OPA2336P Equivalent & Substitute Parts

Part Overview

The OPA2336P is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This device features rail-to-rail output capability and is designed for low-power, general-purpose amplification applications. The OPA2336P is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. Substitute components must maintain functional compatibility across critical electrical parameters including supply voltage range, output current capability, and input bias characteristics.

Substiute Parts

OPA2336P

Texas InstrumentsIn Stock: 3190OPA2336P Datasheet

Current PartRFQ

OPA2336U

Texas InstrumentsIn Stock: 1362OPA2336U Datasheet

MFR RecommendedRFQ

MCP607-I/P

Microchip TechnologyIn Stock: 45470MCP607-I/P Datasheet

MFR RecommendedRFQ

MCP617-I/P

Microchip TechnologyIn Stock: 5475MCP617-I/P Datasheet

MFR RecommendedRFQ

RE46C312E8F

Microchip TechnologyIn Stock: 781RE46C312E8F Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the OPA2336P is determined by the following critical parameters:

Primary Compatibility Criteria:

• Amplifier Type: CMOS
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Package / Case: 8-DIP (0.300", 7.62mm) for direct pin-compatible replacement
• Voltage - Supply Span: Minimum 2.3 V, Maximum 5.5 V
• Operating Temperature: -40°C to 85°C

Secondary Compatibility Criteria:

• Current - Input Bias: 1 pA or lower
• Voltage - Input Offset: 60 µV or lower
• Current - Output / Channel: 5 mA or higher
• Current - Supply: 20 µA (x2 Channels) or lower

Substitute parts are grouped into two categories:

Category 1 - Direct Package Replacement (Through-Hole 8-DIP): Parts maintaining identical 8-DIP through-hole packaging with full parameter compatibility: MCP607-I/P, MCP617-I/P, RE46C312E8F.

Category 2 - Functional Equivalent (Surface Mount Alternative): Parts providing electrical equivalence with alternative packaging for redesigned layouts: OPA2336U (8-SOIC surface mount).

Parameter Comparison

Engineering Selection Recommendations

OPA2336U (Texas Instruments, 8-SOIC Surface Mount)

OPA2336U is the manufacturer-recommended direct functional equivalent to OPA2336P. It maintains identical electrical specifications including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, and output current. The device is active in production status, ensuring long-term availability. OPA2336U is ROHS3 compliant and REACH unaffected. Selection of OPA2336U requires PCB redesign to accommodate 8-SOIC surface-mount packaging but eliminates through-hole assembly requirements. Moisture sensitivity level is MSL 2 (1 Year), requiring controlled storage conditions.

MCP617-I/P (Microchip Technology, 8-DIP Through Hole)

MCP617-I/P provides direct 8-DIP through-hole package compatibility with the OPA2336P, eliminating PCB redesign requirements. Electrical performance exceeds OPA2336P specifications in slew rate (0.08 V/µs versus 0.03 V/µs) and gain bandwidth product (190 kHz versus 100 kHz). Input offset voltage is 150 µV, higher than OPA2336P at 60 µV. Input bias current is 5 nA, higher than OPA2336P at 1 pA. Supply voltage range matches OPA2336P (2.3 V to 5.5 V). Output current per channel is 17 mA, exceeding OPA2336P at 5 mA. Supply current is 19 µA (x2 Channels), lower than OPA2336P at 20 µA. MCP617-I/P is active in production, ROHS3 compliant, and MSL 1 (Unlimited). This part is suitable for applications requiring higher slew rate and bandwidth performance within identical packaging.

MCP607-I/P (Microchip Technology, 8-DIP Through Hole)

MCP607-I/P maintains 8-DIP through-hole package compatibility. Slew rate is 0.08 V/µs and gain bandwidth product is 155 kHz, both exceeding OPA2336P. Input offset voltage is 250 µV, significantly higher than OPA2336P. Supply voltage range is 2.5 V to 6 V, with minimum supply voltage 0.2 V higher than OPA2336P. Output current per channel is 17 mA. Supply current is 18.7 µA (x2 Channels), lower than OPA2336P. MCP607-I/P is active in production, ROHS3 compliant, and MSL 1 (Unlimited). This part is suitable for applications where higher supply voltage tolerance and increased output current are beneficial.

