OPA561PWP Equivalent & Substitute Parts

Part Overview

The OPA561PWP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in a 20-PowerTSSOP surface-mount package. This device is classified as an active linear amplifier component designed for general-purpose signal conditioning and amplification applications. The part maintains Active product status with full RoHS3 compliance and REACH unaffected designation.

Substitute parts become necessary when the original OPA561PWP is unavailable due to inventory constraints, supply chain disruptions, or when alternative packaging formats better suit specific manufacturing requirements. Equivalent devices must maintain functional compatibility across critical electrical parameters including gain-bandwidth product, slew rate, input bias current, and supply voltage specifications.

Substiute Parts

OPA561PWP

Texas InstrumentsIn Stock: 69676OPA561PWP Datasheet

Current PartRFQ

OPA564AIDWP

Texas InstrumentsIn Stock: 2286OPA564AIDWP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the OPA561PWP is determined by functional equivalence across the following critical parameters:

Mandatory Compatibility Criteria:

• Amplifier Type: General Purpose classification
• Number of Circuits: Single circuit configuration
• Gain Bandwidth Product: 17 MHz (core performance specification)
• Current - Input Bias: 10 pA (input stage characteristic)
• Voltage - Supply Span: Minimum 7 V and maximum voltage capability sufficient for application requirements
• Mounting Type: Surface Mount
• Product Status: Active
• Regulatory Compliance: RoHS3 Compliant and REACH Unaffected

Parameters Permitting Variation:

• Slew Rate: May differ within acceptable application margins
• Voltage - Input Offset: Acceptable variance within millivolt range
• Current - Supply: Variation acceptable based on circuit design
• Current - Output / Channel: Higher output current capability acceptable
• Operating Temperature Range: Extended or reduced ranges acceptable depending on application environment
• Package / Case: Alternative surface-mount packages acceptable with PCB layout accommodation
• Supplier Device Package: Different package designations acceptable if electrical footprint compatible

The OPA564AIDWP qualifies as a manufacturer-recommended substitute based on alignment with mandatory compatibility criteria and active product status.

Parameter Comparison

Engineering Selection Recommendations

OPA564AIDWP Substitution Suitability:

The OPA564AIDWP is a manufacturer-recommended equivalent for the OPA561PWP based on the following engineering factors:

Electrical Compatibility: Both devices share identical gain-bandwidth product (17 MHz) and input bias current (10 pA), establishing functional equivalence for signal conditioning applications. The OPA564AIDWP maintains the same minimum supply voltage (7 V) while extending maximum supply capability to 24 V, providing enhanced flexibility for multi-voltage system designs. The substitute device delivers higher output current capability (1.5 A versus 1.2 A) and lower supply current consumption (39 mA versus 50 mA), representing improved performance characteristics.

Regulatory and Compliance Alignment: Both devices maintain Active product status with identical RoHS3 compliance and REACH unaffected designation. Moisture sensitivity level (MSL 2, 1 Year) specifications are identical, ensuring equivalent handling and storage requirements.

Package Consideration: The OPA564AIDWP utilizes a 20-SOIC package format (0.295" width) compared to the OPA561PWP 20-PowerTSSOP format (0.173" width). This substitution requires PCB layout modification to accommodate the larger package footprint. The exposed pad configuration in the OPA564AIDWP package provides thermal management benefits for high-current applications.

Temperature Range Variance: The OPA561PWP operates across -40 to 125°C, while the OPA564AIDWP operates across -40 to 85°C. Applications requiring operation above 85°C must retain the original OPA561PWP specification.

Frequently Asked Questions (FAQ)

Q: Can the OPA564AIDWP directly replace the OPA561PWP without circuit modification?

A: Electrical substitution is valid based on identical gain-bandwidth product, input bias current, and minimum supply voltage specifications. However, the different package format (20-SOIC versus 20-PowerTSSOP) requires PCB layout modification. Pin-to-pin compatibility must be verified against the specific application schematic.

Q: What is the significance of the different slew rate specifications (50 V/µs versus 40 V/µs)?

A: Slew rate determines the maximum rate of voltage change at the amplifier output. The OPA564AIDWP's 40 V/µs specification is lower than the OPA561PWP's 50 V/µs. For applications requiring high-speed signal transitions or steep waveform edges, the original OPA561PWP specification should be retained. Most general-purpose amplification applications tolerate this variance.

Q: Why does the OPA564AIDWP have a lower maximum operating temperature (85°C versus 125°C)?

A: Operating temperature range reflects the device's thermal design and qualification testing. Applications requiring sustained operation above 85°C must use the OPA561PWP. Verify application thermal environment specifications before substitution.

Q: What advantage does the extended supply voltage range (24 V maximum) of the OPA564AIDWP provide?

A: The OPA564AIDWP's 24 V maximum supply capability enables operation in higher-voltage system architectures compared to the OPA561PWP's 15 V maximum. This extended range provides design flexibility for multi-voltage platforms while maintaining backward compatibility with lower-voltage applications.

Q: How does the higher output current capability (1.5 A versus 1.2 A) affect substitution decisions?

A: Higher output current capability represents an enhancement. Applications requiring maximum output current up to 1.2 A operate within both device specifications. Applications requiring 1.2 to 1.5 A output current benefit from the OPA564AIDWP's enhanced capability. No performance degradation occurs from this specification variance.

Q: Are there inventory or supply chain considerations for these devices?

A: The OPA561PWP maintains 69,624 pieces in stock, while the OPA564AIDWP maintains 2,200 pieces in stock. Availability differences may influence substitution decisions based on project timeline requirements.

Q: What package-related considerations apply to the OPA564AIDWP substitution?

A: The OPA564AIDWP 20-SOIC package (0.295" width) is larger than the OPA561PWP 20-PowerTSSOP package (0.173" width). PCB layout must accommodate increased component spacing. The exposed pad in the OPA564AIDWP package provides thermal dissipation benefits for high-current applications. Verify PCB design rules and thermal requirements before implementation.