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NLAS4685FCT1 Equivalent & Substitute Parts
Part Overview
The NLAS4685FCT1 is a 2-circuit SPDT (Single Pole Double Throw) IC switch manufactured by onsemi, featuring 800mOhm on-state resistance in a 10-Microbump package. This component is classified as obsolete, making equivalent and substitute parts necessary for new designs and ongoing production requirements. The part operates across a 1.8V to 5.5V supply range with 30ns/25ns switching times and is suitable for general-purpose analog signal switching applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | NLAS4685FCT1 |
| Manufacturer | onsemi |
| Product Status | Obsolete |
| Switch Circuit Configuration | SPDT |
| Number of Circuits | 2 |
| Multiplexer/Demultiplexer Circuit | 2:1 |
| On-State Resistance (Max) | 800mOhm |
| Channel-to-Channel Matching (ΔRon) | 60mOhm |
| Supply Voltage Range (V+) | 1.8V ~ 5.5V |
| Switch Time (Ton/Toff) | 30ns / 25ns |
| -3dB Bandwidth | 11.5MHz |
| Operating Temperature Range | -55°C ~ 125°C |
| Package Type | 10-UFBGA, FCBGA (10-Microbump) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS non-compliant |
| MSL Rating | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the NLAS4685FCT1 is determined by the following critical parameters:
- Switch Circuit Configuration: Must be SPDT
- Number of Circuits: Must be 2
- Multiplexer/Demultiplexer Circuit: Must be 2:1
- Supply Voltage Range: Must encompass or match 1.8V ~ 5.5V
- Operating Temperature Range: Must support -55°C ~ 125°C or a subset thereof
- Mounting Type: Surface Mount
- On-State Resistance: Acceptable range determined by application requirements (lower resistance provides better signal integrity)
- Package Compatibility: Physical and electrical compatibility with 10-pin configurations
Substitute parts are grouped into two categories:
Category A - Direct Functional Equivalents (onsemi FSA2259UMX): Same manufacturer, identical circuit topology, different package and performance characteristics.
Category B - Cross-Manufacturer Alternatives (Analog Devices ADG787 series, NXP NX3L4684GM,115): Different manufacturers with superior performance specifications, active product status, and RoHS3 compliance.
Category C - Specialized Application (Texas Instruments TS3USB30ERSWR): USB-specific switch with different circuit topology; limited substitution applicability.
Parameter Comparison
| Parameter | NLAS4685FCT1 | FSA2259UMX | ADG787BCBZ-500RL7 | ADG787BCBZ-REEL | ADG787BCBZ-REEL7 | ADG884BCBZ-REEL7 | NX3L4684GM,115 |
|---|---|---|---|---|---|---|---|
| Manufacturer | onsemi | onsemi | Analog Devices Inc. | Analog Devices Inc. | Analog Devices Inc. | Analog Devices Inc. | NXP USA Inc. |
| Product Status | Obsolete | Obsolete | Active | Active | Active | Active | Active |
| Switch Circuit | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT | SPDT |
| Number of Circuits | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Multiplexer/Demultiplexer | 2:1 | 2:1 | 2:1 | 2:1 | 2:1 | 2:1 | 2:1 |
| On-State Resistance (Max) | 800mOhm | 500mOhm (Typ) | 3Ohm | 3Ohm | 3Ohm | 370mOhm | 750mOhm |
| Channel-to-Channel Matching (ΔRon) | 60mOhm | 80mOhm | 20mOhm | 20mOhm | 20mOhm | 10mOhm | 40mOhm |
| Supply Voltage Range (V+) | 1.8V ~ 5.5V | 1.65V ~ 4.4V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.4V ~ 4.3V |
| Switch Time Ton (Max) | 30ns | 55ns | 19ns | 19ns | 19ns | 50ns | 45ns |
| Switch Time Toff (Max) | 25ns | 30ns | 5ns | 5ns | 5ns | 20ns | 20ns |
| -3dB Bandwidth | 11.5MHz | 50MHz | 145MHz | 145MHz | 145MHz | 18MHz | 20MHz |
| Charge Injection | 20pC | 25pC | 14pC | 14pC | 14pC | 125pC | 50pC |
| Current - Leakage (IS(off)) (Max) | 1µA | 10nA | 50pA (Typ) | 50pA (Typ) | 50pA (Typ) | 200pA (Typ) | 10nA |
| Crosstalk | -81dB @ 100kHz | -100dB @ 100kHz | -110dB @ 1MHz | -110dB @ 1MHz | -110dB @ 1MHz | -120dB @ 100kHz | -90dB @ 100kHz |
| Operating Temperature Range | -55°C ~ 125°C | -40°C ~ 85°C | -25°C ~ 85°C | -25°C ~ 85°C | -20°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 125°C |
| Package / Case | 10-UFBGA, FCBGA | 10-UFQFN | 10-UFBGA, WLCSP | 10-UFBGA, WLCSP | 10-UFBGA, WLCSP | 10-UFBGA, WLCSP | 10-XFQFN |
| RoHS Status | RoHS non-compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
For Designs Requiring Extended Temperature Range (-55°C ~ 125°C):
The NX3L4684GM,115 from NXP supports the full -40°C ~ 125°C range and is the only active substitute meeting the lower temperature boundary of the original specification. This part is RoHS3 compliant and offers 750mOhm on-state resistance with active product status.
