MTFC8GAMALBH-AAT ES Equivalent & Substitute Parts

Part Overview

The MTFC8GAMALBH-AAT ES is a 64Gbit NAND Flash memory IC in MMC interface format, packaged in a 153-TFBGA (11.5x13mm) configuration. This component is classified as obsolete, which necessitates identification of equivalent substitute parts for ongoing system support and new design implementations. The part operates across an extended temperature range of -40°C to 105°C and is designed for non-volatile storage applications requiring high-density memory in compact form factors.

Substiute Parts

MTFC8GAMALBH-AAT ES

Micron Technology Inc.In Stock: 1230MTFC8GAMALBH-AAT ES Datasheet

Current PartRFQ

MTFC8GAMALBH-AAT

Micron Technology Inc.In Stock: 16636MTFC8GAMALBH-AAT Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GAMALBH-AAT ES is determined by strict equivalence across the following critical parameters:

• Memory Size: 64Gbit (exact match required)
• Memory Organization: 8G x 8 (exact match required)
• Memory Interface: MMC (exact match required)
• Package / Case: 153-TFBGA (11.5x13) (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Operating Temperature Range: -40°C ~ 105°C (exact match required)
• Technology: FLASH - NAND (exact match required)

The substitute part MTFC8GAMALBH-AAT meets all substitution criteria and is electrically and mechanically compatible with the obsolete ES variant.

Parameter Comparison

Engineering Selection Recommendations

The MTFC8GAMALBH-AAT is the direct substitute for the obsolete MTFC8GAMALBH-AAT ES variant. Both parts are manufactured by Micron Technology Inc. and share identical electrical and mechanical specifications. The substitute part is currently in active production status, ensuring availability for procurement and integration into new designs or legacy system support.

The substitute part carries RoHS3 compliance and REACH unaffected status, meeting current regulatory requirements for electronic component manufacturing and distribution. The Moisture Sensitivity Level (MSL) differs between the two variants (MSL 1 for the ES version versus MSL 3 for the active variant), which may affect storage and handling protocols but does not impact functional compatibility or performance characteristics.

Frequently Asked Questions (FAQ)

Q: Can MTFC8GAMALBH-AAT be used as a direct replacement for MTFC8GAMALBH-AAT ES?

A: Yes. Both parts are electrically and mechanically equivalent. They share identical memory capacity (64Gbit), organization (8G x 8), interface protocol (MMC), package configuration (153-TFBGA 11.5x13), and operating temperature range (-40°C to 105°C). The primary difference is product status: the ES variant is obsolete while the standard variant is in active production.

Q: Are there any compliance differences between the two parts?

A: The substitute part (MTFC8GAMALBH-AAT) includes RoHS3 compliance and REACH unaffected status documentation. The obsolete ES variant does not list these certifications in available documentation. Both parts share identical ECCN and HTSUS classifications.

Q: What is the significance of the different Moisture Sensitivity Levels (MSL)?

A: The ES variant carries MSL 1 (unlimited shelf life), while the substitute carries MSL 3 (168 hours maximum). This affects storage conditions and handling protocols but does not impact electrical performance or functional compatibility. MSL 3 components require controlled humidity storage and have defined time limits after packaging opening.

Q: Is the 153-TFBGA package the same for both parts?

A: Yes. Both parts use the identical 153-TFBGA package with dimensions of 11.5x13mm. PCB footprint, solder pad configuration, and mounting requirements are identical.

Q: What inventory status should be considered for procurement?

A: The substitute part (MTFC8GAMALBH-AAT) has 16,556 pieces in stock as an active product. The obsolete ES variant has 1,147 pieces remaining in inventory. For new designs and ongoing support, the active substitute part is the recommended procurement choice.