OPB360P11 Equivalent & Substitute Parts

Part Overview

The OPB360P11 is an optical sensor through-beam phototransistor module manufactured by TT Electronics/Optek Technology. This component features a 0.125" (3.18mm) sensing distance with pre-wired chassis mount packaging and unamplified phototransistor output configuration. The part is currently obsolete, making equivalent and substitute parts necessary for ongoing system support and new designs requiring compatible optical sensing functionality.

Key Parameters

Parameter	Value
Manufacturer Part Number	OPB360P11
Manufacturer	TT Electronics/Optek Technology
Category	Optical Sensors
Sensing Distance	0.125" (3.18mm)
Sensing Method	Through-Beam
Output Configuration	Phototransistor
Current - DC Forward (If) (Max)	50 mA
Current - Collector (Ic) (Max)	30 mA
Voltage - Collector Emitter Breakdown (Max)	30 V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Chassis Mount
Package / Case	Module, Pre-Wired
Type	Unamplified
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
Product Status	Obsolete

Substitute Part Grouping Explanation

Substitution for the OPB360P11 is determined by strict equivalence across the following critical parameters:

Sensing Distance: 0.125" (3.18mm)
Sensing Method: Through-Beam
Output Configuration: Phototransistor
Current - DC Forward (If) (Max): 50 mA
Current - Collector (Ic) (Max): 30 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Operating Temperature: -40°C ~ 85°C
Type: Unamplified
RoHS Status: ROHS3 Compliant
REACH Status: REACH Unaffected

Substitute parts are grouped into two categories:

Manufacturer Recommended Equivalent (MFR Recommended): OPB360L11 offers parametric equivalence with transition from chassis mount pre-wired module to through-hole PCB mount configuration. This represents the primary upgrade path for the obsolete OPB360P11.

Parametric Equivalents (Active Status): OPB360N51, OPB365N11, OPB365N51, OPB365P55, OPB370N51, OPB370N55, OPB375N51, OPB380N11Z, and OPB380P51Z maintain identical electrical and mechanical specifications while offering active product status and alternative packaging or connector options within the chassis mount pre-wired module category.

Parameter Comparison

Part Number	Manufacturer	Sensing Distance	Sensing Method	Output Configuration	If (Max)	Ic (Max)	Vce Breakdown (Max)	Operating Temperature	Mounting Type	Package / Case	Type	Product Status	RoHS Status
OPB360P11	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Obsolete	ROHS3 Compliant
OPB360L11	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Through Hole	PCB Mount	Unamplified	Active	ROHS3 Compliant
OPB360N51	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB365N11	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB365N51	TT Electronics / Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB365P55	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB370N51	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB370N55	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB375N51	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB380N11Z	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant
OPB380P51Z	TT Electronics/Optek Technology	0.125" (3.18mm)	Through-Beam	Phototransistor	50 mA	30 mA	30 V	-40°C ~ 85°C	Chassis Mount	Module, Pre-Wired	Unamplified	Active	ROHS3 Compliant

Engineering Selection Recommendations

For applications currently using the obsolete OPB360P11, the following selection criteria apply:

Primary Recommendation: OPB360N51 provides direct parametric equivalence with active product status. This part maintains identical electrical specifications, sensing distance, and chassis mount pre-wired module configuration while offering current manufacturing availability.

PCB Integration Alternative: OPB360L11 is the manufacturer-recommended equivalent for designs transitioning to PCB-mounted implementations. This part maintains all electrical parameters but requires mechanical redesign to accommodate through-hole PCB mount versus chassis mount configuration.

Extended Alternatives: OPB365N11, OPB365N51, OPB365P55, OPB370N51, OPB370N55, OPB375N51, OPB380N11Z, and OPB380P51Z are parametric equivalents within the active product portfolio. Selection among these alternatives depends on connector type, packaging variant, and inventory availability requirements specific to the application.

All substitute parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment with the original OPB360P11 specification.

Frequently Asked Questions (FAQ)

Q: Can OPB360L11 be used as a direct drop-in replacement for OPB360P11?

A: OPB360L11 maintains identical electrical and sensing parameters but differs in mounting configuration. The original OPB360P11 uses chassis mount pre-wired module packaging, while OPB360L11 uses through-hole PCB mount. Direct mechanical substitution requires design modification to accommodate the different mounting interface.

Q: What is the difference between OPB360N51 and OPB360P11?

A: OPB360N51 is parametrically equivalent to OPB360P11 across all electrical specifications, sensing distance, and package type. The primary difference is product status: OPB360P11 is obsolete while OPB360N51 is active. Both use chassis mount pre-wired module configuration.

Q: Are all listed substitute parts electrically interchangeable?

A: All substitute parts listed maintain identical electrical specifications: 50 mA maximum DC forward current, 30 mA maximum collector current, 30 V maximum collector-emitter breakdown voltage, and -40°C to 85°C operating temperature range. Mechanical compatibility depends on mounting type and connector configuration.

Q: Which substitute part has the highest inventory availability?

A: OPB370N55 has the highest inventory level at 90,400 pieces in stock. This part maintains full parametric equivalence with OPB360P11 and active product status.

Q: Do all substitute parts meet the same compliance requirements as OPB360P11?

A: All substitute parts are ROHS3 compliant and REACH unaffected, matching the compliance profile of the original OPB360P11.

Q: What is the difference between chassis mount and PCB mount configurations?

A: Chassis mount pre-wired modules (OPB360P11, OPB360N51, and related variants) are designed for panel or enclosure mounting with pre-attached wiring. PCB mount through-hole components (OPB360L11) are designed for direct soldering to printed circuit boards. Selection depends on system integration requirements.

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