OMAP3503ECBCA Equivalent & Substitute Parts

Part Overview

The OMAP3503ECBCA is an ARM Cortex-A8 microprocessor from Texas Instruments' OMAP-35xx series, operating at 600MHz with integrated multimedia and NEON SIMD co-processors. This 32-bit, single-core embedded processor is designed for applications requiring LCD display control, USB connectivity, and multimedia processing capabilities.

The OMAP3503ECBCA is classified as obsolete. Identifying equivalent substitute parts is necessary to support legacy system maintenance, design updates, and procurement continuity when original inventory becomes unavailable.

Substiute Parts

OMAP3503ECBCA
Texas InstrumentsIn Stock: 885OMAP3503ECBCA Datasheet
OMAP3503ECBCA
Current Part
OMAP3503ECBBA
Texas InstrumentsIn Stock: 3471OMAP3503ECBBA Datasheet
OMAP3503ECBBA
MFR Recommended

Key Parameters

Parameter Value
Core Processor Architecture ARM Cortex-A8
Number of Cores / Bus Width 1 Core, 32-Bit
Clock Speed 600MHz
Co-Processors / DSP Multimedia, NEON SIMD
RAM Controller LPDDR
Display Interface LCD
USB Support USB 1.x (3), USB 2.0 (1)
I/O Voltage 1.8V, 3.0V
Operating Temperature Range -40°C to 105°C (TJ)
Package Type 515-VFBGA, FCBGA
Mounting Type Surface Mount
Additional Interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the OMAP3503ECBCA is determined by strict equivalence across the following critical parameters:

  • Processor Core & Architecture: ARM Cortex-A8, 1 Core, 32-Bit configuration
  • Clock Speed: 600MHz operation
  • Co-Processor Suite: Multimedia and NEON SIMD capabilities
  • Memory Controller: LPDDR support
  • Interface Set: LCD, USB (1.x and 2.0), I2C, McBSP, McSPI, MMC/SD/SDIO, UART, HDQ/1-Wire
  • Electrical Specifications: 1.8V and 3.0V I/O voltage compatibility
  • Operating Temperature: -40°C to 105°C range
  • Package Classification: 515-VFBGA FCBGA form factor
  • Compliance Standards: ROHS3 and REACH requirements

The OMAP3503ECBBA meets all these criteria and is classified as an equivalent substitute part.

Parameter Comparison

Parameter OMAP3503ECBCA (Main) OMAP3503ECBBA (Substitute)
Manufacturer Texas Instruments Texas Instruments
Series OMAP-35xx OMAP-35xx
Core Processor ARM Cortex-A8 ARM Cortex-A8
Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 600MHz 600MHz
Co-Processors / DSP Multimedia, NEON SIMD Multimedia, NEON SIMD
RAM Controllers LPDDR LPDDR
Display & Interface Controllers LCD LCD
USB USB 1.x (3), USB 2.0 (1) USB 1.x (3), USB 2.0 (1)
Voltage - I/O 1.8V, 3.0V 1.8V, 3.0V
Operating Temperature -40°C to 105°C (TJ) -40°C to 105°C (TJ)
Mounting Type Surface Mount Surface Mount
Package / Case 515-VFBGA, FCBGA 515-VFBGA, FCBGA
Additional Interfaces HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Active

Engineering Selection Recommendations

The OMAP3503ECBBA is a direct functional equivalent to the OMAP3503ECBCA across all specified electrical, mechanical, and interface parameters. Both parts maintain identical processor architecture, clock speed, co-processor capabilities, and peripheral interface configurations.

The primary distinction is product lifecycle status: the OMAP3503ECBCA is obsolete, while the OMAP3503ECBBA is active. This status difference makes the OMAP3503ECBBA the appropriate selection for new designs, system updates, and long-term procurement strategies.

Both parts satisfy ROHS3 compliance and REACH requirements, ensuring regulatory alignment for industrial and commercial applications. The identical MSL rating (3, 168 Hours) indicates equivalent moisture sensitivity handling requirements during assembly and storage.

Frequently Asked Questions (FAQ)

Q: Can the OMAP3503ECBBA directly replace the OMAP3503ECBCA in existing designs?

A: Yes. Both parts are functionally equivalent across all specified parameters: processor core, clock speed, co-processor suite, memory controller, interface set, voltage specifications, and operating temperature range. No design modifications are required for substitution.

Q: What is the significance of the package designation difference (14x14 vs. 12x12)?

A: Both parts use the 515-POP-FCBGA package classification. The dimensional notation (14x14 and 12x12) refers to the physical footprint size. This difference requires PCB layout verification to ensure the substitute part's footprint is compatible with existing board designs.

Q: Why is the OMAP3503ECBCA classified as obsolete?

A: Product obsolescence reflects end-of-life status from the manufacturer. The OMAP3503ECBBA, classified as active, represents the current production equivalent and is the recommended selection for ongoing system support and new implementations.

Q: Are there compliance or certification differences between these parts?

A: No. Both parts maintain identical ROHS3 compliance, REACH unaffected status, and MSL ratings. Regulatory and environmental requirements are equivalent.

Q: What inventory considerations apply to these parts?

A: The OMAP3503ECBCA has 868 pieces in stock (new original). The OMAP3503ECBBA has 3400 pieces in stock (new original), providing greater availability for procurement planning.

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