MX30LF1G18AC-TI Equivalent & Substitute Parts

Part Overview

The MX30LF1G18AC-TI is a 1Gbit parallel NAND Flash memory IC manufactured by Macronix, housed in a 48-TSOP package. This device is classified as Not For New Designs, indicating it has reached end-of-life status. The part operates across a supply voltage range of 2.7V to 3.6V with an access time of 20 ns and is ROHS3 compliant with MSL 3 rating.

Due to its discontinued design status, equivalent substitute parts are necessary for ongoing production support, legacy system maintenance, and component sourcing flexibility.

Key Parameters

Parameter	Value
Memory Size	1Gbit
Memory Organization	128M x 8
Memory Interface	Parallel
Memory Format	FLASH
Technology	FLASH - NAND
Package / Case	48-TFSOP (0.724", 18.40mm Width)
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Write Cycle Time - Word, Page	20ns
Access Time	20 ns
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the MX30LF1G18AC-TI is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

Memory Size: 1Gbit
Memory Organization: 128M x 8
Memory Interface: Parallel
Memory Format: FLASH
Technology: FLASH - NAND
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 3 (168 Hours)

Allowable Variation Parameters:

Write Cycle Time - Word, Page: Up to 25ns (original: 20ns)
Access Time: Up to 25ns (original: 20ns)
Technology Subtype: FLASH - NAND (SLC) acceptable
Product Status: Active preferred over Not For New Designs

The identified substitute parts meet all mandatory parameters while maintaining electrical and mechanical compatibility with the original MX30LF1G18AC-TI specification.

Parameter Comparison

Parameter	MX30LF1G18AC-TI	MX30LF1G28AD-TI	W29N01HVSINF
Manufacturer	Macronix	Macronix	Winbond Electronics
Memory Size	1Gbit	1Gbit	1Gbit
Memory Organization	128M x 8	128M x 8	128M x 8
Memory Interface	Parallel	Parallel	Parallel
Technology	FLASH - NAND	FLASH - NAND (SLC)	FLASH - NAND (SLC)
Write Cycle Time - Word, Page	20ns	20ns	25ns
Access Time	20 ns	Not specified	25 ns
Voltage - Supply	2.7V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Package / Case	48-TFSOP (0.724", 18.40mm Width)	48-TFSOP (0.724", 18.40mm Width)	48-TFSOP (0.724", 18.40mm Width)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Product Status	Not For New Designs	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

MX30LF1G28AD-TI (Macronix): This substitute maintains identical electrical specifications to the original MX30LF1G18AC-TI while offering Active product status. The MX30LF1G28AD-TI is manufactured by the same supplier and carries ROHS3 compliance with equivalent MSL rating. This part is the primary substitute for direct replacement in legacy designs.

W29N01HVSINF (Winbond Electronics): This alternative meets all mandatory electrical and mechanical parameters with a maximum write cycle time of 25ns and access time of 25ns, both within acceptable tolerance for parallel NAND Flash applications. The W29N01HVSINF is manufactured by Winbond Electronics and maintains Active product status with ROHS3 compliance and identical MSL rating. This part is suitable for applications where timing margins accommodate the 5ns increase in access and write cycle times.

Both substitute parts are ROHS3 compliant and carry MSL 3 ratings, ensuring compatibility with standard PCB assembly processes and environmental requirements.

Frequently Asked Questions (FAQ)

Q: Can MX30LF1G28AD-TI directly replace MX30LF1G18AC-TI in existing designs?

A: Yes. The MX30LF1G28AD-TI maintains identical electrical specifications, package dimensions, and pin configuration. No circuit modifications are required for direct substitution.

Q: What is the difference between MX30LF1G28AD-TI and W29N01HVSINF?

A: Both parts are functionally equivalent 1Gbit parallel NAND Flash devices in 48-TSOP packages. The primary difference is the write cycle time and access time: MX30LF1G28AD-TI operates at 20ns, while W29N01HVSINF operates at 25ns. Both values are within acceptable operating parameters for parallel NAND Flash memory applications. Manufacturer differs: Macronix versus Winbond Electronics.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. MX30LF1G28AD-TI and W29N01HVSINF are both ROHS3 compliant with MSL 3 ratings, matching the original MX30LF1G18AC-TI specification.

Q: Can W29N01HVSINF be used if timing is critical?

A: W29N01HVSINF has a maximum access time of 25ns compared to 20ns for the original part. Applications with timing margins of 5ns or greater can accommodate this substitute. Applications with tighter timing requirements should use MX30LF1G28AD-TI.

Q: Are there any package or mounting differences between these parts?

A: No. All three parts use identical 48-TFSOP packaging (0.724", 18.40mm Width) with surface mount configuration. PCB footprints and assembly processes remain unchanged.

Q: What is the inventory status of these substitute parts?

A: MX30LF1G28AD-TI has 21,954 units in stock. W29N01HVSINF has 28,900 units in stock. Both are available as new original components.

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