OPA2333AMDREP Equivalent & Substitute Parts

Part Overview

The OPA2333AMDREP is a CMOS Zero-Drift operational amplifier manufactured by Texas Instruments, featuring two independent circuits in an 8-SOIC surface mount package. This device is classified as Active product status and is designed for applications requiring ultra-low input offset voltage and minimal input bias current. The OPA2333AMDREP is suitable for precision measurement, sensor signal conditioning, and low-power analog signal processing applications. Substitute parts are identified based on matching electrical performance parameters, package compatibility, and supply voltage operating ranges to ensure functional equivalence in circuit designs.

Key Parameters

Parameter	Value	Unit
Amplifier Type	CMOS, Zero-Drift	—
Number of Circuits	2	—
Output Type	Rail-to-Rail	—
Slew Rate	0.16	V/µs
Gain Bandwidth Product	350	kHz
Voltage - Input Offset	2	µV
Current - Input Bias	70	pA
Current - Supply (x2 Channels)	17	µA
Current - Output / Channel	5	mA
Voltage - Supply Span (Min)	1.8	V
Voltage - Supply Span (Max)	5.5	V
Operating Temperature	-55 to 125	°C
Package / Case	8-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitute parts for the OPA2333AMDREP are identified based on the following critical parameters that determine functional equivalence:

Primary Matching Criteria:

Number of Circuits: 2 independent amplifier circuits
Output Type: Rail-to-Rail output capability
Package Type: 8-SOIC or 8-SOP surface mount packages
Supply Voltage Range: Minimum 1.8 V to maximum 5.5 V overlap
Mounting Type: Surface Mount

Secondary Performance Considerations:

Slew Rate: 0.16 V/µs (OPA2333AMDREP baseline)
Gain Bandwidth Product: 350 kHz (OPA2333AMDREP baseline)
Input Offset Voltage: 2 µV (OPA2333AMDREP baseline)
Input Bias Current: 70 pA (OPA2333AMDREP baseline)
Operating Temperature Range: -55°C to 125°C (OPA2333AMDREP baseline)

Substitute parts are grouped into two categories: direct CMOS Zero-Drift alternatives (BU7266F-E2, BU7266SF-E2, BU7486F-E2) and general-purpose amplifier alternatives (LMR932F-GE2, LMV358IDT, LMV358IYDT, MAX4471ESA+, MAX4471ESA+T, MCP6002-I/SN, MCP6002T-I/SN). Each substitute maintains the dual-circuit configuration and rail-to-rail output specification while offering variations in performance characteristics suited to different application requirements.

Parameter Comparison

Parameter	OPA2333AMDREP	BU7266F-E2	BU7266SF-E2	BU7486F-E2	LMR932F-GE2	LMV358IDT	LMV358IYDT	MAX4471ESA+	MAX4471ESA+T	MCP6002-I/SN	MCP6002T-I/SN
Manufacturer	Texas Instruments	Rohm Semiconductor	Rohm Semiconductor	Rohm Semiconductor	Rohm Semiconductor	STMicroelectronics	STMicroelectronics	Analog Devices Inc./Maxim Integrated	Analog Devices Inc./Maxim Integrated	Microchip Technology	Microchip Technology
Number of Circuits	2	2	2	2	2	2	2	2	2	2	2
Output Type	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail
Slew Rate (V/µs)	0.16	0.0024	0.0024	10	0.35	0.45	0.45	0.002	0.002	0.6	0.6
Gain Bandwidth Product (kHz)	350	4	4	10000	1400	1300	1300	9	9	1000	1000
Voltage - Input Offset (µV)	2	1000	1000	1000	1000	100	100	500	500	4500	4500
Current - Input Bias (pA)	70	1	1	1	5000	16000	16000	200	200	1	1
Current - Supply (µA, x2 Channels)	17	0.7	0.7	6000	140	162	162	0.75	0.75	100	100
Current - Output / Channel (mA)	5	4	4	12	90	160	160	36	36	23	23
Voltage - Supply Span Min (V)	1.8	1.8	1.8	3	1.8	2.7	2.7	1.8	1.8	1.8	1.8
Voltage - Supply Span Max (V)	5.5	5.5	5.5	5.5	5	6	6	5.5	5.5	6	6
Operating Temperature (°C)	-55 to 125	-40 to 85	-40 to 105	-40 to 105	-40 to 85	-40 to 125	-40 to 125	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package / Case	8-SOIC (0.154", 3.90mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.173", 4.40mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)	8-SOIC (0.154", 3.90mm)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
Product Status	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active

