OPA337PA Equivalent & Substitute Parts

Part Overview

The OPA337PA is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device features rail-to-rail output capability and is designed for single-circuit amplification applications. The OPA337PA is classified as obsolete, making equivalent and substitute parts necessary for new designs and ongoing production requirements. Substitute parts must maintain compatibility with the 8-DIP package footprint and deliver equivalent or superior electrical performance within the specified operating parameters.

Substiute Parts

OPA337PA

Texas InstrumentsIn Stock: 2601OPA337PA Datasheet

Current PartRFQ

MCP601-E/P

Microchip TechnologyIn Stock: 2791MCP601-E/P Datasheet

MFR RecommendedRFQ

MCP601-I/P

Microchip TechnologyIn Stock: 4916MCP601-I/P Datasheet

MFR RecommendedRFQ

MCP616-I/P

Microchip TechnologyIn Stock: 2104MCP616-I/P Datasheet

MFR RecommendedRFQ

OPA2743UA

Texas InstrumentsIn Stock: 12967OPA2743UA Datasheet

MFR RecommendedRFQ

RE46C311E8F

Microchip TechnologyIn Stock: 1094RE46C311E8F Datasheet

MFR RecommendedRFQ

TLV2461AIP

Texas InstrumentsIn Stock: 2381TLV2461AIP Datasheet

MFR RecommendedRFQ

TLV2470CP

Texas InstrumentsIn Stock: 823TLV2470CP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the OPA337PA are selected based on strict electrical and mechanical compatibility criteria. The primary substitution logic is based on the following parameters:

Core Compatibility Requirements:

• Package Type: 8-DIP (0.300", 7.62mm) through-hole mounting
• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Voltage Supply Range: Minimum 2.7 V, Maximum 5.5 V (or higher)
• Operating Temperature Range: -40°C to 85°C (or extended)

Electrical Performance Parameters:

• Slew Rate: 1.2 V/µs or greater
• Gain Bandwidth Product: 3 MHz or greater
• Current - Supply: 525 µA or lower (preferred for power efficiency)
• Current - Output / Channel: 9 mA or greater
• Voltage - Input Offset: 500 µV or lower (preferred for accuracy)
• Current - Input Bias: 0.2 pA or lower (preferred for high-impedance applications)

Substitute parts are grouped into two categories:

Category 1: Direct Electrical Equivalents (Active Status) Parts that maintain all core electrical specifications and are in active production status, ensuring long-term availability and supply chain stability.

Category 2: Functional Alternatives (Performance Trade-offs) Parts that meet core compatibility requirements but exhibit different electrical characteristics, suitable for applications where specific performance parameters are not critical constraints.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute: MCP601-I/P

The MCP601-I/P from Microchip Technology is the recommended primary substitute for the OPA337PA. This device maintains full compatibility with the 8-DIP package footprint and meets all core electrical requirements. The MCP601-I/P is in active production status, ensuring reliable long-term supply chain availability. Operating temperature range matches the OPA337PA specification (-40°C to 85°C). Supply voltage range (2.7 V to 6 V) encompasses the OPA337PA requirement (2.7 V to 5.5 V). Electrical performance exceeds the original specification: slew rate of 2.3 V/µs (versus 1.2 V/µs), gain bandwidth product of 2.8 MHz (comparable to 3 MHz), and reduced supply current of 230 µA (versus 525 µA). Output current capability of 22 mA exceeds the 9 mA requirement. RoHS3 compliance and unlimited moisture sensitivity level (MSL 1) match the original part specifications.

Secondary Substitute: MCP601-E/P

The MCP601-E/P offers identical electrical specifications to the MCP601-I/P with extended operating temperature range (-40°C to 125°C), providing additional thermal margin for demanding applications. This part is also in active production status. Selection between MCP601-E/P and MCP601-I/P depends on application temperature requirements.

Alternative Substitute: TLV2461AIP

The TLV2461AIP from Texas Instruments provides enhanced electrical performance with gain bandwidth product of 6.4 MHz and slew rate of 1.6 V/µs. This device is suitable for applications requiring higher bandwidth performance. However, TLV2461AIP is classified as Last Time Buy, indicating limited future availability. Extended operating temperature range (-40°C to 125°C) and higher output current capability (80 mA) provide additional design flexibility. Selection of this part should account for supply chain constraints.

Alternative Substitute: TLV2470CP

The TLV2470CP from Texas Instruments is suitable for applications operating within the 0°C to 70°C temperature range. This device offers comparable electrical performance to the OPA337PA with slew rate of 1.5 V/µs and gain bandwidth product of 2.8 MHz. Active production status ensures availability. This part is appropriate for commercial-grade applications where extended temperature range is not required.

