MTFC8GLGDQ-AIT Z Equivalent & Substitute Parts

Part Overview

The MTFC8GLGDQ-AIT Z is a 64Gbit NAND Flash memory IC in e•MMC™ series format, manufactured by Micron Technology Inc. This component is classified as obsolete, necessitating identification of active equivalent parts for ongoing design requirements and production continuity. The part operates across a supply voltage range of 1.65V to 3.6V and supports industrial temperature ranges from -40°C to 85°C.

Substiute Parts

MTFC8GLGDQ-AIT Z

Micron Technology Inc.In Stock: 3986MTFC8GLGDQ-AIT Z Datasheet

Current PartRFQ

MTFC8GAMALNA-AIT

Micron Technology Inc.In Stock: 2304MTFC8GAMALNA-AIT Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GLGDQ-AIT Z is determined by the following critical parameters:

• Memory Size: 64Gbit (exact match required)
• Memory Organization: 8G x 8 (exact match required)
• Memory Interface: MMC (exact match required)
• Technology: FLASH - NAND (exact match required)
• Series: e•MMC™ (exact match required)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Base Product Number: MTFC8 (common manufacturer base)

The MTFC8GAMALNA-AIT qualifies as a direct substitute based on matching all critical electrical and functional parameters. The primary distinction is the package format transition from 100-LBGA to 100-TBGA, which represents a mechanical redesign while maintaining identical electrical performance and pinout compatibility within the e•MMC™ specification.

Parameter Comparison

Engineering Selection Recommendations

The MTFC8GAMALNA-AIT is the qualified substitute for the obsolete MTFC8GLGDQ-AIT Z. Selection of this substitute is supported by:

• Active product status ensuring ongoing availability and supply chain continuity
• ROHS3 compliance meeting current environmental and regulatory requirements
• Identical electrical specifications and functional performance across all critical parameters
• Maintained REACH compliance and export classification alignment
• Package format change from LBGA to TBGA requires PCB layout and assembly process validation to confirm mechanical compatibility and thermal performance in the target application

Frequently Asked Questions (FAQ)

Q: Can MTFC8GAMALNA-AIT directly replace MTFC8GLGDQ-AIT Z without design changes?

A: Electrical and functional compatibility is confirmed. However, the package format transition from 100-LBGA to 100-TBGA requires PCB footprint and assembly process evaluation. Both packages maintain 14x18mm dimensions and identical pinout within the e•MMC™ specification, but solder joint geometry and thermal characteristics differ between ball grid array types.

Q: What is the primary reason for substitution?

A: The MTFC8GLGDQ-AIT Z is classified as obsolete. The MTFC8GAMALNA-AIT maintains identical memory capacity, organization, interface, and operating specifications while offering active product status and current compliance certifications.

Q: Are there voltage or temperature differences between these parts?

A: No. Both parts operate at 1.65V to 3.6V supply voltage and -40°C to 85°C operating temperature range.

Q: What compliance advantages does the substitute offer?

A: The MTFC8GAMALNA-AIT is ROHS3 compliant, meeting current environmental regulations. Both parts maintain REACH compliance and identical export classification codes.