OPA2336PA Equivalent & Substitute Parts

Part Overview

The OPA2336PA is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This device features rail-to-rail output capability and operates across a 2.3V to 5.5V supply range, making it suitable for low-power analog signal processing applications. The OPA2336PA is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing design requirements and production continuity.

Substiute Parts

OPA2336PA

Texas InstrumentsIn Stock: 2243OPA2336PA Datasheet

Current PartRFQ

OPA2336UA

Texas InstrumentsIn Stock: 3102OPA2336UA Datasheet

MFR RecommendedRFQ

MCP607-I/P

Microchip TechnologyIn Stock: 45470MCP607-I/P Datasheet

MFR RecommendedRFQ

RE46C312E8F

Microchip TechnologyIn Stock: 781RE46C312E8F Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the OPA2336PA is determined by the following critical parameters: amplifier type (CMOS), number of circuits (2), output type (rail-to-rail), supply voltage range compatibility, operating temperature range, and package form factor. The substitute parts are grouped based on their ability to maintain functional equivalence within these constraints.

Primary Substitution Criteria:

• Dual-channel CMOS amplifier architecture
• Rail-to-rail output capability
• Supply voltage range: minimum 2.3V, maximum 5.5V
• Operating temperature: -40°C to 85°C
• 8-pin package configuration

Substitute Categories:

Category 1: Direct Package Equivalent (Through-Hole DIP)

• MCP607-I/P (Microchip Technology): Maintains 8-PDIP through-hole package, CMOS dual-channel architecture, rail-to-rail output, and identical operating temperature range.
• RE46C312E8F (Microchip Technology): Maintains 8-PDIP through-hole package and dual-channel architecture with rail-to-rail output, though with different performance characteristics.

Category 2: Functional Equivalent (Surface Mount Alternative)

• OPA2336UA (Texas Instruments): Identical electrical specifications to OPA2336PA but in 8-SOIC surface-mount package, representing the active production equivalent from the same manufacturer.

Parameter Comparison

Engineering Selection Recommendations

OPA2336UA Selection Rationale: The OPA2336UA is the manufacturer-recommended equivalent from Texas Instruments. It provides identical electrical specifications to the OPA2336PA, including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, and output current per channel. Both devices maintain ROHS3 compliance and REACH unaffected status. The primary difference is the package form factor: OPA2336UA uses 8-SOIC surface-mount packaging versus the through-hole 8-DIP of the OPA2336PA. Selection of OPA2336UA is appropriate for new designs or production runs where surface-mount assembly is available. The device is currently in active production status with higher inventory availability (2993 pcs).

MCP607-I/P Selection Rationale: The MCP607-I/P maintains the through-hole 8-DIP package form factor of the OPA2336PA, enabling direct socket compatibility in existing PCB designs. This Microchip Technology device is CMOS-based with dual channels and rail-to-rail output. Performance differences include higher slew rate (0.08 V/µs versus 0.03 V/µs), higher gain bandwidth product (155 kHz versus 100 kHz), and higher output current per channel (17 mA versus 5 mA). The MCP607-I/P has a slightly higher minimum supply voltage (2.5V versus 2.3V) and maximum supply voltage (6.0V versus 5.5V). Input offset voltage is higher at 250 µV. The device is in active production with substantial inventory (45410 pcs) and maintains ROHS3 compliance.

RE46C312E8F Selection Rationale: The RE46C312E8F is a general-purpose amplifier from Microchip Technology in 8-DIP through-hole package. This device exhibits significantly different performance characteristics: substantially lower slew rate (0.003 V/µs), lower gain bandwidth product (10 kHz), and much higher input offset voltage (3 mV). Supply current is dramatically reduced (600 nA versus 20 µA), and output current per channel is higher (27 mA). The operating temperature range is narrower (-10°C to 60°C versus -40°C to 85°C), and minimum supply voltage is lower (1.8V). Selection of RE46C312E8F is appropriate only for applications where the OPA2336PA's performance specifications are not critical and where the narrower temperature range is acceptable.

All substitute parts maintain ROHS3 compliance and REACH unaffected status, consistent with the original OPA2336PA.

Frequently Asked Questions (FAQ)

Q: Can OPA2336UA be used as a direct replacement for OPA2336PA in existing through-hole PCB designs?

A: No. The OPA2336UA uses 8-SOIC surface-mount packaging, while the OPA2336PA uses 8-DIP through-hole packaging. Direct socket substitution is not possible without PCB redesign or adapter solutions. For through-hole compatibility, use MCP607-I/P or RE46C312E8F.

Q: What are the key electrical differences between OPA2336PA and MCP607-I/P?

A: Both devices are dual-channel CMOS amplifiers with rail-to-rail output and identical operating temperature range (-40°C to 85°C). MCP607-I/P has higher slew rate (0.08 V/µs versus 0.03 V/µs), higher gain bandwidth product (155 kHz versus 100 kHz), higher output current per channel (17 mA versus 5 mA), and higher input offset voltage (250 µV versus 60 µV). Supply voltage range is slightly wider for MCP607-I/P (2.5V to 6.0V versus 2.3V to 5.5V).

Q: Is RE46C312E8F suitable for all OPA2336PA applications?

A: No. RE46C312E8F has significantly different performance characteristics, including much lower slew rate (0.003 V/µs), lower gain bandwidth product (10 kHz), and much higher input offset voltage (3 mV). Additionally, its operating temperature range (-10°C to 60°C) is narrower than OPA2336PA (-40°C to 85°C). Use RE46C312E8F only for applications where these performance differences are acceptable.

Q: What is the inventory status of substitute parts?

A: OPA2336UA has 2993 pcs in stock. MCP607-I/P has 45410 pcs in stock. RE46C312E8F has 680 pcs in stock. All are new original components.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. OPA2336UA, MCP607-I/P, and RE46C312E8F are all ROHS3 compliant and REACH unaffected, consistent with the original OPA2336PA.

Q: Which substitute part is recommended for new designs?

A: For new designs with surface-mount assembly capability, OPA2336UA is recommended as the manufacturer-equivalent from Texas Instruments with identical electrical specifications. For designs requiring through-hole mounting, MCP607-I/P is recommended for applications where higher performance (slew rate, bandwidth, output current) is beneficial or acceptable.

Q: Can OPA2336PA be replaced with MCP607-I/P in low-power applications?

A: MCP607-I/P has slightly lower supply current (18.7 µA versus 20 µA per dual channels), making it suitable for low-power applications. However, verify that the higher slew rate, gain bandwidth product, and input offset voltage do not negatively impact circuit performance.