OPA2336UG4 Equivalent & Substitute Parts

Part Overview

The OPA2336UG4 is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal conditioning applications. This device features low input bias current (1 pA), low input offset voltage (60 µV), and operates across a 2.3 V to 5.5 V supply range with an operating temperature range of -40°C to 85°C. The OPA2336UG4 is packaged in an 8-SOIC surface-mount configuration and is part of the MicroAmplifier™ series.

The OPA2336UG4 has been discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives. Substitute parts must maintain compatibility with the original electrical specifications, mechanical packaging requirements, and compliance certifications to ensure direct replacement capability in existing designs.

Key Parameters

Parameter	OPA2336UG4 Value	Unit
Amplifier Type	CMOS	—
Number of Circuits	2	—
Output Type	Rail-to-Rail	—
Slew Rate	0.03	V/µs
Gain Bandwidth Product	100	kHz
Current - Input Bias	1	pA
Voltage - Input Offset	60	µV
Current - Supply (x2 Channels)	20	µA
Current - Output / Channel	5	mA
Voltage - Supply Span (Min)	2.3	V
Voltage - Supply Span (Max)	5.5	V
Operating Temperature	-40 to 85	°C
Package / Case	8-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	2 (1 Year)	—

Substitute Part Grouping Explanation

Substitute parts for the OPA2336UG4 are identified based on the following critical parameters that determine functional equivalence:

Primary Substitution Criteria:

Amplifier Type: CMOS
Number of Circuits: 2
Output Type: Rail-to-Rail
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature Range: Minimum -40°C to 85°C
Supply Voltage Range: Minimum 2.3 V to 5.5 V

Secondary Compatibility Parameters:

Slew Rate: 0.03 V/µs or greater
Gain Bandwidth Product: 100 kHz or greater
Current - Input Bias: 1 pA or lower
Voltage - Input Offset: 60 µV or lower
Current - Supply: 20 µA (x2 Channels) or lower
Current - Output / Channel: 5 mA or greater

Substitute parts are grouped into two categories:

Category 1 - Direct Manufacturer Equivalents (Texas Instruments): OPA2336U represents the active production equivalent from the same manufacturer and series, maintaining identical electrical specifications and packaging.

Category 2 - Cross-Manufacturer CMOS Alternatives (Microchip Technology): MCP607-I/SN, MCP607T-I/SN, and MCP617T-I/SN are CMOS dual-channel amplifiers in 8-SOIC packaging that meet or exceed the primary electrical specifications of the OPA2336UG4.

Category 3 - Alternative Topology Substitutes (Rohm Semiconductor & Analog Devices): BU7266F-E2, BU7266SF-E2, BU7486F-E2, LMR932F-GE2, MAX4471ESA+, and MAX4471ESA+T represent alternative amplifier topologies (including general-purpose and ultra-low-power designs) that maintain rail-to-rail output capability and 8-pin surface-mount packaging, though with different electrical performance characteristics.

Parameter Comparison

Parameter	OPA2336UG4	OPA2336U	MCP607-I/SN	MCP607T-I/SN	MCP617T-I/SN	BU7266F-E2	BU7266SF-E2	BU7486F-E2	LMR932F-GE2	MAX4471ESA+	MAX4471ESA+T
Amplifier Type	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	General Purpose	General Purpose	General Purpose
Number of Circuits	2	2	2	2	2	2	2	2	2	2	2
Output Type	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail
Slew Rate (V/µs)	0.03	0.03	0.08	0.08	0.08	0.0024	0.0024	10	0.35	0.002	0.002
Gain Bandwidth Product (kHz)	100	100	155	155	190	4	4	10000	1400	9	9
Current - Input Bias (pA)	1	1	1	1	5	1	1	1	5	200	200
Voltage - Input Offset (µV)	60	60	250	250	150	1000	1000	1000	1000	500	500
Current - Supply (µA, x2 Channels)	20	20	18.7	18.7	19	0.7	0.7	6000	140	0.75	0.75
Current - Output / Channel (mA)	5	5	17	17	17	4	4	12	90	36	36
Voltage - Supply Span Min (V)	2.3	2.3	2.5	2.5	2.3	1.8	1.8	3	1.8	1.8	1.8
Voltage - Supply Span Max (V)	5.5	5.5	6	6	5.5	5.5	5.5	5.5	5	5.5	5.5
Operating Temperature (°C)	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 105	-40 to 105	-40 to 85	-40 to 85	-40 to 85
Package / Case	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Product Status	Discontinued	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	2 (1 Year)	2 (1 Year)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

Tier 1 - Direct Replacement (Recommended for Pin-Compatible Substitution):

OPA2336U is the primary recommended substitute. This part is manufactured by Texas Instruments, maintains identical electrical specifications to the OPA2336UG4, and is packaged in the same 8-SOIC (0.154", 3.90mm Width) configuration. The OPA2336U is currently in active production status, ensuring long-term availability. Both parts are ROHS3 compliant and carry identical REACH and ECCN classifications. The OPA2336U requires no circuit redesign and provides direct functional equivalence.

