ORSO82G5-1FN680C Equivalent & Substitute Parts

Part Overview

The ORSO82G5-1FN680C is an ORCA® 4 Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 372 I/O pins, 10,368 logic elements, and 113,664 total RAM bits in a 680-BBGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and production continuity.

Substiute Parts

ORSO82G5-1FN680C

Lattice Semiconductor CorporationIn Stock: 918ORSO82G5-1FN680C Datasheet

Current PartRFQ

LFE3-35EA-8FN672C

Lattice Semiconductor CorporationIn Stock: 1032LFE3-35EA-8FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFE3-35EA-8FN672C is identified as a manufacturer-recommended substitute for the ORSO82G5-1FN680C. Substitution eligibility is determined by the following parameters:

Substitution Criteria:

• Manufacturer: Both parts manufactured by Lattice Semiconductor Corporation
• Mounting Type: Both are surface mount devices
• Moisture Sensitivity Level: Both rated MSL 3 (168 Hours)
• REACH Status: Both REACH Unaffected
• ECCN Classification: Both classified as 3A991D
• HTSUS Code: Both classified as 8542.39.0001

Functional Capacity Considerations:

• Logic Elements: Substitute provides 33,000 elements (vs. 10,368 in main part)
• RAM Bits: Substitute provides 1,358,848 bits (vs. 113,664 in main part)
• I/O Count: Substitute provides 310 I/O (vs. 372 in main part)
• Package: Substitute uses 672-BBGA (27x27) vs. 680-BBGA (35x35)

Parameter Comparison

Engineering Selection Recommendations

The LFE3-35EA-8FN672C is an active product from Lattice Semiconductor Corporation and meets all regulatory and compliance requirements equivalent to the obsolete ORSO82G5-1FN680C. Both devices share identical REACH status, ECCN classification, and HTSUS coding, ensuring regulatory continuity.

The substitute device offers enhanced functional capacity with 33,000 logic elements and 1,358,848 RAM bits compared to the original part's 10,368 logic elements and 113,664 RAM bits. The operating temperature range extends to 85°C (TJ) versus 70°C (TA) on the original device.

Design considerations include I/O pin count reduction from 372 to 310 and package footprint change from 680-BBGA (35x35) to 672-BBGA (27x27). These physical and electrical differences require PCB layout and design file updates.

Frequently Asked Questions (FAQ)

Q: Can the LFE3-35EA-8FN672C directly replace the ORSO82G5-1FN680C without design modifications?

A: No. While both devices are Lattice Semiconductor FPGAs with equivalent regulatory status, the substitute has different I/O pin counts (310 vs. 372), different package dimensions (27x27 vs. 35x35), and different package ball counts (672 vs. 680). PCB layout and design files require updates.

Q: What are the key compliance similarities between these parts?

A: Both devices are REACH Unaffected, classified under ECCN 3A991D, and assigned HTSUS code 8542.39.0001. Both have MSL 3 rating (168 Hours). These regulatory attributes are identical.

Q: How do the functional capacities compare?

A: The LFE3-35EA-8FN672C provides significantly greater logic resources (33,000 elements vs. 10,368) and memory capacity (1,358,848 bits vs. 113,664 bits). However, it provides fewer I/O pins (310 vs. 372).

Q: Are there temperature rating differences?

A: Yes. The original ORSO82G5-1FN680C operates from 0°C to 70°C (TA), while the LFE3-35EA-8FN672C operates from 0°C to 85°C (TJ). The substitute supports a wider operating temperature range.

Q: What packaging considerations apply to this substitution?

A: The original uses a 680-BBGA package in a 35x35mm footprint. The substitute uses a 672-BBGA package in a 27x27mm footprint. The smaller footprint and reduced ball count require complete PCB redesign and re-layout.