RE46C312E8F (Microchip Technology, 8-DIP Through Hole)

RE46C312E8F maintains 8-DIP through-hole package compatibility but exhibits significantly different electrical characteristics. Amplifier type is general purpose rather than CMOS. Slew rate is 0.003 V/µs, substantially lower than OPA2336P. Gain bandwidth product is 10 kHz, significantly lower than OPA2336P. Input offset voltage is 3000 µV (3 mV), substantially higher than OPA2336P. Supply current is 600 nA (x2 Channels), dramatically lower than OPA2336P. Output current per channel is 27 mA, exceeding OPA2336P. Operating temperature range is -10°C to 60°C, narrower than OPA2336P. RE46C312E8F is suitable only for low-frequency, ultra-low-power applications where the reduced operating temperature range is acceptable.

Frequently Asked Questions (FAQ)

Q: Can OPA2336U be used as a direct replacement for OPA2336P without circuit modification?

A: OPA2336U provides electrical equivalence but requires PCB redesign due to package change from 8-DIP through-hole to 8-SOIC surface mount. Pin assignments differ between packages. Electrical specifications are identical, making functional substitution possible with layout redesign.

Q: Which substitute part requires no PCB redesign?

A: MCP617-I/P and MCP607-I/P maintain identical 8-DIP through-hole packaging, allowing direct socket replacement without PCB modification. RE46C312E8F also uses 8-DIP packaging but exhibits different electrical characteristics requiring circuit evaluation.

Q: What is the primary difference between MCP617-I/P and MCP607-I/P?

A: MCP617-I/P has higher gain bandwidth product (190 kHz versus 155 kHz), lower input offset voltage (150 µV versus 250 µV), and higher input bias current (5 nA versus 1 pA). MCP607-I/P supports higher maximum supply voltage (6 V versus 5.5 V). Both maintain identical 8-DIP packaging and through-hole mounting.

Q: Is RE46C312E8F suitable for high-frequency applications?

A: No. RE46C312E8F has gain bandwidth product of 10 kHz and slew rate of 0.003 V/µs, making it unsuitable for applications requiring bandwidth above 10 kHz or fast signal transitions. This part is designed for ultra-low-power, low-frequency applications only.

Q: What is the impact of moisture sensitivity level differences?

A: OPA2336P and substitute parts MCP617-I/P, MCP607-I/P, and RE46C312E8F have MSL 1 (Unlimited), requiring no special moisture control during storage. OPA2336U has MSL 2 (1 Year), requiring controlled storage conditions and bake-out procedures before soldering if storage exceeds one year.

Q: Can MCP617-I/P be used in applications designed for OPA2336P?

A: MCP617-I/P is electrically compatible for most applications. Higher slew rate and bandwidth provide performance margin. Higher input offset voltage (150 µV versus 60 µV) may affect precision applications requiring low offset. Verify offset voltage specification against circuit requirements before substitution.

Q: What is the operating temperature range limitation of RE46C312E8F?

A: RE46C312E8F operates from -10°C to 60°C, compared to OPA2336P range of -40°C to 85°C. This part cannot be used in applications requiring operation below -10°C or above 60°C. Verify temperature requirements before selection.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. OPA2336P, OPA2336U, MCP617-I/P, MCP607-I/P, and RE46C312E8F are all ROHS3 compliant and REACH unaffected, meeting environmental regulatory requirements.

Q: Which substitute part has the lowest supply current consumption?

A: RE46C312E8F has supply current of 600 nA (x2 Channels), substantially lower than OPA2336P at 20 µA. However, RE46C312E8F has significantly reduced bandwidth and slew rate, limiting its application scope to ultra-low-power, low-frequency circuits.