OPB706C Equivalent & Substitute Parts

Part Overview

The OPB706C is a reflective optical sensor manufactured by onsemi, configured as a 4-DIP module with phototransistor output. This component is classified as obsolete, which necessitates identification of equivalent and substitute parts for ongoing design support and procurement continuity. The OPB706C operates through reflective sensing methodology, making it suitable for applications requiring object detection and position sensing in through-hole mounting configurations.

Substiute Parts

OPB706C

onsemiIn Stock: 956OPB706C Datasheet

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OPB706A

TT Electronics/Optek TechnologyIn Stock: 2263OPB706A Datasheet

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OPB706C

onsemiIn Stock: 956OPB706C Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the OPB706C is determined by the following critical parameters:

• Sensing method: Reflective
• Output type: Phototransistor
• Package configuration: 4-DIP Module
• Mounting type: Through Hole
• Operating temperature range: -40°C ~ 85°C
• Voltage and current ratings compatibility

The OPB706A, manufactured by TT Electronics/Optek Technology, qualifies as a substitute part. Both components share the same base product number (OPB706), identical sensing methodology, matching package format, and compatible operating temperature specifications. The OPB706A maintains electrical parameter compatibility within the design envelope of the OPB706C while offering active product status and improved regulatory compliance.

Parameter Comparison

Engineering Selection Recommendations

The OPB706C is classified as obsolete, making the OPB706A the primary substitute for new designs and ongoing procurement. The OPB706A maintains functional equivalence through identical package geometry, sensing methodology, and operating temperature range. The OPB706A offers superior regulatory compliance, meeting ROHS3 requirements compared to the non-compliant status of the OPB706C. Both components share REACH Unaffected classification and unlimited moisture sensitivity level rating.

The OPB706A demonstrates active product status, ensuring long-term availability and manufacturing support. The electrical parameter differences—specifically the reduced maximum collector-emitter breakdown voltage (24 V versus 30 V) and increased maximum collector current (25 mA versus 200 µA)—remain within acceptable design margins for typical reflective optical sensor applications operating within standard logic-level signal processing environments.

Frequently Asked Questions (FAQ)

Q: Can the OPB706A directly replace the OPB706C in existing designs?

A: The OPB706A is functionally equivalent for reflective optical sensing applications. Both components utilize identical 4-DIP module packaging, through-hole mounting, and phototransistor output configuration. Electrical parameter differences are minor and typically accommodate standard circuit implementations. Circuit validation is necessary to confirm compatibility with specific voltage and current requirements.

Q: What is the significance of the product status difference?

A: The OPB706C is obsolete, indicating discontinued manufacturing and limited availability. The OPB706A maintains active product status, ensuring reliable procurement and manufacturing continuity for new production runs and design revisions.

Q: How do the voltage ratings differ between these parts?

A: The OPB706C specifies a maximum collector-emitter breakdown voltage of 30 V, while the OPB706A is rated at 24 V. This difference reflects different semiconductor process specifications but does not impact applications operating within standard logic-level voltage ranges (typically 5 V or 3.3 V).

Q: Are there RoHS compliance implications for substitution?

A: The OPB706C is RoHS non-compliant, while the OPB706A meets ROHS3 requirements. For applications subject to RoHS directives or customer compliance mandates, the OPB706A provides regulatory alignment. Both components maintain REACH Unaffected status.

Q: What packaging considerations apply to this substitution?

A: Both the OPB706C and OPB706A utilize identical 4-DIP module packaging with through-hole mounting configuration. PCB layout and footprint compatibility are maintained, allowing direct mechanical substitution without redesign.