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OPB370P55 Equivalent & Substitute Parts
Part Overview
The OPB370P55 is an optical sensor through-beam phototransistor module manufactured by TT Electronics/Optek Technology. This component features a 0.125" (3.18mm) sensing distance with pre-wired chassis mount packaging and unamplified phototransistor output configuration. The part is currently obsolete, making equivalent and substitute parts necessary for ongoing system support and new designs requiring compatible optical sensing functionality.
Substiute Parts
Key Parameters
| Parameter | OPB370P55 |
|---|---|
| Manufacturer | TT Electronics/Optek Technology |
| Category | Optical Sensors |
| Sensing Distance | 0.125" (3.18mm) |
| Sensing Method | Through-Beam |
| Output Configuration | Phototransistor |
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Collector (Ic) (Max) | 30 mA |
| Voltage - Collector Emitter Breakdown (Max) | 30 V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Chassis Mount |
| Package / Case | Module, Pre-Wired |
| Type | Unamplified |
| RoHS Status | ROHS3 Compliant |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution for the OPB370P55 is determined by strict equivalence across the following critical parameters:
- Sensing distance: 0.125" (3.18mm)
- Sensing method: Through-Beam
- Output configuration: Phototransistor
- Current ratings: If (Max) 50 mA, Ic (Max) 30 mA
- Voltage rating: Collector Emitter Breakdown 30 V
- Operating temperature range: -40°C ~ 85°C
- Type: Unamplified
- Regulatory compliance: ROHS3 Compliant, REACH Unaffected
Substitute parts are grouped into two categories: the manufacturer-recommended direct substitute (OPB370T55) and parametric equivalents that maintain identical electrical and functional specifications while differing in mounting configuration or product status.
Parameter Comparison
| Part Number | Manufacturer | Product Status | Sensing Distance | Sensing Method | Output Configuration | If (Max) | Ic (Max) | Vce Breakdown (Max) | Operating Temperature | Mounting Type | Package / Case | Type | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| OPB370P55 | TT Electronics/Optek Technology | Obsolete | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB370T55 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Through Hole | PCB Mount | Unamplified | ROHS3 Compliant |
| OPB360N51 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB365N11 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB365N51 | TT Electronics / Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB365P55 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB370N51 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB370N55 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB375N51 | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB380N11Z | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
| OPB380P51Z | TT Electronics/Optek Technology | Active | 0.125" (3.18mm) | Through-Beam | Phototransistor | 50 mA | 30 mA | 30 V | -40°C ~ 85°C | Chassis Mount | Module, Pre-Wired | Unamplified | ROHS3 Compliant |
Engineering Selection Recommendations
For applications currently using the obsolete OPB370P55, the following selection criteria apply:
OPB370T55 is the manufacturer-recommended direct substitute. This part maintains identical electrical specifications and sensing characteristics but differs in mounting configuration (PCB mount through-hole versus chassis mount pre-wired). Selection of OPB370T55 requires PCB-level integration rather than direct module replacement.
OPB370N51 and OPB370N55 are parametric equivalents within the OPB370 base product family. Both maintain chassis mount pre-wired packaging identical to the original OPB370P55 and are currently in active production status with full ROHS3 compliance and REACH unaffected certification.
OPB360N51, OPB365N11, OPB365N51, OPB365P55, OPB375N51, OPB380N11Z, and OPB380P51Z are parametric equivalents from alternative base product families. All maintain identical electrical ratings, sensing distance, through-beam sensing method, phototransistor output configuration, and chassis mount pre-wired packaging. All are in active production status with full regulatory compliance.
Selection between parametric equivalents should be based on availability, lead time, and inventory status. All listed substitutes are electrically and functionally interchangeable with the OPB370P55 within the specified parameters.
Frequently Asked Questions (FAQ)
Q: Can OPB370T55 be used as a direct replacement for OPB370P55?
A: OPB370T55 is the manufacturer-recommended substitute with identical electrical specifications. However, it differs in mounting type (PCB mount through-hole versus chassis mount pre-wired). Direct physical replacement requires PCB-level integration modifications.
Q: What is the difference between the parametric equivalents listed?
A: All parametric equivalents maintain identical electrical ratings, sensing distance (0.125"), sensing method (through-beam), output configuration (phototransistor), operating temperature range (-40°C ~ 85°C), and packaging (module, pre-wired). Differences exist only in base product family designation (OPB360, OPB365, OPB370, OPB375, OPB380) and specific suffix codes. All are functionally interchangeable.
Q: Are all substitute parts ROHS3 compliant?
A: Yes. All listed substitute parts are ROHS3 compliant and REACH unaffected, matching the regulatory status of the OPB370P55.
Q: What is the current availability status of OPB370P55?
A: OPB370P55 is obsolete. All recommended substitutes are in active production status.
Q: Can parametric equivalents from different base product families be used interchangeably?
A: Yes. All parametric equivalents maintain identical electrical specifications, sensing characteristics, and packaging configuration. Selection between different base product families should be based on availability and lead time.
Q: What are the critical parameters that determine substitutability?
A: Substitutability is determined by: sensing distance (0.125"), sensing method (through-beam), output configuration (phototransistor), maximum forward current (50 mA), maximum collector current (30 mA), collector-emitter breakdown voltage (30 V), operating temperature range (-40°C ~ 85°C), and unamplified type classification. All listed substitutes maintain these parameters.
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