OPB881L55Z Equivalent & Substitute Parts

Part Overview

The OPB881L55Z is an optical sensor through-beam phototransistor module manufactured by TT Electronics/Optek Technology. This unamplified optical sensor operates with a 0.125" (3.18mm) sensing distance and is configured for chassis mount installation with pre-wired connectivity. The component is classified as Active product status with ROHS3 compliance and unlimited moisture sensitivity level (MSL 1). Equivalent and substitute parts are identified based on matching electrical specifications, mechanical compatibility, and operational parameters to ensure direct functional interchangeability in circuit applications.

Key Parameters

Parameter	Value
Manufacturer Part Number	OPB881L55Z
Manufacturer	TT Electronics/Optek Technology
Category	Optical Sensors
Sensing Distance	0.125" (3.18mm)
Sensing Method	Through-Beam
Output Configuration	Phototransistor
Current - DC Forward (If) (Max)	50 mA
Current - Collector (Ic) (Max)	30 mA
Voltage - Collector Emitter Breakdown (Max)	30 V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Chassis Mount
Package / Case	Module, Pre-Wired
Type	Unamplified
RoHS Status	ROHS3 Compliant
Product Status	Active

Substitute Part Grouping Explanation

Substitute parts for the OPB881L55Z are identified through parametric equivalence based on the following critical specifications:

Substitution Criteria:

Sensing distance: 0.125" (3.18mm)
Sensing method: Through-Beam
Output configuration: Phototransistor
Current - DC Forward (If) (Max): 50 mA
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Mounting type: Chassis Mount
Package / Case: Module, Pre-Wired
Type: Unamplified

All identified substitute parts match these core electrical and mechanical parameters. Operating temperature ranges vary between -40°C ~ 80°C and -40°C ~ 85°C; parts rated to -40°C ~ 80°C operate within a narrower thermal envelope than the primary part.

Parameter Comparison

Manufacturer Part Number	Sensing Distance	Sensing Method	Output Configuration	If (Max)	Ic (Max)	VCE Breakdown (Max)	Operating Temperature	Mounting Type	Package / Case	Type	RoHS Status
OPB881L55Z	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB360N51	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB365N51	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB370N51	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB370N55	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB380P55Z	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB390P11Z	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB829AZ	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 80°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB829CZ	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 80°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB829DZ	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 80°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant
OPB830W11Z	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 80°C	Chassis Mount	Module, Pre-Wired	Unamplified	ROHS3 Compliant

Engineering Selection Recommendations

All substitute parts listed maintain Active product status and ROHS3 compliance, ensuring regulatory alignment with the OPB881L55Z. Parts designated with operating temperature range -40°C ~ 85°C (OPB360N51, OPB365N51, OPB370N51, OPB370N55, OPB380P55Z, OPB390P11Z) provide full thermal equivalence to the primary part. Parts with -40°C ~ 80°C operating range (OPB829AZ, OPB829CZ, OPB829DZ, OPB830W11Z) are suitable for applications where maximum operating temperature does not exceed 80°C. All parts share identical electrical specifications for forward current, collector current, and collector-emitter breakdown voltage, confirming direct functional interchangeability in through-beam optical sensing applications.

Frequently Asked Questions (FAQ)

Q: What determines if a part can substitute for the OPB881L55Z? A: Substitute parts must match the sensing distance (0.125"), sensing method (through-beam), output configuration (phototransistor), current ratings (If 50 mA max, Ic 30 mA max), voltage rating (30 V VCE breakdown), mounting type (chassis mount), and package format (module, pre-wired). All listed parts meet these criteria.

Q: Are there thermal differences between substitute options? A: Yes. The OPB881L55Z and six substitute parts (OPB360N51, OPB365N51, OPB370N51, OPB370N55, OPB380P55Z, OPB390P11Z) operate across -40°C to 85°C. Four substitute parts (OPB829AZ, OPB829CZ, OPB829DZ, OPB830W11Z) operate across -40°C to 80°C. Select the narrower range only if application maximum temperature does not exceed 80°C.

Q: Do all substitute parts carry the same compliance certifications? A: All substitute parts are ROHS3 compliant with MSL 1 (unlimited moisture sensitivity level) and REACH unaffected status, matching the OPB881L55Z compliance profile.

Q: Can substitute parts be used interchangeably in existing designs? A: Yes, all substitute parts share identical electrical specifications and pre-wired module packaging, enabling direct substitution in circuit designs without modification to electrical connections or component footprint.

Q: What is the inventory status of substitute parts? A: Inventory levels vary by part number. OPB370N55 has the highest availability at 90,400 units. Specific inventory quantities are available for each substitute part listed in the parameter comparison table.

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