MX25L3236DM2I-10G Equivalent & Substitute Parts

Part Overview

The MX25L3236DM2I-10G is a 32Mbit NOR Flash memory IC manufactured by Macronix, featuring SPI interface operation at 104 MHz. This component is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The part is housed in an 8-SOP package and operates across the industrial temperature range of -40°C to 85°C with a supply voltage range of 2.7V to 3.6V.

Key Parameters

Parameter	Value
Memory Size	32Mbit
Memory Format	FLASH - NOR
Memory Interface	SPI
Clock Frequency	104 MHz
Voltage Supply Range	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Package Type	8-SOIC / 8-SOP
Write Cycle Time (Page)	5ms
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the MX25L3236DM2I-10G is determined by the following critical parameters: 32Mbit memory capacity, NOR Flash technology, SPI-compatible interface, voltage supply compatibility (2.7V ~ 3.6V minimum), operating temperature range (-40°C ~ 85°C), and package form factor. The three qualified substitute parts meet these core requirements with variations in interface capability, clock frequency, and package configuration.

MX25L3233FM2I-08G qualifies as a direct substitute with enhanced SPI-Quad I/O capability and higher clock frequency (133 MHz), while maintaining identical memory capacity and voltage specifications. Package compatibility is preserved in 8-SOP form factor.

MX25L3255EXCI-10G provides substitution through identical electrical specifications and clock frequency matching, with the primary distinction being a 24-CSPBGA package configuration instead of 8-SOP, suitable for applications where package footprint differs.

W25Q32JVSSIQ from Winbond Electronics qualifies as a cross-manufacturer substitute with SPI-Quad I/O interface, 133 MHz operation, and 8-SOIC package compatibility, maintaining voltage and temperature specifications.

Parameter Comparison

Parameter	MX25L3236DM2I-10G	MX25L3233FM2I-08G	MX25L3255EXCI-10G	W25Q32JVSSIQ
Manufacturer	Macronix	Macronix	Macronix	Winbond Electronics
Memory Size	32Mbit	32Mbit	32Mbit	32Mbit
Memory Format	FLASH - NOR	FLASH - NOR	FLASH - NOR	FLASH - NOR
Memory Interface	SPI	SPI - Quad I/O	SPI	SPI - Quad I/O
Clock Frequency	104 MHz	133 MHz	104 MHz	133 MHz
Voltage Supply	2.7V ~ 3.6V	2.65V ~ 3.6V	2.7V ~ 3.6V	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Package / Case	8-SOIC (0.209", 5.30mm Width)	8-SOIC (0.209", 5.30mm Width)	24-TBGA, CSPBGA	8-SOIC (0.209", 5.30mm Width)
Product Status	Obsolete	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

MX25L3233FM2I-08G is recommended for applications requiring enhanced performance through Quad I/O capability and 133 MHz operation while maintaining the same 8-SOP package footprint. This part is actively manufactured and verified as programmable, providing long-term supply assurance.

MX25L3255EXCI-10G is suitable for designs where package form factor can accommodate 24-CSPBGA configuration. This part maintains identical electrical performance to the original MX25L3236DM2I-10G with active product status and ROHS3 compliance.

W25Q32JVSSIQ provides cross-manufacturer substitution with Quad I/O enhancement and 133 MHz operation in an 8-SOIC package. This part offers the highest inventory availability and verified programmability status, supporting high-volume production requirements.

All three substitute parts maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory compatibility with the original specification.

Frequently Asked Questions (FAQ)

Q: Can MX25L3233FM2I-08G replace MX25L3236DM2I-10G in existing designs?

A: Yes. Both parts share identical 32Mbit capacity, NOR Flash technology, voltage supply range (2.7V ~ 3.6V minimum), operating temperature range, and 8-SOP package form factor. The MX25L3233FM2I-08G provides enhanced Quad I/O interface and 133 MHz clock frequency, which are backward compatible with SPI-only applications.

Q: What is the primary difference between MX25L3255EXCI-10G and the original part?

A: The MX25L3255EXCI-10G maintains identical electrical specifications and 104 MHz clock frequency but uses a 24-CSPBGA package instead of 8-SOP. This substitution requires PCB layout redesign and is suitable only for applications where package footprint can be modified.

Q: Is W25Q32JVSSIQ compatible with designs using MX25L3236DM2I-10G?

A: Yes. W25Q32JVSSIQ is a cross-manufacturer substitute with identical 32Mbit capacity, voltage supply range, operating temperature, and 8-SOIC package compatibility. The Quad I/O interface is backward compatible with SPI-only firmware implementations.

Q: What are the write cycle time differences among these parts?

A: MX25L3236DM2I-10G and MX25L3255EXCI-10G specify 5ms page write cycle time. MX25L3233FM2I-08G offers faster 1.2ms page write cycle time. W25Q32JVSSIQ specifies 3ms page write cycle time. These differences do not affect functional compatibility but may impact programming speed in production environments.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All three substitute parts—MX25L3233FM2I-08G, MX25L3255EXCI-10G, and W25Q32JVSSIQ—are ROHS3 compliant and REACH unaffected, matching the original part's regulatory status.

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