NDB26PFC-4DIT Equivalent & Substitute Parts

Part Overview

The NDB26PFC-4DIT is a DDR2 2Gbit SDRAM memory integrated circuit manufactured by Insignis Technology Corporation. This component operates at 400 MHz with SSTL_18 interface signaling and is housed in an 84-pin FBGA package measuring 8x12.5mm. The part maintains Active product status and is RoHS3 compliant with MSL3 moisture sensitivity rating.

Substitute parts become necessary when the primary component experiences supply constraints, extended lead times, or inventory depletion. Alternative qualified parts with matching electrical and mechanical specifications ensure design continuity and production scheduling flexibility.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Technology	SDRAM - DDR2
Memory Size	2Gbit
Memory Organization	128M x 16
Clock Frequency	400 MHz
Voltage Supply Range	1.7V ~ 1.9V
Operating Temperature Range	-40°C ~ 95°C (TC)
Package Type	84-FBGA (8x12.5mm)
Write Cycle Time	15ns
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the NDB26PFC-4DIT is determined by strict alignment of the following critical parameters:

Memory Capacity & Organization: The substitute must provide 2Gbit total capacity with 128M x 16 organization to maintain address and data bus compatibility.

Technology & Speed Grade: DDR2 SDRAM technology at 400 MHz clock frequency is mandatory. Write cycle time of 15ns must be maintained.

Electrical Specifications: Supply voltage range of 1.7V ~ 1.9V and operating temperature range of -40°C ~ 95°C ensure functional equivalence in target applications.

Package & Footprint: 84-pin FBGA package with 8x12.5mm dimensions ensures mechanical and thermal compatibility with existing PCB layouts.

Compliance & Environmental: RoHS3 compliance and MSL3 rating are required for manufacturing process compatibility.

The W972GG6KB25I from Winbond Electronics satisfies all substitution criteria through matching memory capacity, DDR2 technology, 400 MHz operation, identical voltage specifications, matching temperature range, and equivalent 84-WBGA package footprint.

Parameter Comparison

Parameter	NDB26PFC-4DIT (Insignis)	W972GG6KB25I (Winbond)	Match Status
Memory Type	Volatile DRAM	Volatile DRAM	Match
Technology	SDRAM - DDR2	SDRAM - DDR2	Match
Memory Size	2Gbit	2Gbit	Match
Memory Organization	128M x 16	128M x 16	Match
Clock Frequency	400 MHz	400 MHz	Match
Write Cycle Time	15ns	15ns	Match
Voltage Supply Range	1.7V ~ 1.9V	1.7V ~ 1.9V	Match
Operating Temperature Range	-40°C ~ 95°C (TC)	-40°C ~ 95°C (TC)	Match
Package Type	84-FBGA (8x12.5mm)	84-WBGA (8x12.5mm)	Match
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Match
MSL Rating	3 (168 Hours)	3 (168 Hours)	Match
Product Status	Active	Active	Match

Engineering Selection Recommendations

Both the NDB26PFC-4DIT and W972GG6KB25I maintain Active product status, ensuring continued manufacturer support and supply availability. Both components carry RoHS3 compliance certification, meeting environmental and regulatory requirements for current manufacturing standards.

The W972GG6KB25I presents equivalent functional and electrical characteristics with current inventory availability of 1121 pieces, compared to 654 pieces for the primary part. Both components satisfy identical thermal, electrical, and mechanical requirements for DDR2 SDRAM applications operating at 400 MHz with 2Gbit capacity.

Selection between these parts should be based on procurement lead time, inventory availability, and cost considerations. No functional or reliability differences exist between the two components when applied within specified operating parameters.

Frequently Asked Questions (FAQ)

Q: Can the W972GG6KB25I directly replace the NDB26PFC-4DIT on existing PCBs?

A: Yes. Both components use identical 84-pin FBGA package footprints with 8x12.5mm dimensions. Pin assignments, signal timing, and electrical characteristics are equivalent, enabling direct substitution without PCB redesign.

Q: What is the difference between FBGA and WBGA package designations?

A: FBGA (Fine-pitch Ball Grid Array) and WBGA (Wafer Ball Grid Array) are manufacturing process variations for the same physical package. Both designations refer to 84-pin ball grid arrays with identical 8x12.5mm dimensions and pin spacing. Electrical and mechanical compatibility is maintained.

Q: Are voltage and temperature specifications identical between these parts?

A: Yes. Both components operate within 1.7V to 1.9V supply voltage range and -40°C to 95°C temperature range. Write cycle time and clock frequency specifications are identical at 15ns and 400 MHz respectively.

Q: Do both parts meet current RoHS and MSL requirements?

A: Yes. Both the NDB26PFC-4DIT and W972GG6KB25I are RoHS3 compliant with MSL3 moisture sensitivity rating (168 hours), meeting current manufacturing and environmental standards.

Q: What memory organization do these parts support?

A: Both components provide 2Gbit capacity organized as 128M x 16, supporting identical address bus width and data bus configuration for DDR2 SDRAM applications.

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