OPB970T51 Equivalent & Substitute Parts

Part Overview

The OPB970T51 is an optical sensor manufactured by TT Electronics/Optek Technology, part of the Photologic® series. This through-beam optical sensor features a 0.125" (3.18mm) PCB mount configuration and is designed for applications requiring precise object detection and positioning. The part is Active in product status with full RoHS3 compliance and REACH unaffected designation. Substitute parts are identified when equivalent electrical and mechanical parameters are maintained across the Photologic® sensor family, ensuring functional interchangeability in circuit designs.

Key Parameters

Parameter	Value
Manufacturer Part Number	OPB970T51
Manufacturer	TT Electronics/Optek Technology
Category	Optical Sensors
Series	Photologic®
Sensing Distance	0.125" (3.18mm)
Sensing Method	Through-Beam
Output Configuration	Totem Pole, Buffer
Mounting Type	Through Hole
Current - Supply	15 mA
Voltage - Supply	4.75V ~ 5.25V
Response Time	70ns
Operating Temperature	-40°C ~ 70°C
Package / Case	PCB Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected

Substitute Part Grouping Explanation

Substitute parts for the OPB970T51 are qualified based on strict electrical and mechanical parameter equivalence within the Photologic® optical sensor family. The following parameters determine substitution eligibility:

Sensing Distance: 0.125" (3.18mm)
Sensing Method: Through-Beam
Output Configuration: Totem Pole, Buffer
Mounting Type: Through Hole
Current - Supply: 15 mA
Voltage - Supply: 4.75V ~ 5.25V
Response Time: 70ns
Operating Temperature: -40°C ~ 70°C
Package / Case: PCB Mount
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
REACH Status: REACH Unaffected

All substitute parts listed maintain these exact specifications, ensuring direct functional replacement in circuit applications. Variations in part numbering reflect different manufacturing configurations or packaging batches within the same electrical and mechanical specification set.

Parameter Comparison

Part Number	Manufacturer	Series	Sensing Distance	Sensing Method	Output Configuration	Current - Supply	Voltage - Supply	Response Time	Operating Temperature	RoHS Status	Inventory (Pcs)
OPB970T51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1003
OPB930L51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1285
OPB960L51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1073
OPB960N51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	8810
OPB960N55	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1745
OPB960T11	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1065
OPB960T51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	20199
OPB960T55	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1239
OPB970N11	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	3534
OPB970N51	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	3099
OPB970N55	TT Electronics/Optek Technology	Photologic®	0.125" (3.18mm)	Through-Beam	Totem Pole, Buffer	15 mA	4.75V ~ 5.25V	70ns	-40°C ~ 70°C	ROHS3 Compliant	1330

Engineering Selection Recommendations

All listed substitute parts maintain Active product status and full RoHS3 compliance with REACH unaffected designation. Selection among equivalent parts should be based on inventory availability and supply chain requirements. The OPB960T51 variant offers the highest inventory level at 20,199 pieces, providing supply continuity for high-volume applications. All parts within this substitution group are functionally equivalent for through-beam optical sensing applications operating within the specified 4.75V to 5.25V supply voltage range and -40°C to 70°C temperature envelope.

Frequently Asked Questions (FAQ)

Q: Can OPB960 series parts directly replace OPB970T51 in existing designs?

A: Yes. OPB960 and OPB970 series parts within this substitution group share identical electrical specifications including sensing distance, output configuration, supply current, voltage range, response time, and operating temperature. PCB mount through-hole configuration is consistent across all variants.

Q: What determines the suffix designation (T51, N51, L51, T11, N55, T55) in part numbers?

A: Suffix designations reflect manufacturing configuration or packaging batch variations within the Photologic® sensor family. All suffixes listed maintain equivalent electrical and mechanical parameters for direct substitution purposes.

Q: Are there any compliance or certification differences between substitute parts?

A: No. All substitute parts listed carry identical RoHS3 compliance status, REACH unaffected designation, and MSL 1 (Unlimited) moisture sensitivity rating. Regulatory and environmental compliance is uniform across the substitution group.

Q: What is the impact of selecting a substitute part on circuit performance?

A: Circuit performance remains unchanged. All substitute parts deliver 70ns response time, 15 mA supply current, and totem pole buffer output configuration. Functional behavior in through-beam optical sensing applications is identical.

Q: Should PCB layout be modified when substituting parts?

A: No PCB layout modification is required. All parts use identical through-hole PCB mount packaging and mechanical footprint. Direct component substitution on existing PCBs is supported.

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