MTFC8GAMALBH-AIT ES TR Equivalent & Substitute Parts

Part Overview

The MTFC8GAMALBH-AIT ES TR is a 64Gbit NAND Flash memory IC in MMC interface format, packaged in 153-TFBGA (11.5x13mm). This component is classified as obsolete, which necessitates identification of active equivalent parts for ongoing design support and procurement continuity. The part operates across the industrial temperature range of -40°C to 85°C and is supplied in Tape & Reel packaging with MSL 1 rating.

Substiute Parts

MTFC8GAMALBH-AIT ES TR
Micron Technology Inc.In Stock: 787MTFC8GAMALBH-AIT ES TR Datasheet
MTFC8GAMALBH-AIT ES TR
Current Part
MTFC8GAMALBH-AIT TR
Micron Technology Inc.In Stock: 1038MTFC8GAMALBH-AIT TR Datasheet
MTFC8GAMALBH-AIT TR
Direct

Key Parameters

Parameter Value
Memory Size 64Gbit
Memory Organization 8G x 8
Memory Interface MMC
Package Type 153-TFBGA (11.5x13)
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Memory Technology FLASH - NAND
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GAMALBH-AIT ES TR is determined by strict alignment of the following parameters:

  • Memory capacity: 64Gbit
  • Memory organization: 8G x 8 configuration
  • Interface standard: MMC (MultiMediaCard)
  • Physical package: 153-TFBGA with 11.5x13mm footprint
  • Operating temperature range: -40°C to 85°C
  • Mounting technology: Surface Mount

The identified substitute part maintains identical electrical and mechanical specifications across all critical parameters, ensuring direct functional equivalence without design modification.

Parameter Comparison

Parameter MTFC8GAMALBH-AIT ES TR (Main) MTFC8GAMALBH-AIT TR (Substitute)
Manufacturer Micron Technology Inc. Micron Technology Inc.
Memory Size 64Gbit 64Gbit
Memory Organization 8G x 8 8G x 8
Memory Interface MMC MMC
Package / Case 153-TFBGA 153-TFBGA
Supplier Device Package 153-TFBGA (11.5x13) 153-TFBGA (11.5x13)
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NAND FLASH - NAND
Series e•MMC™ e•MMC™
Product Status Obsolete Active
ECCN 3A991B1A 3A991B1A
HTSUS 8542.32.0071 8542.32.0071

Engineering Selection Recommendations

The MTFC8GAMALBH-AIT TR is the direct functional equivalent for the obsolete MTFC8GAMALBH-AIT ES TR. Both parts are manufactured by Micron Technology Inc. and share identical electrical and mechanical specifications. The substitute part carries Active product status, ensuring continued availability and manufacturing support.

The substitute part is ROHS3 Compliant and REACH Unaffected, providing regulatory compliance for new designs and procurement cycles. The MSL rating difference (MSL 1 for main part versus MSL 3 for substitute) reflects standard industry practice for active production components and does not impact functional compatibility.

Frequently Asked Questions (FAQ)

Q: Can MTFC8GAMALBH-AIT TR be used as a direct replacement for MTFC8GAMALBH-AIT ES TR?

A: Yes. Both parts are identical in memory capacity (64Gbit), organization (8G x 8), interface (MMC), package (153-TFBGA 11.5x13mm), and operating temperature range (-40°C to 85°C). No design modifications are required.

Q: What is the difference between the ES TR and TR packaging designations?

A: Both designations indicate Tape & Reel packaging. The ES TR variant is obsolete, while the TR variant is in active production. The physical packaging format and specifications are equivalent.

Q: Are there any compliance differences between the two parts?

A: The substitute part (MTFC8GAMALBH-AIT TR) carries ROHS3 Compliance and REACH Unaffected certifications. Both parts share the same ECCN and HTSUS classifications.

Q: What is the significance of the MSL rating difference?

A: The main part has MSL 1 (Unlimited shelf life), while the substitute has MSL 3 (168 hours). This reflects standard moisture sensitivity levels for active production components and does not affect functional performance or compatibility.

Q: Can the substitute part be used in existing designs without PCB modifications?

A: Yes. The 153-TFBGA package footprint (11.5x13mm) is identical, allowing direct PCB compatibility without layout changes.

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