OPA251PA Equivalent & Substitute Parts

Part Overview

The OPA251PA is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device features rail-to-rail output capability and operates across a wide supply voltage range of 2.7 V to 36 V, making it suitable for low-power analog signal processing applications. The OPA251PA is classified as obsolete, necessitating identification of functionally equivalent substitute components for ongoing design support and procurement continuity.

Substiute Parts

OPA251PA

Texas InstrumentsIn Stock: 2005OPA251PA Datasheet

Current PartRFQ

OPA251UA

Texas InstrumentsIn Stock: 4965OPA251UA Datasheet

MFR RecommendedRFQ

OPA241PA

Texas InstrumentsIn Stock: 4436OPA241PA Datasheet

MFR RecommendedRFQ

TLC27L1CP

Texas InstrumentsIn Stock: 1240TLC27L1CP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the OPA251PA is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Supply Voltage Range: Minimum 2.7 V, Maximum 36 V
• Operating Temperature Range: -40°C to 85°C
• Input Bias Current: 4 nA
• Input Offset Voltage: 50 µV (nominal tolerance)
• Output Current Capability: 21 mA per channel

Mechanical Compatibility Criteria:

• Package Type: 8-DIP through-hole configuration
• Pin Count: 8
• Physical Dimensions: 0.300" (7.62mm) width

The OPA251UA provides direct electrical equivalence with identical performance specifications but differs in mounting technology (surface mount 8-SOIC package). The OPA241PA maintains through-hole 8-DIP packaging with equivalent electrical performance, though input offset voltage specification is relaxed to 100 µV. The TLC27L1CP operates within the same package format but exhibits different electrical characteristics, including enhanced slew rate (0.05 V/µs), higher gain bandwidth product (110 kHz), and reduced supply voltage range (3 V to 16 V).

Parameter Comparison

Engineering Selection Recommendations

OPA251UA Substitution: The OPA251UA is the manufacturer-recommended equivalent for the OPA251PA, providing identical electrical specifications and performance characteristics. This device is suitable for applications where surface-mount technology is acceptable. The OPA251UA requires PCB redesign to accommodate the 8-SOIC package format. Both devices maintain ROHS3 compliance and share the same base product number (OPA251), confirming functional equivalence.

OPA241PA Substitution: The OPA241PA maintains the through-hole 8-DIP package format of the OPA251PA, eliminating the need for PCB redesign. Electrical performance is equivalent across all critical parameters with the exception of input offset voltage, which is specified at 100 µV compared to 50 µV for the OPA251PA. This device carries Last Time Buy status, indicating limited future availability. ROHS3 compliance is maintained.

TLC27L1CP Substitution: The TLC27L1CP is a through-hole 8-DIP packaged alternative that operates within the LinCMOS™ series. This device exhibits enhanced performance in slew rate (0.05 V/µs versus 0.01 V/µs) and gain bandwidth product (110 kHz versus 35 kHz), with significantly lower input bias current (0.7 pA). However, the TLC27L1CP operates within a reduced supply voltage range (3 V to 16 V maximum) and narrower temperature range (0°C to 70°C), making it unsuitable for applications requiring the full -40°C to 85°C operating window or supply voltages exceeding 16 V. This device carries Last Time Buy status.

Frequently Asked Questions (FAQ)

Q: Can the OPA251UA directly replace the OPA251PA without circuit modification?

A: The OPA251UA provides identical electrical performance and is the manufacturer-recommended substitute. However, the OPA251UA uses an 8-SOIC surface-mount package versus the 8-DIP through-hole package of the OPA251PA. Direct PCB-level substitution requires package conversion or PCB redesign. Electrical functionality remains unchanged.

Q: Is the OPA241PA a suitable replacement for through-hole applications?

A: Yes. The OPA241PA maintains the 8-DIP through-hole package format and operates across the same supply voltage range (2.7 V to 36 V) and temperature range (-40°C to 85°C). The input offset voltage specification is relaxed to 100 µV compared to 50 µV for the OPA251PA. Applications tolerant of this offset voltage specification can use the OPA241PA without circuit redesign.

Q: Why is the TLC27L1CP not recommended as a direct substitute?

A: While the TLC27L1CP shares the 8-DIP through-hole package, it operates within a reduced supply voltage range (3 V to 16 V maximum) and narrower temperature range (0°C to 70°C). Applications requiring the full OPA251PA operating envelope (-40°C to 85°C, up to 36 V supply) cannot use the TLC27L1CP. The TLC27L1CP is suitable only for applications operating within its specified limits.

Q: What is the significance of the product status designations?

A: The OPA251PA and OPA251UA are classified as Obsolete, indicating discontinued manufacturing and limited availability. The OPA241PA and TLC27L1CP carry Last Time Buy status, indicating final production runs with defined end-of-life dates. For long-term design continuity, the OPA251UA or OPA241PA are preferred over the TLC27L1CP.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. The OPA251PA, OPA251UA, OPA241PA, and TLC27L1CP are all ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What packaging considerations apply to each substitute?

A: The OPA251PA and OPA241PA use through-hole 8-DIP packages suitable for breadboard prototyping and through-hole PCB assembly. The OPA251UA uses surface-mount 8-SOIC packaging, requiring SMT assembly equipment. The TLC27L1CP uses through-hole 8-DIP packaging compatible with the OPA251PA footprint.