible with system power delivery
- Operating temperature range must match or exceed the original specification
Physical Parameters:
- Package type and ball grid array (BGA) footprint must be compatible with PCB layout
- Mounting type must remain surface mount for manufacturing consistency
Compliance Parameters:
- REACH and export control classifications (ECCN, HTSUS) must maintain regulatory compliance
The LFE3-35EA-8FN672C from the ECP3 series meets these substitution criteria as an active product with equivalent or superior functional capacity and compliance status.
Parameter Comparison
| Parameter | ORT82G5-3FN680C (Original) | LFE3-35EA-8FN672C (Substitute) |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | ORCA® 4 | ECP3 |
| Product Status | Obsolete | Active |
| Number of Logic Elements/Cells | 10,368 | 33,000 |
| Total RAM Bits | 113,664 | 1,358,848 |
| Number of I/O | 372 | 310 |
| Number of Gates | 643,000 | Not specified |
| Voltage - Supply | 1.425V ~ 3.6V | 1.14V ~ 1.26V |
| Package / Case | 680-BBGA | 672-BBGA |
| Supplier Device Package | 680-FPBGA (35x35) | 672-FPBGA (27x27) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) | 0°C ~ 85°C (TJ) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | 3A991D | 3A991D |
| HTSUS | 8542.39.0001 | 8542.39.0001 |
Engineering Selection Recommendations
The LFE3-35EA-8FN672C is designated as the manufacturer-recommended substitute for the obsolete ORT82G5-3FN680C. Selection of this substitute is supported by the following factors:
Product Status: The substitute is an active product with ongoing manufacturer support, ensuring long-term availability and supply chain stability compared to the obsolete original.
Functional Capacity: The ECP3 device provides superior logic element count (33,000 vs. 10,368) and significantly higher RAM capacity (1,358,848 vs. 113,664 bits), enabling designs to maintain or expand functionality.
Compliance Alignment: Both devices share identical REACH status, ECCN classification, and HTSUS codes, maintaining regulatory compliance across supply chain and export requirements.
Thermal Performance: The substitute supports an extended operating temperature range (0°C ~ 85°C vs. 0°C ~ 70°C), providing improved thermal margin for demanding applications.
Packaging Considerations: While the substitute uses a 672-BBGA package (27x27) versus the original 680-BBGA (35x35), both are surface-mount BGA devices. PCB layout redesign is required to accommodate the different footprint and reduced I/O count (310 vs. 372 pins).
Frequently Asked Questions (FAQ)
Q: Can the LFE3-35EA-8FN672C directly replace the ORT82G5-3FN680C without design changes?
A: No. While functionally equivalent in core FPGA capability, the substitute requires PCB layout redesign due to different package dimensions (27x27 vs. 35x35) and reduced I/O pin count (310 vs. 372). Design validation is necessary to confirm signal routing compatibility.
Q: What is the impact of the reduced I/O pin count on system design?
A: The substitute provides 62 fewer I/O pins (310 vs. 372). System designs must evaluate whether all original signal connections can be accommodated within the reduced pin count. This may require signal multiplexing or architectural modifications.
Q: Are the supply voltage ranges compatible?
A: The supply voltage ranges differ significantly. The original operates at 1.425V ~ 3.6V, while the substitute operates at 1.14V ~ 1.26V. Power delivery systems must be redesigned to meet the substitute's narrower, lower voltage specification.
Q: What are the implications of the different operating temperature ranges?
A: The substitute supports a wider operating temperature range (0°C ~ 85°C vs. 0°C ~ 70°C). This provides additional thermal margin and may improve reliability in temperature-sensitive applications.
Q: Are both devices subject to the same regulatory requirements?
A: Yes. Both devices share identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS codes (8542.39.0001), ensuring consistent regulatory compliance.
Q: What is the moisture sensitivity level for both devices?
A: Both devices are classified as MSL 3 with a 168-hour floor life. Identical handling and storage protocols apply to both components.
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