NCP1395APG Equivalent & Substitute Parts

Part Overview

The NCP1395APG is an offline switch half-bridge converter IC manufactured by onsemi, designed for isolated power conversion applications with switching frequencies ranging from 50kHz to 1MHz. This component operates as a half-bridge topology controller with integrated soft-start and frequency control features.

The NCP1395APG is classified as obsolete. Due to its discontinued status, identifying functionally equivalent substitute parts is essential for design continuity, system maintenance, and procurement planning. The primary substitute maintains identical electrical specifications while offering alternative packaging options to accommodate different assembly requirements.

Substiute Parts

NCP1395APG

onsemiIn Stock: 926NCP1395APG Datasheet

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NCP1395ADR2G

onsemiIn Stock: 2860NCP1395ADR2G Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the NCP1395APG is determined by equivalence across the following critical parameters:

• Topology classification (Half-Bridge)
• Supply voltage range (9.3V ~ 20V)
• Switching frequency capability (50kHz ~ 1MHz)
• Duty cycle specification (50%)
• Output isolation requirement (Isolated)
• Fault protection features (Over Temperature, Over Voltage)
• Control feature set (Frequency Control, Soft Start)
• Operating temperature range (-40°C ~ 150°C)

The NCP1395ADR2G qualifies as a direct functional equivalent, sharing identical electrical specifications and control characteristics. The primary distinction between these parts is packaging format: the main part uses through-hole 16-DIP configuration, while the substitute employs surface-mount 16-SOIC configuration.

Parameter Comparison

Engineering Selection Recommendations

Both the NCP1395APG and NCP1395ADR2G are classified as obsolete products. Selection between these parts should be based on assembly methodology and board design constraints:

The NCP1395APG (16-DIP through-hole) is suitable for applications utilizing through-hole assembly processes or requiring manual insertion capabilities.

The NCP1395ADR2G (16-SOIC surface-mount) is appropriate for designs employing surface-mount technology (SMT) assembly processes and requiring reduced board footprint.

Both parts maintain identical electrical performance and control characteristics. The choice between them depends solely on manufacturing process compatibility and physical board layout requirements. Both parts carry REACH Unaffected status and ECCN EAR99 classification.

Frequently Asked Questions (FAQ)

Q: Are NCP1395APG and NCP1395ADR2G electrically interchangeable?

A: Yes. Both parts share identical electrical specifications, including supply voltage range, switching frequency capability, duty cycle, output isolation, fault protection, and control features. They differ only in physical packaging and mounting methodology.

Q: What is the primary difference between these substitute parts?

A: The NCP1395APG uses 16-DIP through-hole packaging, while the NCP1395ADR2G uses 16-SOIC surface-mount packaging. This affects board layout, assembly process, and component footprint but not electrical function.

Q: Can I use NCP1395ADR2G as a direct replacement for NCP1395APG on an existing board?

A: Direct board-level replacement is not possible without redesign. The through-hole DIP footprint and surface-mount SOIC footprint are physically incompatible. PCB layout modification and assembly process changes are required.

Q: Are there any compliance or certification differences between these parts?

A: Both parts carry identical compliance status: REACH Unaffected, ECCN EAR99, and HTSUS 8542.39.0001. Both are classified as obsolete products.

Q: What mounting considerations apply to each part?

A: The NCP1395APG requires through-hole insertion and wave soldering or manual soldering. The NCP1395ADR2G requires surface-mount assembly using reflow soldering processes. Board design, assembly equipment, and manufacturing capabilities determine which is appropriate for a given application.