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NDS356P P-Channel MOSFET Equivalent & Substitute Parts
Part Overview
The NDS356P is a P-Channel MOSFET manufactured by onsemi, rated for 20V drain-to-source voltage with 1.1A continuous drain current at 25°C. The device is packaged in SOT-23-3 (TO-236-3) surface mount configuration with 500mW power dissipation capability and operates across the temperature range of -55°C to 150°C.
The NDS356P is classified as an obsolete product. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| FET Type | P-Channel | — |
| Drain to Source Voltage (Vdss) | 20 | V |
| Continuous Drain Current (Id) @ 25°C | 1.1 | A |
| Rds On (Max) @ Id, Vgs | 210 | mOhm @ 1.3A, 10V |
| Power Dissipation (Max) | 500 | mW |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | SOT-23-3 | — |
| Vgs (Max) | ±12 | V |
Substitute Part Grouping Explanation
Substitution of the NDS356P is determined by the following critical parameters:
Mandatory Compatibility Criteria:
- FET Type: P-Channel
- Package: SOT-23-3 (TO-236-3, SC-59) surface mount
- Drain to Source Voltage (Vdss): Minimum 20V (equal or higher acceptable)
- Continuous Drain Current (Id): Minimum 1.1A at 25°C (equal or higher acceptable)
- Operating Temperature Range: -55°C to 150°C (minimum requirement)
- Gate Voltage (Vgs Max): ±12V or higher
Substitution Logic: Substitute parts must maintain or exceed the voltage and current ratings of the NDS356P while operating within the same temperature envelope. Parts with higher current ratings, lower on-resistance, or higher voltage ratings provide enhanced performance margins. Package compatibility in SOT-23-3 is mandatory for direct board-level substitution without layout modification.
Parameter Comparison
| Parameter | NDS356P (onsemi) | FDN352AP (Fairchild) | NTR1P02LT3G (onsemi) | BSH205G2R (Nexperia) | IRLML6302TRPBF (Infineon) | IRLML6402TRPBF (Infineon) |
|---|---|---|---|---|---|---|
| FET Type | P-Channel | P-Channel | P-Channel | P-Channel | P-Channel | P-Channel |
| Vdss (V) | 20 | 30 | 20 | 20 | 20 | 20 |
| Id @ 25°C (A) | 1.1 | 1.3 | 1.3 | 2.0 | 0.78 | 3.7 |
| Rds On (Max) (mOhm) | 210 @ 1.3A, 10V | 180 @ 1.3A, 10V | 220 @ 0.75A, 4.5V | 170 @ 2A, 4.5V | 600 @ 0.61A, 4.5V | 65 @ 3.7A, 4.5V |
| Power Dissipation (Max) (mW) | 500 | 500 | 400 | 480 | 540 | 1300 |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | SOT-23-3 | SOT-23-3 | SOT-23-3 | TO-236AB | Micro3™/SOT-23 | Micro3™/SOT-23 |
| Vgs (Max) (V) | ±12 | ±25 | ±12 | ±8 | ±12 | ±12 |
| Product Status | Obsolete | Active | Active | Active | Not For New Designs | Active |
Engineering Selection Recommendations
Primary Substitute: FDN352AP (Fairchild Semiconductor)
The FDN352AP is the recommended direct substitute for the NDS356P. It maintains identical package configuration (SOT-23-3), matches the 20V voltage rating with 30V capability, and exceeds the current requirement with 1.3A rating. The on-resistance is superior at 180mOhm versus 210mOhm. The device is in active production status with full availability. Compliance includes REACH Unaffected and EAR99 classification, matching the original part's regulatory profile.
Secondary Substitute: NTR1P02LT3G (onsemi)
The NTR1P02LT3G is an onsemi alternative offering 1.3A continuous drain current and 20V Vdss rating in SOT-23-3 package. This part maintains the same manufacturer ecosystem as the original NDS356P. The device is RoHS3 compliant and in active production. Note that power dissipation is rated at 400mW, which is lower than the NDS356P's 500mW specification. This part is suitable for applications where thermal margins are adequate.