Tier 2 - Cross-Manufacturer CMOS Alternatives (Recommended for Performance-Matched Substitution):

MCP607-I/SN, MCP607T-I/SN, and MCP617T-I/SN are manufactured by Microchip Technology and provide CMOS dual-channel amplification in 8-SOIC (0.154", 3.90mm Width) packaging. These parts maintain the same package footprint as the OPA2336UG4 and exceed the minimum electrical specifications:

MCP607-I/SN and MCP607T-I/SN: Slew rate of 0.08 V/µs (2.67× higher), gain bandwidth product of 155 kHz (1.55× higher), and output current of 17 mA per channel (3.4× higher). Supply voltage range extends to 6 V maximum. These parts are suitable for applications requiring improved dynamic performance while maintaining low input bias current (1 pA) and acceptable input offset voltage (250 µV).
MCP617T-I/SN: Provides enhanced specifications with gain bandwidth product of 190 kHz (1.9× higher), input offset voltage of 150 µV (2.5× lower), and input bias current of 5 nA. This part is optimized for precision applications requiring lower offset voltage while maintaining CMOS topology benefits.

All three Microchip alternatives are in active production, ROHS3 compliant, and carry MSL rating of 1 (Unlimited), providing superior moisture handling compared to the OPA2336UG4.

Tier 3 - Alternative Topology Substitutes (Conditional Substitution Based on Application Requirements):

BU7266F-E2 and BU7266SF-E2 (Rohm Semiconductor): Ultra-low-power CMOS amplifiers with supply current of 700 nA (x2 channels), representing 35× lower power consumption than the OPA2336UG4. These parts are suitable for battery-powered applications where power efficiency is critical. However, they feature significantly reduced bandwidth (4 kHz) and slew rate (0.0024 V/µs), limiting use to low-frequency signal conditioning. BU7266SF-E2 extends operating temperature to 105°C. Package width is 0.173" (4.40mm), requiring PCB layout verification for compatibility.

BU7486F-E2 (Rohm Semiconductor): High-performance CMOS amplifier with slew rate of 10 V/µs and gain bandwidth product of 10 MHz, suitable for high-speed applications. Supply current of 6 mA and output current of 12 mA per channel support higher-power signal conditioning. Minimum supply voltage is 3 V, restricting use in 2.3 V systems. Package width is 0.173" (4.40mm).

LMR932F-GE2 (Rohm Semiconductor): General-purpose amplifier with slew rate of 0.35 V/µs and gain bandwidth product of 1.4 MHz, providing moderate performance enhancement. Input bias current of 5 nA and output current of 90 mA per channel support high-current applications. Supply voltage range is 1.8 V to 5 V (maximum 5 V vs. 5.5 V for OPA2336UG4). Package width is 0.173" (4.40mm).

MAX4471ESA+ and MAX4471ESA+T (Analog Devices Inc./Maxim Integrated): General-purpose amplifiers with ultra-low supply current of 750 nA (x2 channels) and high output current of 36 mA per channel. These parts feature lower bandwidth (9 kHz) and slew rate (0.002 V/µs) compared to the OPA2336UG4, limiting use to low-frequency applications. Input bias current of 200 pA and input offset voltage of 500 µV represent reduced precision compared to the OPA2336UG4. Both variants maintain 8-SOIC (0.154", 3.90mm Width) packaging. MAX4471ESA+ is supplied in Tube packaging, while MAX4471ESA+T is supplied in Tape & Reel format.

Compliance and Certification:

All substitute parts listed are ROHS3 compliant and carry REACH Unaffected status, matching the OPA2336UG4 regulatory classification. All parts are assigned ECCN EAR99 and HTSUS 8542.33.0001 codes. MSL ratings vary: Tier 1 and Tier 2 parts carry MSL 1 (Unlimited) or MSL 2 (1 Year), providing flexibility for storage and handling protocols.

Frequently Asked Questions (FAQ)

Q1: Can OPA2336U be used as a direct replacement for OPA2336UG4 without circuit modification?

A: Yes. OPA2336U is the active production equivalent manufactured by Texas Instruments with identical electrical specifications, package configuration (8-SOIC, 0.154" width), and pin assignment. No circuit redesign is required. The primary difference is product status: OPA2336UG4 is discontinued while OPA2336U is in active production.

Q2: What is the difference between OPA2336UG4 and OPA2336U packaging?

