OPA627AP Equivalent & Substitute Parts

Part Overview

The OPA627AP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device belongs to the Difet® series and is classified as obsolete, though 1,967 units remain in current inventory as new original stock. The OPA627AP operates across a supply voltage range of 9V to 36V with an operating temperature range of -25°C to 85°C, making it suitable for precision analog signal conditioning applications requiring low input bias current and low input offset voltage characteristics.

Due to its obsolete product status, identifying equivalent and substitute operational amplifiers is essential for design continuity, long-term component availability, and system reliability in new designs or production transitions.

Substiute Parts

OPA627AP

Texas InstrumentsIn Stock: 2000OPA627AP Datasheet

Current PartRFQ

OPA828IDR

Texas InstrumentsIn Stock: 16747OPA828IDR Datasheet

MFR RecommendedRFQ

AD744JNZ

Analog Devices Inc.In Stock: 2257AD744JNZ Datasheet

MFR RecommendedRFQ

AD744KNZ

Analog Devices Inc.In Stock: 1614AD744KNZ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the OPA627AP is determined by compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Supply voltage range overlap (minimum 9V to 36V compatibility required)
• Input bias current performance (lower or equal values preferred for precision applications)
• Input offset voltage specifications (lower or equal values preferred)
• Slew rate and gain bandwidth product (equal or superior performance acceptable)
• Output current capability (equal or superior performance acceptable)

Mechanical & Packaging Compatibility:

• Package type: 8-DIP through-hole packages are directly compatible; 8-SOIC surface-mount packages require PCB redesign
• Pin configuration: Standard 8-pin operational amplifier pinout

Compliance & Regulatory Compatibility:

• RoHS3 compliance required
• REACH unaffected status required
• ECCN EAR99 classification maintained

Two substitute categories are identified:

Category 1: Direct Through-Hole Package Substitutes (Pin-Compatible)

• AD744JNZ (Analog Devices Inc., 8-PDIP)
• AD744KNZ (Analog Devices Inc., 8-PDIP)

These parts maintain identical through-hole 8-DIP packaging, enabling direct PCB replacement without layout modification.

Category 2: Enhanced Performance Surface-Mount Substitute (Requires PCB Redesign)

• OPA828IDR (Texas Instruments, 8-SOIC)

This part offers superior electrical performance but requires PCB redesign due to surface-mount packaging.

Parameter Comparison

Engineering Selection Recommendations

For Direct PCB Replacement (No Layout Modification Required):

The AD744JNZ and AD744KNZ are pin-compatible through-hole 8-DIP substitutes manufactured by Analog Devices Inc. Both parts maintain active product status, ensuring long-term availability and supply chain stability. Both are ROHS3 compliant with MSL 1 (unlimited moisture sensitivity), matching the OPA627AP's environmental specifications.

The AD744KNZ offers a marginal advantage over the AD744JNZ due to lower input offset voltage (250 µV versus 300 µV), providing improved precision in applications sensitive to DC offset. However, both parts exhibit higher input bias current (30 pA versus 2 pA) and lower slew rate (75 V/µs versus 55 V/µs) compared to the OPA627AP. The operating temperature range of both AD744 variants is narrower (0°C to 70°C versus -25°C to 85°C), which may limit applicability in extended temperature environments.

For Enhanced Performance with PCB Redesign:

The OPA828IDR, manufactured by Texas Instruments, provides superior electrical performance across multiple parameters: higher slew rate (150 V/µs), higher gain bandwidth product (45 MHz), lower input bias current (1 pA), and lower input offset voltage (50 µV). The OPA828IDR also supports an extended operating temperature range (-40°C to 125°C). However, this part requires PCB redesign due to 8-SOIC surface-mount packaging. The OPA828IDR maintains ROHS3 compliance and active product status. MSL 2 (1 Year) requires standard moisture control during storage and handling.

Compliance & Regulatory Alignment:

All substitute parts maintain ROHS3 compliance, REACH unaffected status, and EAR99 ECCN classification, ensuring regulatory continuity with the OPA627AP.

Frequently Asked Questions (FAQ)

Q1: Can the AD744JNZ or AD744KNZ be soldered directly into a PCB designed for the OPA627AP?

A: Yes. Both AD744 variants use the standard 8-DIP through-hole package with identical pin configuration and spacing (0.300", 7.62mm). Direct soldering replacement is mechanically and electrically feasible without PCB modification.

Q2: What is the primary difference between AD744JNZ and AD744KNZ?

A: The AD744KNZ specifies lower input offset voltage (250 µV) compared to the AD744JNZ (300 µV). Both parts share identical slew rate, gain bandwidth product, supply current, and output current specifications. Selection between these variants depends on application precision requirements for DC offset performance.

Q3: Why does the OPA828IDR require PCB redesign if it offers superior performance?

A: The OPA828IDR uses 8-SOIC surface-mount packaging (0.154", 3.90mm width) versus the 8-DIP through-hole package (0.300", 7.62mm) of the OPA627AP. Surface-mount and through-hole packages require different PCB footprints, solder pad layouts, and assembly processes. PCB redesign is mandatory for mechanical and electrical integration.

Q4: Are the AD744 variants suitable for applications requiring extended temperature operation?

A: The AD744JNZ and AD744KNZ operate across 0°C to 70°C, which is narrower than the OPA627AP range (-25°C to 85°C). Applications requiring operation below 0°C or above 70°C cannot use these substitutes. The OPA828IDR supports -40°C to 125°C, accommodating extended temperature requirements.

Q5: What is the impact of higher input bias current in the AD744 variants?

A: The AD744 variants specify 30 pA input bias current versus 2 pA for the OPA627AP. In high-impedance input circuits, higher input bias current increases input offset voltage drift and noise. Applications with input impedances exceeding 1 MΩ may experience degraded performance. Low-impedance circuits (below 100 kΩ) are generally unaffected.

Q6: Does the OPA828IDR's higher slew rate affect circuit behavior?

A: The OPA828IDR slew rate of 150 V/µs exceeds the OPA627AP specification of 55 V/µs. Higher slew rate reduces settling time and improves transient response in high-frequency applications. This is a performance enhancement with no negative impact on circuits designed for the OPA627AP, provided closed-loop stability is maintained through appropriate compensation networks.

Q7: What moisture handling precautions apply to each substitute?

A: The AD744JNZ, AD744KNZ, and OPA627AP all specify MSL 1 (unlimited), requiring no special moisture control. The OPA828IDR specifies MSL 2 (1 Year), requiring storage in dry conditions and baking before reflow soldering if exposed to ambient humidity for extended periods.

Q8: Are all substitute parts available in the same packaging options as the OPA627AP?

A: No. The OPA627AP is available only in 8-DIP through-hole. The AD744JNZ and AD744KNZ are available in 8-DIP through-hole (matching the OPA627AP). The OPA828IDR is available only in 8-SOIC surface-mount. No substitute offers identical packaging across all variants.

Q9: Which substitute provides the best long-term supply chain security?

A: All three substitutes maintain active product status, indicating ongoing manufacturing and distribution. Texas Instruments (OPA828IDR) and Analog Devices Inc. (AD744 variants) are established semiconductor manufacturers with established supply chains. Active product status provides superior long-term availability compared to the obsolete OPA627AP.

Q10: Can the OPA828IDR be used in a through-hole socket designed for 8-DIP packages?

A: No. The OPA828IDR uses 8-SOIC surface-mount packaging with different pin spacing and configuration. It cannot be inserted into through-hole sockets or DIP sockets. PCB redesign with surface-mount footprints is required.