MTI-8-0I-T Equivalent & Substitute Parts

Part Overview

The MTI-8-0I-T is a 9-axis motion sensor module manufactured by Xsens Technologies BV, integrating accelerometer, gyroscope, and magnetometer functionality. This component operates as an RTK GNSS/INS module with multiple communication interfaces (I2C, SPI, UART) and is housed in a 28-SMD surface-mount package. The MTI-8-0I-T is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production continuity.

Substiute Parts

MTI-8-0I-T

Xsens Technologies BVIn Stock: 920MTI-8-0I-T Datasheet

Current PartRFQ

MTI-8-5A-T

Xsens Technologies BVIn Stock: 935MTI-8-5A-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the MTI-8-0I-T is based on functional equivalence across the following critical parameters:

Functional Compatibility Criteria:

• Sensor Type: Accelerometer, Gyroscope, Magnetometer configuration
• Output Interfaces: I2C, SPI, UART communication protocols
• Operating Temperature Range: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Moisture Sensitivity Level: MSL 3 (168 Hours)
• Regulatory Compliance: REACH Unaffected status

The MTI-8-5A-T meets all functional requirements and maintains compatibility across these parameters. Package configuration differs (28-LCC versus 28-SMD Module), requiring PCB layout verification during integration.

Parameter Comparison

Engineering Selection Recommendations

MTI-8-5A-T Selection Basis:

The MTI-8-5A-T is the manufacturer-recommended substitute for the obsolete MTI-8-0I-T. This substitution is supported by:

1. Functional Equivalence: Both components provide identical sensor functionality (9-axis accelerometer, gyroscope, magnetometer) with matching communication interfaces (I2C, SPI, UART).

2. Environmental Compatibility: Operating temperature range (-40°C ~ 85°C) and moisture sensitivity level (MSL 3, 168 Hours) are identical, ensuring equivalent performance in specified environmental conditions.

3. Regulatory Compliance: Both parts maintain REACH Unaffected status and identical ECCN classification (7A994), confirming equivalent regulatory standing.

4. Product Status: The MTI-8-5A-T is classified as Active, ensuring ongoing availability and manufacturer support, contrasting with the obsolete status of the MTI-8-0I-T.

5. Package Consideration: The MTI-8-5A-T uses a 28-LCC package (28-PLCC supplier device package) versus the 28-SMD Module of the original part. PCB footprint and layout modifications are required during integration.

Frequently Asked Questions (FAQ)

Q: Can the MTI-8-5A-T directly replace the MTI-8-0I-T without PCB modifications?

A: The MTI-8-5A-T provides functional equivalence in sensor capability and communication interfaces. However, package configuration differs (28-LCC versus 28-SMD Module), requiring PCB footprint redesign and layout verification.

Q: Are the communication protocols identical between these parts?

A: Yes. Both the MTI-8-0I-T and MTI-8-5A-T support I2C, SPI, and UART output interfaces, ensuring software and firmware compatibility.

Q: What is the significance of the MTI-8-0I-T being obsolete?

A: Obsolete status indicates the part is no longer manufactured or supported by Xsens Technologies BV. The MTI-8-5A-T, classified as Active, provides continued availability and manufacturer support for equivalent applications.

Q: Are environmental operating conditions the same?

A: Yes. Both components operate across the identical temperature range (-40°C ~ 85°C) and share the same moisture sensitivity level (MSL 3, 168 Hours), confirming equivalent environmental performance specifications.

Q: Do regulatory certifications differ between these parts?

A: No. Both parts maintain REACH Unaffected status and identical ECCN classification (7A994), confirming equivalent regulatory compliance.

Q: What packaging differences exist?

A: The MTI-8-0I-T uses a 28-SMD Module package, while the MTI-8-5A-T uses a 28-LCC package (28-PLCC supplier device package). This difference requires PCB layout and footprint modifications during component substitution.