Engineering Selection Recommendations

Direct CMOS Zero-Drift Alternatives (BU7266F-E2, BU7266SF-E2, BU7486F-E2):

These Rohm Semiconductor devices maintain CMOS architecture and are suitable for applications where the OPA2333AMDREP is unavailable. BU7266F-E2 and BU7266SF-E2 offer ultra-low supply current (0.7 µA) and minimal input bias current (1 pA), making them appropriate for battery-powered and low-power applications. BU7266SF-E2 extends the operating temperature range to -40°C to 105°C compared to BU7266F-E2 (-40°C to 85°C). BU7486F-E2 provides significantly higher slew rate (10 V/µs) and gain bandwidth product (10 MHz), suitable for higher-frequency signal processing applications. All three devices are ROHS3 compliant with MSL 1 rating and Active product status.

General-Purpose Amplifier Alternatives (LMR932F-GE2, LMV358IDT, LMV358IYDT, MAX4471ESA+, MAX4471ESA+T, MCP6002-I/SN, MCP6002T-I/SN):

These devices provide functional substitution with trade-offs in performance characteristics. LMV358IDT and LMV358IYDT (STMicroelectronics) offer extended operating temperature to -40°C to 125°C, matching the OPA2333AMDREP range. LMV358IYDT includes AEC-Q100 automotive qualification. MAX4471ESA+ and MAX4471ESA+T (Analog Devices Inc./Maxim Integrated) deliver ultra-low supply current (0.75 µA) suitable for ultra-low-power applications. MCP6002-I/SN and MCP6002T-I/SN (Microchip Technology) provide 1 MHz gain bandwidth product with 0.6 V/µs slew rate. All substitute parts maintain dual-circuit configuration, rail-to-rail output, and ROHS3 compliance with MSL 1 rating.

Package Compatibility Consideration:

The OPA2333AMDREP uses 8-SOIC package with 0.154" width (3.90mm). Rohm Semiconductor substitutes (BU7266F-E2, BU7266SF-E2, BU7486F-E2, LMR932F-GE2) use 8-SOIC package with 0.173" width (4.40mm). This dimensional difference requires PCB layout verification to ensure mechanical fit. STMicroelectronics (LMV358IDT, LMV358IYDT), Analog Devices Inc./Maxim Integrated (MAX4471ESA+, MAX4471ESA+T), and Microchip Technology (MCP6002-I/SN, MCP6002T-I/SN) devices use the same 8-SOIC 0.154" width package as the OPA2333AMDREP, enabling direct footprint compatibility.

Frequently Asked Questions (FAQ)

Q1: Can BU7266F-E2 or BU7266SF-E2 directly replace OPA2333AMDREP in all applications?

BU7266F-E2 and BU7266SF-E2 maintain the same dual-circuit CMOS architecture and rail-to-rail output as OPA2333AMDREP. However, they exhibit significantly lower slew rate (0.0024 V/µs versus 0.16 V/µs) and gain bandwidth product (4 kHz versus 350 kHz). These devices are suitable for low-frequency, precision measurement applications but not for applications requiring higher bandwidth or faster signal response. Additionally, the package width differs (4.40mm versus 3.90mm), requiring PCB layout verification.

Q2: What is the primary advantage of BU7486F-E2 compared to OPA2333AMDREP?

BU7486F-E2 provides substantially higher slew rate (10 V/µs) and gain bandwidth product (10 MHz), making it suitable for higher-frequency signal processing applications. However, it requires minimum supply voltage of 3 V (versus 1.8 V for OPA2333AMDREP) and draws higher supply current (6 mA versus 17 µA). BU7486F-E2 is appropriate for applications where bandwidth and slew rate are critical performance parameters and supply voltage constraints are not limiting.

