OPA602AP Equivalent & Substitute Parts Reference

Part Overview

The OPA602AP is a general-purpose operational amplifier manufactured by Texas Instruments in the Difet® series. This device is packaged in an 8-PDIP (0.300", 7.62mm) through-hole configuration and is classified as obsolete. The OPA602AP delivers a gain-bandwidth product of 6.5 MHz with a slew rate of 35V/µs, suitable for general-purpose amplification applications requiring low input bias current (2 pA) and moderate supply current (3mA).

Due to its obsolete product status, locating OPA602AP units for new designs or production restocking presents supply chain challenges. Equivalent and substitute parts are necessary to maintain design continuity, ensure component availability, and support ongoing manufacturing requirements.

Substiute Parts

OPA602AP

Texas InstrumentsIn Stock: 1444OPA602AP Datasheet

Current PartRFQ

OPA145IDR

Texas InstrumentsIn Stock: 5640OPA145IDR Datasheet

MFR RecommendedRFQ

AD744JNZ

Analog Devices Inc.In Stock: 2257AD744JNZ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the OPA602AP is determined by the following critical parameters:

Functional Compatibility Criteria:

• Single-circuit operational amplifier architecture
• Input bias current specification (2 pA maximum)
• Supply voltage range compatibility (minimum 10V to maximum 36V)
• Output current capability (20 mA per channel minimum)
• Operating temperature range overlap or extension

Packaging and Mounting Considerations:

• Through-hole mounting technology (8-PDIP package format)
• Physical footprint compatibility (0.300", 7.62mm width)

Performance Parameters:

• Slew rate (35V/µs baseline)
• Gain-bandwidth product (6.5 MHz baseline)
• Input offset voltage (1 mV baseline)

The identified substitute parts meet the functional and electrical requirements for direct replacement in applications where the OPA602AP was originally specified. Substitutes are grouped by amplifier type (J-FET technology) and package compatibility.

Parameter Comparison

Engineering Selection Recommendations

OPA145IDR (Texas Instruments): This substitute is an active product with ROHS3 compliance. The OPA145IDR operates across an extended temperature range (-55°C to 150°C) and features rail-to-rail output capability. However, the OPA145IDR is packaged in 8-SOIC surface-mount format, requiring PCB redesign for through-hole applications. The supply current is significantly reduced (0.445mA versus 3mA), and the slew rate is lower (20V/µs versus 35V/µs). This substitute is suitable for new designs where surface-mount technology is acceptable and lower power consumption is beneficial.

AD744JNZ (Analog Devices Inc.): This substitute maintains through-hole 8-PDIP packaging identical to the OPA602AP, eliminating the need for PCB redesign. The AD744JNZ is an active product with ROHS3 compliance. Performance characteristics include higher slew rate (75V/µs) and higher gain-bandwidth product (13 MHz), providing enhanced dynamic performance. The operating temperature range (0°C to 70°C) is narrower than the OPA602AP. Input bias current is higher (30 pA versus 2 pA), and input offset voltage is higher (300 µV versus 1 mV). This substitute is optimal for direct replacement in existing through-hole designs where enhanced slew rate and bandwidth are acceptable trade-offs.

Both substitutes are ROHS3 compliant and REACH unaffected, meeting regulatory requirements equivalent to the original OPA602AP.

Frequently Asked Questions (FAQ)

Q: Can the OPA145IDR directly replace the OPA602AP on existing PCBs?

A: No. The OPA145IDR uses 8-SOIC surface-mount packaging, while the OPA602AP uses 8-DIP through-hole packaging. PCB redesign is required. A surface-mount to through-hole adapter may be used as a temporary solution, but this is not recommended for production applications.

Q: Can the AD744JNZ directly replace the OPA602AP on existing PCBs?

A: Yes. The AD744JNZ uses identical 8-DIP (0.300", 7.62mm) through-hole packaging. Pin-for-pin replacement is possible without PCB modification. Electrical parameter differences must be evaluated for the specific application.

Q: What are the key electrical differences between OPA602AP and AD744JNZ?

A: The AD744JNZ has higher slew rate (75V/µs versus 35V/µs) and higher gain-bandwidth product (13 MHz versus 6.5 MHz), providing faster transient response. However, input bias current is higher (30 pA versus 2 pA) and input offset voltage is higher (300 µV versus 1 mV). Operating temperature range is narrower (0°C to 70°C versus -25°C to 85°C).

Q: What are the key electrical differences between OPA602AP and OPA145IDR?

A: The OPA145IDR has lower supply current (0.445mA versus 3mA), lower input offset voltage (40 µV versus 1 mV), and extended operating temperature range (-55°C to 150°C versus -25°C to 85°C). The OPA145IDR features rail-to-rail output. Slew rate is lower (20V/µs versus 35V/µs) and gain-bandwidth product is lower (5.5 MHz versus 6.5 MHz).

Q: Are all three parts ROHS3 compliant?

A: Yes. The OPA602AP, OPA145IDR, and AD744JNZ are all ROHS3 compliant and REACH unaffected.

Q: Which substitute is recommended for low-power applications?

A: The OPA145IDR is recommended for low-power applications due to its significantly reduced supply current (0.445mA versus 3mA for the OPA602AP). Surface-mount packaging must be accommodated in the design.

Q: Which substitute is recommended for high-speed applications?

A: The AD744JNZ is recommended for applications requiring higher slew rate (75V/µs) and higher gain-bandwidth product (13 MHz). Through-hole packaging compatibility eliminates redesign requirements.

Q: What is the inventory status of these substitutes?

A: OPA145IDR has 5549 units in stock. AD744JNZ has 2178 units in stock. Both are active products with ongoing availability.