OMAP3503ECBC Equivalent & Substitute Parts

Part Overview

The OMAP3503ECBC is an ARM® Cortex®-A8 microprocessor from Texas Instruments' OMAP-35xx series, designed for embedded applications requiring 32-bit processing at 600MHz. This device integrates multimedia co-processing capabilities with NEON™ SIMD support, LPDDR RAM controllers, and LCD display interface functionality. The OMAP3503ECBC is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design support and production requirements. Substitute parts must maintain functional equivalence across core processor architecture, performance specifications, and interface capabilities while accommodating packaging variations.

Substiute Parts

OMAP3503ECBC

Texas InstrumentsIn Stock: 1163OMAP3503ECBC Datasheet

Current PartRFQ

OMAP3503ECBB

Texas InstrumentsIn Stock: 1168OMAP3503ECBB Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the OMAP3503ECBC is determined by strict equivalence across the following critical parameters:

Mandatory Equivalence Parameters:

• Core processor architecture (ARM® Cortex®-A8)
• Number of cores and bus width (1 Core, 32-Bit)
• Clock speed (600MHz)
• Co-processor and DSP capabilities (Multimedia, NEON™ SIMD)
• RAM controller type (LPDDR)
• Display interface support (LCD)
• USB interface configuration (USB 1.x × 3, USB 2.0 × 1)
• I/O voltage levels (1.8V, 3.0V)
• Operating temperature range (0°C ~ 90°C)
• Additional interface set (HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART)
• Compliance certifications (ROHS3, REACH Unaffected)
• Moisture sensitivity level (MSL 3)

Allowable Variation Parameters:

• Package physical dimensions (14x14 versus 12x12 FCBGA footprint)
• Product status (obsolete versus active)
• Inventory availability

The OMAP3503ECBB qualifies as a direct substitute based on complete functional and electrical equivalence, with the primary distinction being the package footprint size and active product status.

Parameter Comparison

Engineering Selection Recommendations

The OMAP3503ECBB is a direct functional equivalent to the OMAP3503ECBC and is suitable for substitution in applications where the package footprint accommodation is feasible. Both components maintain identical electrical specifications, interface configurations, and compliance certifications (ROHS3 Compliant, REACH Unaffected).

The primary consideration for component selection is the printed circuit board layout compatibility with the package footprint difference. The OMAP3503ECBC utilizes a 14x14mm FCBGA package, while the OMAP3503ECBB utilizes a 12x12mm FCBGA package. This dimensional variation requires PCB redesign if transitioning between these parts.

The OMAP3503ECBB holds active product status with Texas Instruments, providing superior long-term availability and supply chain stability compared to the obsolete OMAP3503ECBC. For new designs or production continuity, the OMAP3503ECBB is the preferred selection.

Frequently Asked Questions (FAQ)

Q: Can the OMAP3503ECBB be used as a direct replacement for the OMAP3503ECBC without design modifications?

A: The OMAP3503ECBB provides complete functional and electrical equivalence to the OMAP3503ECBC. However, the package footprint differs (12x12mm versus 14x14mm), requiring PCB layout modifications. Pin-to-pin compatibility exists within the 515-VFBGA package family, but the physical die size reduction necessitates PCB redesign.

Q: What are the key electrical parameters that must remain identical between these parts?

A: Core processor architecture, clock speed (600MHz), co-processor capabilities (NEON™ SIMD), RAM controller type (LPDDR), USB interface configuration, I/O voltage levels (1.8V, 3.0V), and operating temperature range (0°C ~ 90°C) must remain identical for functional equivalence.

Q: Are there any compliance or certification differences between these parts?

A: Both the OMAP3503ECBC and OMAP3503ECBB maintain identical compliance status: ROHS3 Compliant, REACH Unaffected, and MSL 3 (168 Hours). No compliance-related restrictions apply to substitution.

Q: Why is the OMAP3503ECBC classified as obsolete?

A: The OMAP3503ECBC has reached end-of-life status with Texas Instruments. The OMAP3503ECBB remains in active production, providing continued availability and support for OMAP-35xx series applications.

Q: What interface capabilities are preserved in the substitute part?

A: Both parts maintain identical interface support: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART, LCD display control, and USB (3× USB 1.x, 1× USB 2.0).

Q: Are there any thermal or power consumption differences between these parts?

A: Both parts operate within the identical temperature range (0°C ~ 90°C junction temperature) and maintain the same I/O voltage specifications (1.8V, 3.0V). No thermal or power consumption variations are specified in the provided parameters.