A: Both parts use 8-SOIC (0.154", 3.90mm Width) surface-mount packaging. The primary packaging difference is the distribution format: OPA2336UG4 was supplied in Tube packaging, while OPA2336U is available in Tube packaging. Both are suitable for automated assembly processes.

Q3: Are Microchip MCP607 and MCP617 series parts pin-compatible with OPA2336UG4?

A: Yes. MCP607-I/SN, MCP607T-I/SN, and MCP617T-I/SN are pin-compatible dual-channel amplifiers in 8-SOIC (0.154", 3.90mm Width) packaging. All three parts maintain identical pin assignments for dual-channel CMOS amplifiers. No PCB layout modification is required for pin compatibility. However, electrical performance differs: MCP607 series provides higher bandwidth (155 kHz vs. 100 kHz) and slew rate (0.08 V/µs vs. 0.03 V/µs), while MCP617 adds improved input offset voltage (150 µV vs. 60 µV).

Q4: Why do Rohm BU7266 and BU7486 parts have different package widths (0.173" vs. 0.154")?

A: BU7266F-E2, BU7266SF-E2, and BU7486F-E2 use 8-SOP packaging with 0.173" (4.40mm) width, compared to the OPA2336UG4's 8-SOIC packaging with 0.154" (3.90mm) width. While both are 8-pin surface-mount packages, the wider body requires verification of PCB pad spacing and solder mask clearances. Footprint compatibility must be confirmed before substitution. Pin assignments are identical for dual-channel amplifier configurations.

Q5: Which substitute part offers the lowest power consumption?

A: BU7266F-E2 and BU7266SF-E2 offer the lowest supply current at 700 nA (x2 channels), representing 35× lower power consumption than the OPA2336UG4 (20 µA x2 channels). These parts are optimized for battery-powered and energy-harvesting applications. However, they feature significantly reduced bandwidth (4 kHz) and slew rate (0.0024 V/µs), limiting use to low-frequency signal conditioning below approximately 400 Hz.

Q6: Which substitute part offers the highest bandwidth and slew rate?

A: BU7486F-E2 offers the highest performance with slew rate of 10 V/µs (333× higher than OPA2336UG4) and gain bandwidth product of 10 MHz (100× higher). This part is suitable for high-speed signal conditioning, precision instrumentation, and audio-frequency applications. However, minimum supply voltage is 3 V, restricting use in systems requiring 2.3 V operation. Supply current of 6 mA (x2 channels) is 300× higher than the OPA2336UG4.

Q7: Can MAX4471ESA+ be used in applications requiring precision signal conditioning?

A: MAX4471ESA+ is suitable for low-frequency, low-power applications but not recommended for precision signal conditioning. Input bias current of 200 pA (200× higher than OPA2336UG4) and input offset voltage of 500 µV (8.3× higher) limit precision. Bandwidth of 9 kHz and slew rate of 0.002 V/µs restrict use to sub-kilohertz signal conditioning. This part is optimized for ultra-low-power operation (750 nA supply current) rather than precision.

Q8: What is the operating temperature range difference between OPA2336UG4 and substitute parts?

A: OPA2336UG4 operates from -40°C to 85°C. Most substitute parts maintain this range. BU7266SF-E2 and BU7486F-E2 extend the upper limit to 105°C, providing 20°C additional margin for high-temperature applications. LMR932F-GE2 maintains -40°C to 85°C range. MAX4471ESA+ and MAX4471ESA+T maintain -40°C to 85°C range. Applications requiring operation above 85°C should specify BU7266SF-E2 or BU7486F-E2.

Q9: What is the difference between MCP607-I/SN (Tube) and MCP607T-I/SN (Tape & Reel)?

A: Both parts are electrically identical CMOS dual-channel amplifiers with 155 kHz bandwidth and 0.08 V/µs slew rate. The difference is packaging format: MCP607-I/SN is supplied in Tube packaging for manual assembly or small-volume production, while MCP607T-I/SN is supplied in Tape & Reel format for automated high-volume assembly. Electrical specifications, pin assignments, and 8-SOIC (0.154", 3.90mm Width) package dimensions are identical.

Q10: Are all substitute parts ROHS3 compliant?

A: Yes. All substitute parts listed (OPA2336U, MCP607-I/SN, MCP607T-I/SN, MCP617T-I/SN, BU7266F-E2, BU7266SF-E2, BU7486F-E2, LMR932F-GE2, MAX4471ESA+, MAX4471ESA+T) are ROHS3 compliant and carry REACH Unaffected status, matching the OPA2336UG4 regulatory classification. All parts are assigned ECCN EAR99 and HTSUS 8542.33.0001 codes for export control and tariff purposes.

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