MTFC8GAKAJCN-4M IT TR Equivalent & Substitute Parts

Part Overview

The MTFC8GAKAJCN-4M IT TR is a 64Gbit NAND Flash memory IC in MMC interface format, manufactured by Micron Technology Inc. and packaged in a 153-VFBGA (11.5x13mm) configuration. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and component procurement.

The necessity to identify substitute parts arises from the product's obsolete status, which restricts availability through standard distribution channels. Equivalent parts must maintain compatibility across memory capacity, interface protocol, electrical specifications, and physical packaging to ensure seamless integration into existing designs.

Substiute Parts

MTFC8GAKAJCN-4M IT TR

Micron Technology Inc.In Stock: 9119MTFC8GAKAJCN-4M IT TR Datasheet

Current PartRFQ

FEMC008GTTE7-T14-16

Flexxon Pte LtdIn Stock: 1223FEMC008GTTE7-T14-16 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the MTFC8GAKAJCN-4M IT TR is determined by strict alignment across the following critical parameters:

Memory Capacity & Organization: The substitute part must provide 64Gbit capacity with 8G x 8 organization to maintain data storage equivalence.

Interface Protocol: While the main part uses MMC interface, the substitute FEMC008GTTE7-T14-16 implements eMMC interface. Both protocols operate within the same electrical and timing envelope for this memory class, with eMMC representing an enhanced evolution of MMC that maintains backward compatibility at the signal level for basic read/write operations.

Package & Form Factor: Both parts utilize 153-VFBGA packaging with identical 11.5x13mm dimensions, ensuring mechanical compatibility with existing PCB layouts and sockets.

Electrical Specifications: Supply voltage range (2.7V ~ 3.6V) and operating temperature range (-40°C ~ 85°C) are identical, confirming electrical interchangeability.

Compliance & Environmental: Both parts meet ROHS3 compliance and share identical MSL rating (3, 168 Hours), ensuring equivalent handling and storage requirements.

Parameter Comparison

Engineering Selection Recommendations

The FEMC008GTTE7-T14-16 qualifies as a functional equivalent based on matching memory capacity, organization, package dimensions, electrical specifications, and environmental compliance ratings. The primary distinction is the interface protocol: eMMC versus MMC.

The substitute part carries Active product status, ensuring continued availability and manufacturing support, whereas the main part is Obsolete. Both components maintain ROHS3 compliance and identical MSL ratings, confirming equivalent regulatory and handling requirements.

Selection of the substitute should be based on system-level interface compatibility. The eMMC protocol in the FEMC008GTTE7-T14-16 represents a superset of MMC functionality with enhanced performance capabilities (200 MHz clock frequency specified for this part). Systems designed for MMC interface operation will require firmware or controller-level validation to confirm eMMC compatibility before deployment.

Frequently Asked Questions (FAQ)

Q: Can the FEMC008GTTE7-T14-16 directly replace the MTFC8GAKAJCN-4M IT TR in existing designs?

A: Physical and electrical compatibility is confirmed across package, voltage, temperature, and capacity parameters. Interface protocol compatibility (eMMC vs. MMC) requires system-level validation. The eMMC protocol is functionally compatible with MMC at the command and data transfer level for standard read/write operations, but controller firmware may require updates to fully utilize eMMC-specific features.

Q: What are the key differences between these two parts?

A: The primary differences are manufacturer (Micron vs. Flexxon), interface protocol (MMC vs. eMMC), product status (Obsolete vs. Active), and clock frequency specification (not provided for main part vs. 200 MHz for substitute). Memory capacity, organization, package, voltage, temperature range, and compliance ratings are identical.

Q: Are there any packaging differences between the two parts?

A: Both parts use 153-VFBGA packaging with identical 11.5x13mm dimensions. The main part specifies 153-VFBGA while the substitute specifies 153-FBGA; both designations refer to the same physical package format and are mechanically interchangeable.

Q: What is the significance of the eMMC protocol in the substitute part?

A: eMMC (embedded MMC) is an enhanced version of the MMC protocol that maintains backward compatibility while adding higher performance capabilities. For this 64Gbit memory class, both protocols operate within the same electrical envelope and support identical data capacity and organization.

Q: How do the compliance and environmental ratings compare?

A: Both parts are ROHS3 compliant and carry identical Moisture Sensitivity Level (MSL) ratings of 3 with 168-hour exposure limits. Handling, storage, and environmental requirements are equivalent.