MURS1G-TP Equivalent & Substitute Parts

Part Overview

The MURS1G-TP is a general-purpose fast recovery rectifier diode manufactured by Micro Commercial Co, rated for 400 V DC reverse voltage and 1 A average rectified current in a surface mount DO-214AC (SMA) package. This component is classified as Active product status and is RoHS3 compliant. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to component availability, supply chain considerations, or design flexibility within the same application parameters.

Substiute Parts

MURS1G-TP

Micro Commercial CoIn Stock: 1015MURS1G-TP Datasheet

Current PartRFQ

ES1G

Good-Ark SemiconductorIn Stock: 415377ES1G Datasheet

Parametric EquivalentRFQ

ES1G-13-F

Diodes IncorporatedIn Stock: 420370ES1G-13-F Datasheet

Parametric EquivalentRFQ

ES1G-HF

Comchip TechnologyIn Stock: 4706ES1G-HF Datasheet

Parametric EquivalentRFQ

ES1GWG_R1_00001

Panjit International Inc.In Stock: 2498ES1GWG_R1_00001 Datasheet

Parametric EquivalentRFQ

ES1G_R1_00001

Panjit International Inc.In Stock: 92755ES1G_R1_00001 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the MURS1G-TP are qualified based on the following electrical and mechanical criteria:

Critical Matching Parameters:

• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 1 A
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
• Package / Case: DO-214AC, SMA
• Mounting Type: Surface Mount
• RoHS Status: ROHS3 Compliant
• Moisture Sensitivity Level (MSL): 1 (Unlimited)

Allowable Parameter Variations: Substitute parts may differ in the following parameters while maintaining functional equivalence:

• Voltage - Forward (Vf) (Max) @ If: ±0.05 V tolerance
• Reverse Recovery Time (trr): within fast recovery classification
• Current - Reverse Leakage @ Vr: within specified range
• Capacitance @ Vr, F: device-specific variation
• Operating Temperature - Junction: minimum -55°C and maximum ≥ 125°C
• Product Status: Active or Not For New Designs (with compliance verification)

All substitute parts maintain DO-214AC (SMA) surface mount package compatibility and are suitable for direct PCB footprint replacement.

Parameter Comparison

Engineering Selection Recommendations

Primary Selection (Active Status, Full Compatibility):

ES1G-13-F (Diodes Incorporated) and ES1G-HF (Comchip Technology) are recommended as primary substitutes. Both parts maintain Active product status, match the MURS1G-TP forward voltage specification at 1.25 V @ 1 A, and support the full operating temperature range of -55°C to 150°C. ES1G-13-F is available in Cut Tape (CT) packaging, while ES1G-HF is supplied in Tape & Reel (TR) format matching the original part packaging.

ES1G_R1_00001 (Panjit International Inc.) is an Active product with superior reverse leakage characteristics (1 µA @ 400 V versus 5 µA @ 400 V), matching forward voltage and temperature range specifications. This part is suitable for applications where lower leakage current provides performance benefits.

Secondary Selection (Active Status, Minor Parameter Variation):

ES1G (Good-Ark Semiconductor) is an Active product with equivalent electrical performance across all critical parameters. The forward voltage specification of 1.3 V @ 1 A represents a 0.05 V increase relative to the MURS1G-TP. The operating temperature range extends to 125°C maximum, which is 25°C lower than the original part. This part is suitable for applications operating within the -55°C to 125°C range.

Not Recommended for New Designs:

ES1GWG_R1_00001 (Panjit International Inc.) carries a "Not For New Designs" product status designation. While electrically equivalent, this part is not suitable for new design implementations.

Frequently Asked Questions (FAQ)

Q: Can ES1G substitute for MURS1G-TP in all applications?

A: ES1G is electrically equivalent with one exception: the maximum operating junction temperature is 125°C compared to 150°C for MURS1G-TP. ES1G is suitable for applications with maximum junction temperatures not exceeding 125°C. The forward voltage specification of 1.3 V @ 1 A is 0.05 V higher than the MURS1G-TP specification of 1.25 V @ 1 A.

Q: What is the difference between ES1G-13-F and ES1G-HF?

A: Both parts are electrically equivalent with identical forward voltage (1.25 V @ 1 A) and operating temperature range (-55°C to 150°C). The primary difference is packaging: ES1G-13-F is supplied in Cut Tape (CT) format, while ES1G-HF is supplied in Tape & Reel (TR) format. Reverse recovery time differs slightly (25 ns for ES1G-13-F versus 35 ns for ES1G-HF), both within fast recovery classification.

Q: Are all substitute parts compatible with the MURS1G-TP PCB footprint?

A: Yes. All substitute parts use the DO-214AC (SMA) surface mount package with identical mechanical dimensions and pin configuration. Direct PCB footprint replacement is supported for all listed substitutes.

Q: What does "Not For New Designs" mean for ES1GWG_R1_00001?

A: "Not For New Designs" indicates that the manufacturer has designated this part as obsolete or end-of-life for new product development. While the part remains electrically equivalent and available in inventory, it is not recommended for incorporation into new designs. Use of this part should be limited to legacy product support or maintenance applications.

Q: How do reverse recovery time differences affect circuit performance?

A: The MURS1G-TP specifies 25 ns reverse recovery time, while ES1G, ES1G-HF, ES1G_R1_00001, and ES1GWG_R1_00001 specify 35 ns. Both values fall within the fast recovery classification (≤ 500ns, > 200mA). The 10 ns difference may affect switching characteristics in high-frequency applications but does not prevent functional substitution in standard rectification circuits.

Q: What is the significance of reverse leakage current differences?

A: MURS1G-TP and ES1G specify 5 µA @ 400 V reverse leakage, while ES1G_R1_00001 and ES1GWG_R1_00001 specify 1 µA @ 400 V. Lower reverse leakage current reduces standby power dissipation and improves circuit efficiency. The 4 µA difference is application-dependent; high-impedance circuits benefit from lower leakage specifications.

Q: Can packaging format (Cut Tape vs. Tape & Reel) affect substitution decisions?

A: Packaging format affects handling, storage, and assembly processes but does not impact electrical or mechanical compatibility. Cut Tape (CT) format is suitable for manual assembly or small-volume production. Tape & Reel (TR) format is optimized for automated pick-and-place assembly. Selection should align with manufacturing process requirements.

Q: Is RoHS3 compliance maintained across all substitute parts?

A: Yes. All listed substitute parts carry ROHS3 Compliant certification, matching the MURS1G-TP compliance status. Moisture Sensitivity Level (MSL) is 1 (Unlimited) for all parts, indicating no special moisture handling requirements during storage or assembly.