N74F373DB,112 Equivalent & Substitute Parts

Part Overview

The N74F373DB,112 is a D-Type Transparent Latch logic IC manufactured by NXP USA Inc., featuring an 8:8 circuit configuration with tri-state output capability in a 20-SSOP surface mount package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and procurement continuity. Substitute parts must maintain identical electrical performance characteristics and package compatibility to ensure direct replacement capability.

Substiute Parts

N74F373DB,112
NXP USA Inc.In Stock: 1214N74F373DB,112 Datasheet
N74F373DB,112
Current Part
SN74F373DBR
Texas InstrumentsIn Stock: 3183SN74F373DBR Datasheet
SN74F373DBR
Direct
SN74F373DW
Texas InstrumentsIn Stock: 2464SN74F373DW Datasheet
SN74F373DW
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number N74F373DB,112
Manufacturer NXP USA Inc.
Logic Type D-Type Transparent Latch
Circuit Configuration 8:8
Output Type Tri-State
Package / Case 20-SSOP (0.209", 5.30mm Width)
Voltage - Supply 4.5V ~ 5.5V
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Current - Output High, Low 3mA, 24mA
Independent Circuits 1
RoHS Status ROHS3 Compliant
Product Status Obsolete

Substitute Part Grouping Explanation

Substitute parts for the N74F373DB,112 are qualified based on the following critical parameters that determine functional and physical compatibility:

Electrical Equivalence Criteria:

  • Logic Type: D-Type Transparent Latch
  • Circuit Configuration: 8:8
  • Output Type: Tri-State
  • Supply Voltage Range: 4.5V ~ 5.5V
  • Output Current Specifications: 3mA (High), 24mA (Low)
  • Operating Temperature Range: 0°C ~ 70°C

Physical Compatibility Criteria:

  • Package Type: 20-pin surface mount (SSOP or SOIC variants)
  • Mounting Type: Surface Mount
  • Pin count and signal routing: Maintained across all qualified substitutes

Compliance Criteria:

  • RoHS3 Compliance
  • REACH Unaffected status

Substitutes are grouped into two categories: direct pin-compatible replacements in identical 20-SSOP packaging, and functionally equivalent alternatives in related 20-pin surface mount packages (20-SOIC) that require PCB layout accommodation.

Parameter Comparison

Parameter N74F373DB,112 (NXP) SN74F373DBR (TI) SN74F373DW (TI)
Manufacturer NXP USA Inc. Texas Instruments Texas Instruments
Logic Type D-Type Transparent Latch D-Type Transparent Latch D-Type Transparent Latch
Circuit Configuration 8:8 8:8 8:8
Output Type Tri-State Tri-State Tri-State
Package / Case 20-SSOP (0.209", 5.30mm) 20-SSOP (0.209", 5.30mm) 20-SOIC (0.295", 7.50mm)
Voltage - Supply 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C 0°C ~ 70°C
Current - Output High, Low 3mA, 24mA 3mA, 24mA 3mA, 24mA
Independent Circuits 1 1 1
Delay Time - Propagation 2ns 8.6ns 8.6ns
Product Status Obsolete Active Last Time Buy
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Packaging Format Bulk Tape & Reel (TR) Tube

Engineering Selection Recommendations

SN74F373DBR (Texas Instruments) is the primary substitute for direct replacement applications. This part maintains identical 20-SSOP packaging, ensuring zero PCB layout modifications. Texas Instruments' active product status provides long-term availability and supply chain stability. All electrical parameters, compliance certifications (ROHS3, REACH Unaffected), and functional specifications align with the N74F373DB,112. The propagation delay differential (8.6ns vs. 2ns) must be evaluated within system timing margins.

SN74F373DW (Texas Instruments) serves as a secondary substitute for applications where package footprint flexibility exists. This part utilizes 20-SOIC packaging, requiring PCB layout redesign and footprint modification. Texas Instruments' Last Time Buy status indicates limited future availability; procurement should prioritize SN74F373DBR for new designs. Electrical performance and compliance specifications remain equivalent to the primary substitute.

Selection between these substitutes depends on PCB design constraints and supply chain requirements. For direct replacement without layout modification, SN74F373DBR is the appropriate choice. For designs accommodating package changes, SN74F373DW provides an alternative with acknowledged availability limitations.

Frequently Asked Questions (FAQ)

Q: Can SN74F373DBR replace N74F373DB,112 without PCB modifications? A: Yes. SN74F373DBR maintains identical 20-SSOP packaging dimensions and pin configuration, enabling direct PCB substitution without layout changes.

Q: What is the significance of the propagation delay difference (2ns vs. 8.6ns)? A: The N74F373DB,112 specifies 2ns propagation delay, while both Texas Instruments substitutes specify 8.6ns. System timing analysis must confirm that the increased delay does not violate setup/hold time requirements or system clock margins. This parameter difference is the primary technical consideration for substitution feasibility.

Q: Why is SN74F373DW listed as Last Time Buy? A: Last Time Buy status indicates Texas Instruments has announced end-of-life for this product. Existing inventory is available, but future procurement will not be possible. New designs should prioritize SN74F373DBR (Active status) for long-term supply assurance.

Q: Are all substitutes RoHS3 compliant? A: Yes. N74F373DB,112, SN74F373DBR, and SN74F373DW are all ROHS3 Compliant with REACH Unaffected status, meeting current environmental and regulatory requirements.

Q: What packaging format differences exist between substitutes? A: N74F373DB,112 is supplied in bulk format. SN74F373DBR is supplied in Tape & Reel (TR) format for automated assembly. SN74F373DW is supplied in Tube format. These differences affect procurement and assembly processes but do not impact electrical functionality.

Q: Can SN74F373DW be used in existing PCBs designed for N74F373DB,112? A: No. SN74F373DW uses 20-SOIC packaging (0.295" width) versus the required 20-SSOP (0.209" width). PCB footprint redesign is mandatory. SN74F373DBR is the appropriate choice for existing PCB designs.

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