OPA627APG4 Equivalent & Substitute Parts

Part Overview

The OPA627APG4 is a general-purpose operational amplifier manufactured by Texas Instruments, featuring Difet® technology in an 8-PDIP through-hole package. This device is classified as obsolete, necessitating identification of equivalent and substitute components for new designs or production continuity. The OPA627APG4 operates across a supply voltage range of 9V to 36V with a slew rate of 55V/µs and gain bandwidth product of 16 MHz, making it suitable for precision analog applications requiring low input bias current and low input offset voltage.

Substiute Parts

OPA627APG4

Texas InstrumentsIn Stock: 1297OPA627APG4 Datasheet

Current PartRFQ

OPA828IDR

Texas InstrumentsIn Stock: 16747OPA828IDR Datasheet

MFR RecommendedRFQ

OPA627AP

Texas InstrumentsIn Stock: 2000OPA627AP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the OPA627APG4 is determined by the following critical parameters:

Electrical Compatibility Criteria:

• Supply voltage range must encompass or match the original specification (9V to 36V minimum)
• Input bias current and input offset voltage must be equal to or lower than the original values
• Slew rate and gain bandwidth product establish performance boundaries
• Output current capability must meet or exceed the original specification

Mechanical Compatibility Criteria:

• Package type determines physical fit and PCB layout compatibility
• Mounting type (through-hole versus surface mount) affects assembly process and board design

Compliance Criteria:

• RoHS3 compliance status
• Product status (active versus obsolete) affects long-term availability

The OPA627AP provides direct substitution with identical electrical and mechanical specifications. The OPA828IDR offers enhanced electrical performance with higher slew rate and gain bandwidth product but requires package conversion from 8-DIP to 8-SOIC and mounting type change from through-hole to surface mount.

Parameter Comparison

Engineering Selection Recommendations

OPA627AP Selection: The OPA627AP is a direct equivalent to the OPA627APG4, offering identical electrical performance and mechanical compatibility. Both devices share the same Difet® series designation, 8-DIP through-hole package, and operating specifications. The OPA627AP is suitable for applications requiring pin-for-pin replacement without circuit modification. Both parts carry obsolete product status; however, OPA627AP maintains unlimited moisture sensitivity rating (MSL 1), matching the original specification. RoHS3 compliance is maintained across both variants.

OPA828IDR Selection: The OPA828IDR is an active-status substitute offering enhanced electrical performance with 150V/µs slew rate (2.7× improvement), 45 MHz gain bandwidth product (2.8× improvement), and lower input offset voltage (50µV versus 130µV). The OPA828IDR features J-FET amplifier architecture with extended operating temperature range (-40°C to 125°C). Selection of OPA828IDR requires circuit board redesign due to package conversion from 8-DIP to 8-SOIC and mounting type change from through-hole to surface mount. The OPA828IDR carries active product status, ensuring long-term availability. MSL rating increases to 2 (1 Year), requiring controlled storage conditions. Minimum supply voltage decreases to 8V, expanding lower-voltage application capability.

Frequently Asked Questions (FAQ)

Q: Can OPA627AP be used as a direct replacement for OPA627APG4 without circuit modification?

A: Yes. The OPA627AP provides pin-for-pin compatibility with identical electrical specifications, supply voltage range, operating temperature range, and 8-DIP through-hole package configuration. No circuit modification is required.

Q: What are the key differences between OPA627APG4 and OPA828IDR?

A: The OPA828IDR offers superior electrical performance with 2.7× higher slew rate (150V/µs versus 55V/µs) and 2.8× higher gain bandwidth product (45 MHz versus 16 MHz). The OPA828IDR uses J-FET amplifier architecture versus general-purpose design. Critical differences include package type (8-SOIC versus 8-DIP), mounting method (surface mount versus through-hole), and product status (active versus obsolete). The OPA828IDR requires PCB redesign and cannot be used as a direct pin-for-pin replacement.

Q: Is the OPA828IDR suitable for applications originally designed for OPA627APG4?

A: The OPA828IDR is electrically compatible for applications within its specified operating parameters. The lower input offset voltage (50µV versus 130µV) and higher slew rate provide performance improvements. However, the package and mounting type change necessitates circuit board redesign. Applications requiring through-hole mounting or existing 8-DIP footprints cannot accommodate OPA828IDR without layout modification.

Q: What is the impact of MSL rating differences between OPA627APG4 and OPA828IDR?

A: OPA627APG4 carries MSL 1 (Unlimited), allowing indefinite storage without moisture control. OPA828IDR carries MSL 2 (1 Year), requiring controlled storage conditions and bake-out procedures before reflow soldering if storage exceeds one year. This affects supply chain management and component handling protocols.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. OPA627APG4, OPA627AP, and OPA828IDR all carry ROHS3 Compliant status, meeting environmental and regulatory requirements for lead-free manufacturing and restricted substance compliance.

Q: What is the minimum supply voltage requirement for each part?

A: OPA627APG4 and OPA627AP require minimum 9V supply voltage. OPA828IDR operates at minimum 8V supply voltage, enabling use in lower-voltage applications. All parts support maximum 36V supply voltage.

Q: How does the operating temperature range affect part selection?

A: OPA627APG4 and OPA627AP operate across -25°C to 85°C. OPA828IDR extends this range to -40°C to 125°C, providing wider temperature coverage for industrial and extended-temperature applications. Selection depends on application temperature requirements.