NB4N507ADG Clock/Frequency Synthesizer IC Equivalent & Substitute Parts

Part Overview

The NB4N507ADG is a Clock/Frequency Synthesizer IC manufactured by onsemi, designed for applications requiring precise clock generation and frequency synthesis up to 200MHz. This device features a Phase-Locked Loop (PLL) architecture with both clock and crystal input options, delivering PECL output signals. The NB4N507ADG is currently in Last Time Buy status, making identification of functionally equivalent alternatives essential for design continuity and supply chain planning.

Substiute Parts

NB4N507ADG

onsemiIn Stock: 1326NB4N507ADG Datasheet

Current PartRFQ

NB4N507ADR2G

onsemiIn Stock: 2042NB4N507ADR2G Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the NB4N507ADG is determined by strict equivalence across the following critical parameters:

• Manufacturer & Base Product Number: Both parts must share the same base product number (NB4N507) and manufacturer (onsemi) to ensure identical die and functional specifications
• Package & Pinout: 16-SOIC (0.154", 3.90mm Width) surface mount package with identical pin configuration
• Electrical Specifications: Maximum frequency (200MHz), supply voltage range (3V ~ 5.5V), operating temperature range (-40°C ~ 85°C), PLL architecture, input types (Clock, Crystal), and PECL output must be identical
• Functional Architecture: Single circuit with 1:1 input:output ratio, differential output capability, and integrated divider/multiplier functionality
• Compliance & Certifications: ROHS3 compliance and MSL Level 1 rating must be maintained

The NB4N507ADR2G qualifies as a direct substitute based on identical electrical and mechanical parameters. The only difference is packaging format: the NB4N507ADG is supplied in Tube packaging, while the NB4N507ADR2G is supplied in Tape & Reel (TR) format.

Parameter Comparison

Engineering Selection Recommendations

The NB4N507ADR2G is a direct functional equivalent to the NB4N507ADG. Both parts are manufactured by onsemi with identical electrical specifications, functional architecture, and package geometry. The NB4N507ADR2G maintains full ROHS3 compliance and MSL Level 1 rating, ensuring compatibility with existing design requirements and manufacturing processes.

The primary distinction between these parts is packaging format. The NB4N507ADG is supplied in Tube packaging, while the NB4N507ADR2G is supplied in Tape & Reel (TR) format. This difference affects handling, storage, and automated assembly processes but does not impact electrical performance or functional operation.

Given the Last Time Buy status of the NB4N507ADG, the NB4N507ADR2G is the recommended alternative for continued supply and design continuity. The Active product status of the NB4N507ADR2G ensures long-term availability and manufacturing support.

Frequently Asked Questions (FAQ)

Q: Are the NB4N507ADG and NB4N507ADR2G electrically identical?

A: Yes. Both parts share identical electrical specifications, including maximum frequency (200MHz), supply voltage range (3V ~ 5.5V), operating temperature range (-40°C ~ 85°C), PLL architecture, input types, and PECL output characteristics.

Q: What is the difference between these two part numbers?

A: The only difference is packaging format. The NB4N507ADG is supplied in Tube packaging, while the NB4N507ADR2G is supplied in Tape & Reel (TR) format. The die, pinout, and electrical performance are identical.

Q: Can I use the NB4N507ADR2G as a direct replacement for the NB4N507ADG on my PCB?

A: Yes. Both parts use the 16-SOIC (0.154", 3.90mm Width) package with identical pinout. No PCB modifications are required for substitution.

Q: Does the packaging format affect compliance or certifications?

A: No. Both parts maintain ROHS3 compliance and MSL Level 1 rating regardless of packaging format.

Q: Why is the NB4N507ADG in Last Time Buy status?

A: Last Time Buy status indicates that onsemi is discontinuing this part number. The NB4N507ADR2G, with Active product status, is the recommended alternative for future designs and continued supply.

Q: Are there any design considerations when switching from Tube to Tape & Reel packaging?

A: Packaging format affects supply chain logistics and automated assembly processes. Tape & Reel format is optimized for high-volume automated pick-and-place assembly, while Tube packaging is suitable for lower-volume or manual assembly operations. Electrical and functional performance remain unchanged.