NTB0102JKZ Equivalent & Substitute Parts

Part Overview

The NTB0102JKZ is a voltage level translator IC manufactured by NXP USA Inc., designed for bidirectional signal translation between different voltage domains. This active component operates with VCCA ranging from 1.2 V to 3.6 V and VCCB from 1.65 V to 5.5 V, supporting data rates up to 100 Mbps across 2 channels in a single circuit configuration. The device is housed in an 8-X2SON (1.35x1) surface mount package and maintains Active product status. Equivalent substitute parts are identified based on matching electrical specifications and compatible packaging requirements for direct circuit board replacement.

Substiute Parts

NTB0102JKZ
NXP USA Inc.In Stock: 741NTB0102JKZ Datasheet
NTB0102JKZ
Current Part
NXB0102GTX
Nexperia USA Inc.In Stock: 7048NXB0102GTX Datasheet
NXB0102GTX
Parametric Equivalent

Key Parameters

Parameter Specification
Translator Type Voltage Level
Channel Type Bidirectional
Number of Circuits 1
Channels per Circuit 2
Voltage - VCCA 1.2 V ~ 3.6 V
Voltage - VCCB 1.65 V ~ 5.5 V
Output Type Tri-State
Data Rate 100 Mbps
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-XFDFN

Substitute Part Grouping Explanation

Substitute parts for the NTB0102JKZ are identified based on the following critical parameters that determine functional equivalence:

  • Translator Type: Voltage Level
  • Channel Type: Bidirectional
  • Number of Circuits: 1
  • Channels per Circuit: 2
  • Voltage - VCCA: 1.2 V ~ 3.6 V
  • Voltage - VCCB: 1.65 V ~ 5.5 V
  • Output Type: Tri-State
  • Data Rate: 100 Mbps
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 8-XFDFN

The NXB0102GTX from Nexperia USA Inc. meets all specified electrical and functional parameters. While the supplier device package designation differs (8-XSON, SOT833-1 at 1.95x1 versus 8-X2SON at 1.35x1), both packages conform to the 8-XFDFN case standard and are mechanically compatible for surface mount PCB assembly.

Parameter Comparison

Parameter NTB0102JKZ (NXP) NXB0102GTX (Nexperia)
Translator Type Voltage Level Voltage Level
Channel Type Bidirectional Bidirectional
Number of Circuits 1 1
Channels per Circuit 2 2
Voltage - VCCA 1.2 V ~ 3.6 V 1.2 V ~ 3.6 V
Voltage - VCCB 1.65 V ~ 5.5 V 1.65 V ~ 5.5 V
Output Type Tri-State Tri-State
Data Rate 100 Mbps 100 Mbps
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 8-XFDFN 8-XFDFN
Product Status Active Active

Engineering Selection Recommendations

Both the NTB0102JKZ and NXB0102GTX are Active status components suitable for production applications. The NXB0102GTX carries ROHS3 compliance, REACH Unaffected status, and MSL rating of 1 (Unlimited), indicating robust environmental and regulatory qualification. Selection between these parts should be based on supply chain availability, lead time requirements, and existing qualification documentation within your organization. The electrical and functional equivalence is complete across all specified parameters.

Frequently Asked Questions (FAQ)

Q: Can NXB0102GTX directly replace NTB0102JKZ on existing PCBs?

A: Yes. Both devices share identical electrical specifications, tri-state output configuration, bidirectional 2-channel architecture, and 8-XFDFN package classification. The physical package dimensions differ slightly (1.95x1 mm versus 1.35x1 mm), but both conform to the same case standard and are compatible with standard surface mount assembly processes.

Q: What are the key parameters that define substitution eligibility?

A: Substitution eligibility is determined by matching voltage ranges (VCCA 1.2-3.6 V, VCCB 1.65-5.5 V), bidirectional channel configuration (1 circuit, 2 channels), tri-state output type, 100 Mbps data rate capability, and -40°C to 125°C operating temperature range. All these parameters are identical between the main part and substitute.

Q: Are there compliance or certification differences between these parts?

A: The NXB0102GTX provides explicit ROHS3 compliance and REACH Unaffected certification documentation. Verify your application's specific regulatory requirements against the compliance status of your selected part.

Q: What is the impact of package dimension differences?

A: The supplier device package dimensions (1.95x1 mm versus 1.35x1 mm) represent minor variations within the 8-XFDFN standard. Both packages are surface mount compatible and suitable for automated PCB assembly. Confirm footprint compatibility with your PCB design files before procurement.

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