MTFC8GLDEA-4M IT Equivalent & Substitute Parts

Part Overview

The MTFC8GLDEA-4M IT is a 64Gbit NAND Flash memory IC in MMC interface format, manufactured by Micron Technology Inc. This component is classified as obsolete, necessitating identification of equivalent substitute parts for ongoing system support and new design implementations. The part operates across industrial temperature ranges (-40°C to 85°C) and is compliant with RoHS3 and REACH regulations.

Substiute Parts

MTFC8GLDEA-4M IT

Micron Technology Inc.In Stock: 4652MTFC8GLDEA-4M IT Datasheet

Current PartRFQ

MTFC8GAMALNA-AIT

Micron Technology Inc.In Stock: 2304MTFC8GAMALNA-AIT Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GLDEA-4M IT is determined by the following critical parameters:

• Memory Size: 64Gbit (exact match required)
• Memory Organization: 8G x 8 (exact match required)
• Memory Interface: MMC (exact match required)
• Memory Type: Non-Volatile FLASH (exact match required)
• Technology: FLASH - NAND (exact match required)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Series: e•MMC™ (exact match required)
• RoHS Compliance: ROHS3 Compliant (exact match required)
• MSL Rating: 3 (168 Hours) (exact match required)

The MTFC8GAMALNA-AIT meets all substitution criteria. While the package format differs (100-TBGA versus 153-WFBGA), both packages are surface-mount BGA configurations suitable for equivalent PCB integration with appropriate footprint redesign.

Parameter Comparison

Engineering Selection Recommendations

The MTFC8GAMALNA-AIT is the qualified substitute for the obsolete MTFC8GLDEA-4M IT. Both components are manufactured by Micron Technology Inc. and maintain identical electrical specifications, memory capacity, interface protocol, and environmental operating parameters.

The primary design consideration is package footprint transition from 153-WFBGA to 100-TBGA. This requires PCB layout modification but does not affect electrical compatibility or functional performance. The MTFC8GAMALNA-AIT maintains active product status, ensuring continued availability and supply chain support.

Both parts satisfy RoHS3 and REACH compliance requirements with equivalent MSL ratings, supporting identical handling and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can the MTFC8GAMALNA-AIT directly replace the MTFC8GLDEA-4M IT without design changes?

A: Electrical and functional compatibility is complete. PCB footprint redesign is required due to package format differences (153-WFBGA versus 100-TBGA). Signal integrity and power distribution remain equivalent.

Q: Are the operating temperature ranges identical?

A: Yes. Both parts operate across -40°C to 85°C, supporting identical thermal specifications for industrial applications.

Q: What is the significance of the package change from 153-WFBGA to 100-TBGA?

A: The 153-WFBGA measures 11.5x13mm while the 100-TBGA measures 14x18mm. This represents a different ball grid array configuration requiring footprint adjustment during PCB redesign. Electrical performance and interface protocol remain unchanged.

Q: Are RoHS and REACH compliance statuses equivalent?

A: Yes. Both parts are ROHS3 Compliant and REACH Unaffected, meeting identical regulatory requirements.

Q: What is the MSL rating and why is it important?

A: Both parts carry MSL 3 (168 Hours) rating, indicating identical moisture sensitivity levels and handling requirements during assembly and storage.

Q: Is the MMC interface protocol identical between both parts?

A: Yes. Both components implement the e•MMC™ series MMC interface protocol with identical electrical and timing characteristics.