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NTB0102JKZ Equivalent & Substitute Parts
Part Overview
The NTB0102JKZ is a voltage level translator IC manufactured by NXP USA Inc., designed for bidirectional signal translation between different voltage domains. This active component operates with VCCA ranging from 1.2 V to 3.6 V and VCCB from 1.65 V to 5.5 V, supporting data rates up to 100 Mbps across 2 channels in a single circuit configuration. The device is housed in an 8-X2SON (1.35x1) surface mount package and maintains Active product status. Equivalent substitute parts are identified based on matching electrical specifications and compatible packaging requirements for direct circuit board replacement.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Translator Type | Voltage Level |
| Channel Type | Bidirectional |
| Number of Circuits | 1 |
| Channels per Circuit | 2 |
| Voltage - VCCA | 1.2 V ~ 3.6 V |
| Voltage - VCCB | 1.65 V ~ 5.5 V |
| Output Type | Tri-State |
| Data Rate | 100 Mbps |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFDFN |
Substitute Part Grouping Explanation
Substitute parts for the NTB0102JKZ are identified based on the following critical parameters that determine functional equivalence:
- Translator Type: Voltage Level
- Channel Type: Bidirectional
- Number of Circuits: 1
- Channels per Circuit: 2
- Voltage - VCCA: 1.2 V ~ 3.6 V
- Voltage - VCCB: 1.65 V ~ 5.5 V
- Output Type: Tri-State
- Data Rate: 100 Mbps
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 8-XFDFN
The NXB0102GTX from Nexperia USA Inc. meets all specified electrical and functional parameters. While the supplier device package designation differs (8-XSON, SOT833-1 at 1.95x1 versus 8-X2SON at 1.35x1), both packages conform to the 8-XFDFN case standard and are mechanically compatible for surface mount PCB assembly.
Parameter Comparison
| Parameter | NTB0102JKZ (NXP) | NXB0102GTX (Nexperia) |
|---|---|---|
| Translator Type | Voltage Level | Voltage Level |
| Channel Type | Bidirectional | Bidirectional |
| Number of Circuits | 1 | 1 |
| Channels per Circuit | 2 | 2 |
| Voltage - VCCA | 1.2 V ~ 3.6 V | 1.2 V ~ 3.6 V |
| Voltage - VCCB | 1.65 V ~ 5.5 V | 1.65 V ~ 5.5 V |
| Output Type | Tri-State | Tri-State |
| Data Rate | 100 Mbps | 100 Mbps |
| Operating Temperature | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 8-XFDFN | 8-XFDFN |
| Product Status | Active | Active |
Engineering Selection Recommendations
Both the NTB0102JKZ and NXB0102GTX are Active status components suitable for production applications. The NXB0102GTX carries ROHS3 compliance, REACH Unaffected status, and MSL rating of 1 (Unlimited), indicating robust environmental and regulatory qualification. Selection between these parts should be based on supply chain availability, lead time requirements, and existing qualification documentation within your organization. The electrical and functional equivalence is complete across all specified parameters.
Frequently Asked Questions (FAQ)
Q: Can NXB0102GTX directly replace NTB0102JKZ on existing PCBs?
A: Yes. Both devices share identical electrical specifications, tri-state output configuration, bidirectional 2-channel architecture, and 8-XFDFN package classification. The physical package dimensions differ slightly (1.95x1 mm versus 1.35x1 mm), but both conform to the same case standard and are compatible with standard surface mount assembly processes.
Q: What are the key parameters that define substitution eligibility?
A: Substitution eligibility is determined by matching voltage ranges (VCCA 1.2-3.6 V, VCCB 1.65-5.5 V), bidirectional channel configuration (1 circuit, 2 channels), tri-state output type, 100 Mbps data rate capability, and -40°C to 125°C operating temperature range. All these parameters are identical between the main part and substitute.
Q: Are there compliance or certification differences between these parts?
A: The NXB0102GTX provides explicit ROHS3 compliance and REACH Unaffected certification documentation. Verify your application's specific regulatory requirements against the compliance status of your selected part.
Q: What is the impact of package dimension differences?
A: The supplier device package dimensions (1.95x1 mm versus 1.35x1 mm) represent minor variations within the 8-XFDFN standard. Both packages are surface mount compatible and suitable for automated PCB assembly. Confirm footprint compatibility with your PCB design files before procurement.
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