Q3: Why do LMV358IDT and LMV358IYDT have higher input offset voltage (100 µV) compared to OPA2333AMDREP (2 µV)?

LMV358IDT and LMV358IYDT are general-purpose amplifiers rather than zero-drift devices. The higher input offset voltage reflects the different amplifier architecture. These devices are suitable for applications where offset voltage is not a critical specification, such as general signal conditioning and buffering. For precision measurement applications requiring ultra-low offset voltage, zero-drift alternatives (BU7266F-E2, BU7266SF-E2) are more appropriate.

Q4: What is the significance of the AEC-Q100 qualification on LMV358IYDT?

LMV358IYDT carries AEC-Q100 automotive qualification, indicating compliance with automotive industry reliability and quality standards. This qualification is relevant only for automotive applications. For non-automotive applications, LMV358IDT (without automotive qualification) provides identical electrical performance at potentially lower cost.

Q5: Are MAX4471ESA+ and MAX4471ESA+T functionally equivalent?

MAX4471ESA+ and MAX4471ESA+T are functionally identical with the same electrical specifications. The difference is packaging: MAX4471ESA+ is supplied in Tube packaging, while MAX4471ESA+T is supplied in Tape & Reel (TR) packaging. Selection depends on assembly process requirements and volume considerations.

Q6: Can MCP6002-I/SN and MCP6002T-I/SN be used interchangeably with OPA2333AMDREP?

MCP6002-I/SN and MCP6002T-I/SN maintain dual-circuit configuration, rail-to-rail output, and compatible 8-SOIC package dimensions (0.154" width). However, they exhibit higher input offset voltage (4.5 mV versus 2 µV) and lower input bias current (1 pA versus 70 pA). These devices are suitable for general-purpose applications but not for precision measurement applications requiring ultra-low offset voltage. The difference in packaging (Tube for MCP6002-I/SN versus Cut Tape for MCP6002T-I/SN) reflects assembly process requirements.

Q7: What supply voltage range compatibility should be verified when selecting a substitute?

The OPA2333AMDREP operates from 1.8 V to 5.5 V. BU7486F-E2 requires minimum 3 V supply, which may not be compatible with 1.8 V or 2.7 V single-cell battery applications. LMV358IDT and LMV358IYDT require minimum 2.7 V supply. All other substitutes (BU7266F-E2, BU7266SF-E2, LMR932F-GE2, MAX4471ESA+, MAX4471ESA+T, MCP6002-I/SN, MCP6002T-I/SN) support the full 1.8 V to 5.5 V range. Circuit design must verify that the selected substitute's supply voltage range encompasses the application's operating requirements.

Q8: How does operating temperature range affect substitute selection?

OPA2333AMDREP operates from -55°C to 125°C. LMV358IDT and LMV358IYDT match this extended range. BU7266SF-E2 extends to 105°C, while BU7266F-E2, LMR932F-GE2, MAX4471ESA+, MAX4471ESA+T, MCP6002-I/SN, and MCP6002T-I/SN are limited to 85°C. Applications requiring operation below -40°C or above 85°C must use OPA2333AMDREP, LMV358IDT, LMV358IYDT, or BU7266SF-E2.

Q9: What is the impact of package width difference (0.154" versus 0.173") on PCB design?

The 0.154" width (3.90mm) OPA2333AMDREP package is narrower than the 0.173" width (4.40mm) Rohm Semiconductor packages. PCB footprints designed for 0.154" width packages cannot accommodate 0.173" width packages without layout modification. Substitutes with matching 0.154" width (LMV358IDT, LMV358IYDT, MAX4471ESA+, MAX4471ESA+T, MCP6002-I/SN, MCP6002T-I/SN) enable direct footprint compatibility without PCB redesign.

Q10: Which substitute offers the lowest power consumption for battery-powered applications?

MAX4471ESA+ and MAX4471ESA+T deliver the lowest supply current at 0.75 µA (x2 channels), followed by BU7266F-E2 and BU7266SF-E2 at 0.7 µA. These devices are appropriate for ultra-low-power applications. OPA2333AMDREP draws 17 µA, which is higher than these ultra-low-power alternatives but lower than general-purpose devices like LMV358IDT (162 µA) and MCP6002-I/SN (100 µA).

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