Specialized Substitute: MCP616-I/P

The MCP616-I/P is a low-power alternative suitable for battery-powered or energy-constrained applications. Supply current of only 19 µA (versus 525 µA in the OPA337PA) provides significant power savings. However, this device exhibits substantially reduced bandwidth (190 kHz gain bandwidth product) and slew rate (0.08 V/µs), making it unsuitable for high-frequency signal processing. Input offset voltage of 150 µV is superior to the OPA337PA. Selection requires confirmation that application bandwidth requirements are compatible with the reduced performance specifications.

Not Recommended: RE46C311E8F

The RE46C311E8F does not meet the electrical performance requirements of the OPA337PA. Gain bandwidth product of 10 kHz and slew rate of 0.003 V/µs are insufficient for general-purpose amplification applications. Operating temperature range (-10°C to 60°C) is narrower than the OPA337PA specification. This device is suitable only for ultra-low-power, low-frequency applications and should not be selected as a direct substitute.

Not Recommended: OPA2743UA

The OPA2743UA is a dual-channel CMOS amplifier in 8-SOIC surface-mount package. This device is incompatible with the OPA337PA due to different package type (surface mount versus through-hole DIP) and different circuit count (2 circuits versus 1 circuit). Selection of this part requires PCB redesign and is not a direct substitute.

Frequently Asked Questions (FAQ)

Q1: Can I use MCP601-I/P as a direct replacement for OPA337PA without circuit modifications?

A: Yes. The MCP601-I/P is pin-compatible with the OPA337PA in the 8-DIP package and meets all core electrical specifications. No circuit modifications are required for basic amplification applications. However, applications with specific bandwidth or slew rate requirements should verify that the MCP601-I/P performance characteristics are acceptable.

Q2: What is the difference between MCP601-E/P and MCP601-I/P?

A: Both devices are electrically identical with identical electrical specifications. The primary difference is operating temperature range: MCP601-E/P operates from -40°C to 125°C, while MCP601-I/P operates from -40°C to 85°C. Select MCP601-E/P for applications requiring extended high-temperature operation.

Q3: Why is TLV2461AIP marked as "Last Time Buy"?

A: Last Time Buy status indicates that Texas Instruments has announced end-of-life for this product. New orders may be accepted for a limited time, but production will cease. For new designs, MCP601-I/P or MCP601-E/P are recommended to ensure long-term supply availability.

Q4: Can I use MCP616-I/P to reduce power consumption in my application?

A: MCP616-I/P offers extremely low supply current (19 µA), making it attractive for battery-powered applications. However, this device has severely limited bandwidth (190 kHz) and slew rate (0.08 V/µs). Use MCP616-I/P only if your application operates at frequencies below 10 kHz and does not require fast signal transitions.

Q5: Is the OPA2743UA compatible with OPA337PA?

A: No. The OPA2743UA is not compatible with the OPA337PA. The OPA2743UA is a dual-channel device (2 circuits) in 8-SOIC surface-mount package, while the OPA337PA is a single-channel device (1 circuit) in 8-DIP through-hole package. PCB redesign would be required to use the OPA2743UA.

Q6: What is the significance of the 8-DIP package specification?

A: The 8-DIP (0.300", 7.62mm) package is a through-hole component with 0.3-inch row spacing. All recommended substitutes maintain this package specification, ensuring mechanical and electrical compatibility with existing PCB designs. Substitute parts with different package types (such as 8-SOIC) require PCB redesign and are not direct replacements.

Q7: Are all substitute parts RoHS3 compliant?

A: Yes. All recommended substitute parts (MCP601-E/P, MCP601-I/P, MCP616-I/P, TLV2461AIP, TLV2470CP, and RE46C311E8F) are RoHS3 compliant, matching the compliance status of the OPA337PA.

Q8: Which substitute part should I select for a new design?

A: For new designs, MCP601-I/P is the recommended choice. This device is in active production status, offers superior electrical performance compared to the OPA337PA, maintains full package compatibility, and provides long-term supply chain stability. Select MCP601-E/P if your application requires extended operating temperature range (-40°C to 125°C).

Q9: Can I use TLV2470CP in applications requiring -40°C operation?

A: No. The TLV2470CP operating temperature range is 0°C to 70°C, which does not include -40°C. For applications requiring -40°C operation, select MCP601-I/P, MCP601-E/P, or TLV2461AIP.

Q10: What are the key electrical differences between MCP601-I/P and OPA337PA?

A: MCP601-I/P offers improved slew rate (2.3 V/µs versus 1.2 V/µs), reduced supply current (230 µA versus 525 µA), higher output current capability (22 mA versus 9 mA), and comparable gain bandwidth product (2.8 MHz versus 3 MHz). Input offset voltage is slightly higher (700 µV versus 500 µV). These differences are acceptable for general-purpose amplification applications.