For Designs Accepting Reduced Temperature Range (-40°C ~ 85°C):
The Analog Devices ADG787BCBZ series (ADG787BCBZ-500RL7, ADG787BCBZ-REEL, ADG787BCBZ-REEL7) and ADG884BCBZ-REEL7 are active products with RoHS3 compliance. The ADG787 variants offer superior performance with 3Ohm on-state resistance, 145MHz bandwidth, and -110dB crosstalk. The ADG884BCBZ-REEL7 provides 370mOhm resistance with -120dB crosstalk performance.
For RoHS Compliance Requirements:
All substitute parts listed (except the original NLAS4685FCT1) are RoHS3 compliant. FSA2259UMX remains an onsemi option but is also obsolete. Active alternatives from Analog Devices and NXP are recommended for new designs.
For Package Compatibility Considerations:
The original NLAS4685FCT1 uses 10-Microbump (FCBGA) packaging. Substitute parts employ different package types (10-UMLP, 10-WLCSP, 10-XQFN). PCB layout and footprint redesign is required for any substitution.
Frequently Asked Questions (FAQ)
Q: Can FSA2259UMX directly replace NLAS4685FCT1?
A: FSA2259UMX shares the same SPDT 2:1 topology and onsemi manufacturer origin. However, it is also obsolete, operates at a reduced temperature range (-40°C ~ 85°C), and uses a different package (10-UMLP vs. 10-Microbump). The supply voltage range is narrower (1.65V ~ 4.4V vs. 1.8V ~ 5.5V). Substitution is functionally possible but does not resolve obsolescence.
Q: What is the primary difference between ADG787BCBZ variants?
A: ADG787BCBZ-500RL7, ADG787BCBZ-REEL, and ADG787BCBZ-REEL7 are identical in electrical specifications and package type (10-WLCSP). Differences are in packaging format (Cut Tape & Digi-Reel vs. Tape & Reel) and operating temperature range (ADG787BCBZ-REEL7 specifies -20°C ~ 85°C vs. -25°C ~ 85°C for the others). All are active products.
Q: Is the NX3L4684GM,115 suitable for applications requiring the full -55°C lower temperature limit?
A: No. The NX3L4684GM,115 operates from -40°C ~ 125°C. Applications requiring operation below -40°C cannot use this substitute. The original NLAS4685FCT1 specification of -55°C ~ 125°C cannot be fully matched by any active substitute listed.
Q: Why is TS3USB30ERSWR included if it has different circuit topology?
A: TS3USB30ERSWR is a DPDT USB-specific switch with different functional characteristics (1 channel vs. 2 circuits, 10Ohm vs. 800mOhm resistance). It is not a direct substitute for general-purpose analog switching applications. Inclusion reflects its presence in the provided substitute list but is not recommended for NLAS4685FCT1 replacement.
Q: What are the compliance and regulatory considerations for substitution?
A: The original NLAS4685FCT1 is RoHS non-compliant. All active substitute parts (ADG787 series, ADG884BCBZ-REEL7, NX3L4684GM,115) are RoHS3 compliant. All parts listed share identical REACH and ECCN classifications (REACH Unaffected, EAR99). MSL ratings are uniform at Level 1 (Unlimited) across all parts.
Q: Are there package footprint compatibility concerns?
A: Yes. The NLAS4685FCT1 uses 10-Microbump (FCBGA) packaging. Substitute parts use 10-UMLP, 10-WLCSP, or 10-XQFN packages. Each requires different PCB footprints and assembly processes. Mechanical and electrical compatibility must be verified during design transition.
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