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MTFC8GAMALBH-AIT ES TR Equivalent & Substitute Parts
Part Overview
The MTFC8GAMALBH-AIT ES TR is a 64Gbit NAND Flash memory IC in MMC interface format, packaged in 153-TFBGA (11.5x13mm). This component is classified as obsolete, which necessitates identification of active equivalent parts for ongoing design support and procurement continuity. The part operates across the industrial temperature range of -40°C to 85°C and is supplied in Tape & Reel packaging with MSL 1 rating.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Size | 64Gbit |
| Memory Organization | 8G x 8 |
| Memory Interface | MMC |
| Package Type | 153-TFBGA (11.5x13) |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Memory Technology | FLASH - NAND |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the MTFC8GAMALBH-AIT ES TR is determined by strict alignment of the following parameters:
- Memory capacity: 64Gbit
- Memory organization: 8G x 8 configuration
- Interface standard: MMC (MultiMediaCard)
- Physical package: 153-TFBGA with 11.5x13mm footprint
- Operating temperature range: -40°C to 85°C
- Mounting technology: Surface Mount
The identified substitute part maintains identical electrical and mechanical specifications across all critical parameters, ensuring direct functional equivalence without design modification.
Parameter Comparison
| Parameter | MTFC8GAMALBH-AIT ES TR (Main) | MTFC8GAMALBH-AIT TR (Substitute) |
|---|---|---|
| Manufacturer | Micron Technology Inc. | Micron Technology Inc. |
| Memory Size | 64Gbit | 64Gbit |
| Memory Organization | 8G x 8 | 8G x 8 |
| Memory Interface | MMC | MMC |
| Package / Case | 153-TFBGA | 153-TFBGA |
| Supplier Device Package | 153-TFBGA (11.5x13) | 153-TFBGA (11.5x13) |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Memory Type | Non-Volatile | Non-Volatile |
| Memory Format | FLASH | FLASH |
| Technology | FLASH - NAND | FLASH - NAND |
| Series | e•MMC™ | e•MMC™ |
| Product Status | Obsolete | Active |
| ECCN | 3A991B1A | 3A991B1A |
| HTSUS | 8542.32.0071 | 8542.32.0071 |
Engineering Selection Recommendations
The MTFC8GAMALBH-AIT TR is the direct functional equivalent for the obsolete MTFC8GAMALBH-AIT ES TR. Both parts are manufactured by Micron Technology Inc. and share identical electrical and mechanical specifications. The substitute part carries Active product status, ensuring continued availability and manufacturing support.
The substitute part is ROHS3 Compliant and REACH Unaffected, providing regulatory compliance for new designs and procurement cycles. The MSL rating difference (MSL 1 for main part versus MSL 3 for substitute) reflects standard industry practice for active production components and does not impact functional compatibility.
Frequently Asked Questions (FAQ)
Q: Can MTFC8GAMALBH-AIT TR be used as a direct replacement for MTFC8GAMALBH-AIT ES TR?
A: Yes. Both parts are identical in memory capacity (64Gbit), organization (8G x 8), interface (MMC), package (153-TFBGA 11.5x13mm), and operating temperature range (-40°C to 85°C). No design modifications are required.
Q: What is the difference between the ES TR and TR packaging designations?
A: Both designations indicate Tape & Reel packaging. The ES TR variant is obsolete, while the TR variant is in active production. The physical packaging format and specifications are equivalent.
Q: Are there any compliance differences between the two parts?
A: The substitute part (MTFC8GAMALBH-AIT TR) carries ROHS3 Compliance and REACH Unaffected certifications. Both parts share the same ECCN and HTSUS classifications.
Q: What is the significance of the MSL rating difference?
A: The main part has MSL 1 (Unlimited shelf life), while the substitute has MSL 3 (168 hours). This reflects standard moisture sensitivity levels for active production components and does not affect functional performance or compatibility.
Q: Can the substitute part be used in existing designs without PCB modifications?
A: Yes. The 153-TFBGA package footprint (11.5x13mm) is identical, allowing direct PCB compatibility without layout changes.
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