Alternative Substitute: BSH205G2R (Nexperia USA Inc.)
The BSH205G2R provides enhanced current capability at 2A continuous drain current with superior on-resistance of 170mOhm. The device is packaged in TO-236AB, which is mechanically compatible with SOT-23-3 footprints. This part carries AEC-Q100 automotive qualification and is RoHS3 compliant. The Vgs maximum rating is ±8V, which is lower than the NDS356P's ±12V specification and must be verified for gate drive compatibility in the target application.
Not Recommended: IRLML6302TRPBF (Infineon Technologies)
The IRLML6302TRPBF is classified as "Not For New Designs" by the manufacturer. Although it meets the voltage and temperature requirements, the 780mA continuous drain current falls below the NDS356P's 1.1A specification. The on-resistance of 600mOhm is significantly higher, resulting in greater power dissipation and thermal stress. This part should not be selected for new applications.
Enhanced Performance Option: IRLML6402TRPBF (Infineon Technologies)
The IRLML6402TRPBF is an active production part offering substantial performance improvements over the NDS356P. It provides 3.7A continuous drain current, 65mOhm on-resistance, and 1.3W power dissipation capability. The device is suitable for applications requiring higher current handling or lower thermal dissipation. This part is RoHS3 compliant and in active production status. The higher performance characteristics make it suitable for designs where the NDS356P represents a performance bottleneck.
Frequently Asked Questions (FAQ)
Q: Can the FDN352AP directly replace the NDS356P without PCB modification?
A: Yes. The FDN352AP is packaged in SOT-23-3, which is mechanically and electrically compatible with the NDS356P's footprint. No PCB layout changes are required for direct substitution.
Q: What is the significance of the 30V Vdss rating on the FDN352AP compared to the NDS356P's 20V?
A: The higher voltage rating on the FDN352AP provides additional design margin and protection against voltage transients. It does not affect compatibility with 20V applications. The part will operate correctly in any circuit designed for the NDS356P's 20V specification.
Q: Why is the IRLML6302TRPBF marked "Not For New Designs"?
A: This designation indicates that the manufacturer has discontinued active development and support for this part. While existing inventory may be available, the part is not recommended for new product designs. The NDS356P's 1.1A current requirement exceeds the IRLML6302TRPBF's 780mA rating, making it technically unsuitable regardless of its status.
Q: Is the BSH205G2R's ±8V Vgs maximum rating compatible with the NDS356P's ±12V specification?
A: The BSH205G2R's ±8V Vgs maximum is a lower limit than the NDS356P's ±12V. If the original circuit applies gate voltages exceeding ±8V, the BSH205G2R will not be compatible. Verify the actual gate drive voltage in the target application before selecting this substitute.
Q: What are the thermal implications of selecting the IRLML6402TRPBF over the NDS356P?
A: The IRLML6402TRPBF's 65mOhm on-resistance is significantly lower than the NDS356P's 210mOhm, resulting in reduced power dissipation at equivalent current levels. The 1.3W power dissipation rating provides substantially greater thermal headroom. This part is suitable for applications where thermal management is a design constraint.
Q: Are all substitute parts RoHS3 compliant?
A: The FDN352AP does not specify RoHS status in the provided data. The NTR1P02LT3G, BSH205G2R, IRLML6302TRPBF, and IRLML6402TRPBF are all confirmed RoHS3 compliant. Verify RoHS compliance requirements for your specific application before final part selection.
Q: Can the NTR1P02LT3G's 400mW power dissipation rating be used in place of the NDS356P's 500mW specification?
A: The NTR1P02LT3G's lower power dissipation rating indicates reduced thermal capability. This part is suitable only if the actual power dissipation in the target application remains below 400mW. Thermal analysis of the specific circuit is required to confirm compatibility.
Q: What is the difference between SOT-23-3 and TO-236AB packaging?
A: SOT-23-3 and TO-236AB are mechanically equivalent surface mount packages with identical pin configurations and footprints. The designations reflect different naming conventions used by various manufacturers. Parts in either package are directly interchangeable on the PCB.
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