NDQ48PFQ-7NET Equivalent & Substitute Parts

Part Overview

The NDQ48PFQ-7NET is a DDR4 4Gbit SDRAM memory integrated circuit manufactured by Insignis Technology Corporation. This volatile memory device operates at 1.333 GHz with an 18 ns access time and is housed in a 78-FBGA (7.5x10.6mm) surface mount package. The component is classified as Active product status with full RoHS3 compliance and MSL Level 3 rating.

Substitute parts are identified when equivalent electrical and mechanical parameters align with the original specification, enabling direct replacement in applications where the main part becomes unavailable or when inventory constraints require alternative sourcing.

Substiute Parts

NDQ48PFQ-7NET
Insignis Technology CorporationIn Stock: 949NDQ48PFQ-7NET Datasheet
NDQ48PFQ-7NET
Current Part
AS4C512M8D4A-75BCN
Alliance Memory, Inc.In Stock: 852AS4C512M8D4A-75BCN Datasheet
AS4C512M8D4A-75BCN
Parametric Equivalent

Key Parameters

Parameter Value
Memory Type Volatile DRAM
Technology SDRAM - DDR4
Memory Size 4Gbit
Memory Organization 512M x 8
Memory Interface POD
Clock Frequency 1.333 GHz
Access Time 18 ns
Write Cycle Time 15 ns
Voltage Supply Range 1.14V ~ 1.26V
Operating Temperature 0°C ~ 95°C (TC)
Package Type 78-TFBGA
Package Dimensions 7.5x10.6mm
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the NDQ48PFQ-7NET is determined by strict alignment of the following critical parameters:

Memory Specifications: The substitute part must maintain identical memory size (4Gbit), organization (512M x 8), technology (SDRAM - DDR4), and interface type (POD).

Electrical Characteristics: Clock frequency (1.333 GHz), access time (18 ns), write cycle time (15 ns), and supply voltage range (1.14V ~ 1.26V) must match exactly.

Thermal Performance: Operating temperature range (0°C ~ 95°C TC) must be equivalent or superior.

Package Compatibility: The substitute must use the 78-TFBGA package type with surface mount mounting. Minor dimensional variations in package footprint (7.5x10.6mm versus 7.5x11mm) are acceptable within standard PCB layout tolerances for BGA components.

Compliance Requirements: RoHS3 compliance and MSL Level 3 rating must be maintained.

The AS4C512M8D4A-75BCN from Alliance Memory, Inc. satisfies all substitution criteria and is classified as a parametric equivalent.

Parameter Comparison

Parameter NDQ48PFQ-7NET (Insignis) AS4C512M8D4A-75BCN (Alliance Memory) Match Status
Memory Type Volatile DRAM Volatile DRAM Identical
Technology SDRAM - DDR4 SDRAM - DDR4 Identical
Memory Size 4Gbit 4Gbit Identical
Memory Organization 512M x 8 512M x 8 Identical
Memory Interface POD POD Identical
Clock Frequency 1.333 GHz 1.333 GHz Identical
Access Time 18 ns 18 ns Identical
Write Cycle Time 15 ns 15 ns Identical
Voltage Supply Range 1.14V ~ 1.26V 1.14V ~ 1.26V Identical
Operating Temperature 0°C ~ 95°C (TC) 0°C ~ 95°C (TC) Identical
Package Type 78-TFBGA 78-TFBGA Identical
Package Dimensions 7.5x10.6mm 7.5x11mm Compatible
Mounting Type Surface Mount Surface Mount Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
MSL Rating 3 (168 Hours) 3 (168 Hours) Identical

Engineering Selection Recommendations

The AS4C512M8D4A-75BCN qualifies as a direct parametric equivalent to the NDQ48PFQ-7NET based on complete alignment of electrical, thermal, and mechanical specifications. Both components maintain Active product status and full RoHS3 compliance with identical MSL Level 3 ratings.

The package dimension variance (7.5x10.6mm versus 7.5x11mm) represents a 0.4mm difference in one axis and falls within standard PCB layout tolerances for 78-FBGA components. This minor dimensional difference does not affect electrical performance or thermal characteristics.

Selection between these parts should be based on availability, lead time, and supply chain requirements. Both components are suitable for direct substitution in DDR4 memory applications requiring 4Gbit capacity at 1.333 GHz operation.

Frequently Asked Questions (FAQ)

Q: Can the AS4C512M8D4A-75BCN replace the NDQ48PFQ-7NET in existing designs?

A: Yes. The AS4C512M8D4A-75BCN is a parametric equivalent with identical electrical specifications, operating frequency, access time, and voltage requirements. The 0.4mm package dimension difference is within standard BGA layout tolerances and does not affect PCB compatibility.

Q: Are there differences in compliance or environmental ratings?

A: No. Both components maintain RoHS3 compliance and MSL Level 3 (168 Hours) ratings. Operating temperature ranges are identical at 0°C to 95°C (TC).

Q: What is the significance of the POD memory interface?

A: POD (Pseudo Open Drain) is the interface standard for these DDR4 memory devices. Both the main part and substitute use identical POD interface specifications, ensuring electrical compatibility at the signal level.

Q: Does the package dimension difference affect thermal performance?

A: No. The 0.4mm difference in package length does not impact thermal characteristics. Both components operate within the same thermal envelope and maintain identical access times and power dissipation profiles.

Q: Are inventory levels a consideration for substitution?

A: Inventory status is provided for reference only. The NDQ48PFQ-7NET has 862 pieces in stock, while the AS4C512M8D4A-75BCN has 807 pieces available. Substitution decisions should be based on parametric equivalence and application requirements rather than inventory levels alone.

Q: What is the base product number for the Alliance Memory part?

A: The base product number for the AS4C512M8D4A-75BCN is AS4C512, indicating the 512Mbit core memory architecture used in this 4Gbit configuration.

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