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MTFC8GLWDQ-3L AAT Equivalent & Substitute Parts
Part Overview
The MTFC8GLWDQ-3L AAT is a 64Gbit NAND Flash memory IC in MMC interface format, manufactured by Micron Technology Inc. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement. The part operates across industrial temperature ranges (-40°C to 105°C) and is suitable for embedded storage applications requiring high-capacity non-volatile memory in a compact 100-LBGA package footprint.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | MTFC8GLWDQ-3L AAT |
| Memory Size | 64Gbit |
| Memory Organization | 8G x 8 |
| Memory Interface | MMC |
| Technology | FLASH - NAND |
| Package Type | 100-LBGA (14x18) |
| Voltage Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the MTFC8GLWDQ-3L AAT is determined by the following critical parameters:
- Memory Capacity: 64Gbit (non-negotiable)
- Memory Organization: 8G x 8 (non-negotiable)
- Memory Interface: MMC (non-negotiable)
- Technology: FLASH - NAND (non-negotiable)
- Operating Temperature Range: -40°C ~ 105°C (non-negotiable)
- Supply Voltage: 2.7V ~ 3.6V (non-negotiable)
- Mounting Type: Surface Mount (non-negotiable)
- RoHS Compliance: ROHS3 Compliant (non-negotiable)
- Base Product Number: MTFC8 (manufacturer series alignment)
Package variations (LBGA vs. TBGA) are permissible substitutes provided all electrical and functional parameters remain equivalent and the physical footprint is compatible with the target PCB design.
Parameter Comparison
| Parameter | MTFC8GLWDQ-3L AAT (Main) | MTFC8GAMALNA-AAT (Substitute) | Compatibility |
|---|---|---|---|
| Manufacturer | Micron Technology Inc. | Micron Technology Inc. | Match |
| Memory Size | 64Gbit | 64Gbit | Match |
| Memory Organization | 8G x 8 | 8G x 8 | Match |
| Memory Interface | MMC | MMC | Match |
| Technology | FLASH - NAND | FLASH - NAND | Match |
| Operating Temperature | -40°C ~ 105°C | -40°C ~ 105°C | Match |
| Mounting Type | Surface Mount | Surface Mount | Match |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Match |
| Package Type | 100-LBGA (14x18) | 100-TBGA (14x18) | Footprint Compatible |
| Moisture Sensitivity Level | 3 (168 Hours) | 2 (1 Year) | Substitute Superior |
| Product Status | Obsolete | Active | Substitute Active |
Engineering Selection Recommendations
The MTFC8GAMALNA-AAT is a direct functional equivalent to the MTFC8GLWDQ-3L AAT. Both components share identical electrical specifications, memory capacity, interface protocol, and operating parameters. The primary distinction is the package variant: LBGA (Land Grid Array) versus TBGA (Tape Ball Grid Array), both maintaining the same 14x18mm footprint.
The MTFC8GAMALNA-AAT offers additional advantages: it maintains active product status with Micron Technology Inc., ensuring continued availability and supply chain stability. The improved moisture sensitivity level (MSL 2 versus MSL 3) provides extended shelf life and reduced handling constraints during manufacturing and storage.
Selection of the MTFC8GAMALNA-AAT is appropriate for new designs and legacy system support where component replacement is required. Both parts maintain ROHS3 compliance and identical ECCN/HTSUS classifications, ensuring regulatory and export compliance equivalence.
Frequently Asked Questions (FAQ)
Q: Can the MTFC8GAMALNA-AAT directly replace the MTFC8GLWDQ-3L AAT in existing designs?
A: Yes. Both components are electrically and functionally identical. The package variant change from LBGA to TBGA does not affect electrical performance. PCB layout compatibility must be verified to confirm the ball grid pattern is compatible with existing solder pads.
Q: What is the difference between LBGA and TBGA packaging?
A: LBGA (Land Grid Array) and TBGA (Tape Ball Grid Array) are both ball grid array packages with identical footprints (14x18mm, 100 balls). The primary difference is the substrate material and manufacturing process. Both are surface-mount packages suitable for automated assembly.
Q: Why is the MTFC8GLWDQ-3L AAT classified as obsolete?
A: Micron Technology Inc. has discontinued this part number in favor of newer alternatives. The MTFC8GAMALNA-AAT represents the active equivalent in the product line.
Q: Are there any voltage or temperature differences between these parts?
A: No. Both components operate at 2.7V to 3.6V supply voltage and function across the -40°C to 105°C temperature range. All electrical specifications are identical.
Q: What does MSL 2 versus MSL 3 mean for component handling?
A: Moisture Sensitivity Level (MSL) indicates the maximum time a component can be exposed to ambient conditions before requiring baking. MSL 3 allows 168 hours of exposure; MSL 2 allows one year. The MTFC8GAMALNA-AAT has less stringent moisture handling requirements, reducing risk during storage and assembly.
Q: Are both parts ROHS3 compliant?
A: Yes. Both the MTFC8GLWDQ-3L AAT and MTFC8GAMALNA-AAT are ROHS3 compliant, meeting all hazardous substance restrictions.
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