MTFC64GAPALBH-IT Equivalent & Substitute Parts

Part Overview

The MTFC64GAPALBH-IT is a 64Gbit NAND Flash memory IC in MMC interface configuration, manufactured by Micron Technology Inc. in a 153-TFBGA package (11.5x13mm). This component is classified as obsolete, necessitating identification of functionally compatible alternatives for ongoing system support and new design implementations. The part operates across the industrial temperature range of -40°C to 85°C and maintains ROHS3 compliance with MSL 3 moisture sensitivity rating.

Key Parameters

Parameter	Value
Manufacturer	Micron Technology Inc.
Memory Type	Non-Volatile FLASH
Memory Size	64Gbit
Memory Organization	8G x 8
Memory Interface	MMC
Package Type	153-TFBGA (11.5x13mm)
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the MTFC64GAPALBH-IT is determined by the following critical parameters:

Interface Compatibility: The original part operates on MMC interface protocol. The identified substitute, MTFC64GAZAQHD-IT, operates on eMMC interface, which represents an enhanced protocol variant within the same Micron product family.

Package Compatibility: Both parts utilize 153-pin BGA packages with identical footprint dimensions (11.5x13mm), enabling direct PCB-level compatibility without layout modification.

Temperature Range: Both parts maintain identical operating temperature specifications (-40°C to 85°C), ensuring thermal performance equivalence across industrial applications.

Compliance Standards: Both parts maintain ROHS3 compliance, identical MSL 3 ratings, and equivalent ECCN/HTSUS classifications, satisfying regulatory requirements without deviation.

Memory Organization: The substitute part provides 512Gbit capacity (64G x 8 organization) compared to the original 64Gbit (8G x 8), representing a capacity upgrade within the same interface family.

Parameter Comparison

Parameter	MTFC64GAPALBH-IT (Original)	MTFC64GAZAQHD-IT (Substitute)
Manufacturer	Micron Technology Inc.	Micron Technology Inc.
Memory Type	Non-Volatile FLASH	Non-Volatile FLASH
Memory Size	64Gbit	512Gbit
Memory Organization	8G x 8	64G x 8
Memory Interface	MMC	eMMC
Package Type	153-TFBGA (11.5x13mm)	153-VFBGA (11.5x13mm)
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount
Supply Voltage	Not specified	2.7V ~ 3.6V
Clock Frequency	Not specified	200 MHz
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	3 (168 Hours)	3 (168 Hours)
Product Status	Obsolete	Last Time Buy

Engineering Selection Recommendations

For Direct Replacement: The MTFC64GAZAQHD-IT serves as the manufacturer-recommended substitute for the obsolete MTFC64GAPALBH-IT. Both parts share identical package footprints, thermal specifications, and compliance certifications. The substitute maintains ROHS3 compliance and equivalent MSL ratings, satisfying regulatory requirements without modification.

Interface Consideration: The transition from MMC to eMMC interface represents a protocol enhancement. System firmware and controller implementations must support eMMC protocol to utilize the substitute part. This is a functional requirement, not an optional consideration.

Capacity Upgrade: The substitute provides 8x memory capacity (512Gbit vs. 64Gbit). Systems designed for the original part will function with the substitute without performance degradation, as the increased capacity does not impose additional electrical or thermal demands beyond the specified operating parameters.

Product Status: The original part is classified as obsolete, while the substitute is designated Last Time Buy. This status differential indicates limited future availability of the substitute and necessitates long-term supply planning for sustained production requirements.

Frequently Asked Questions (FAQ)

Q: Can MTFC64GAZAQHD-IT be used as a direct pin-for-pin replacement?

A: Both parts utilize 153-pin BGA packages with identical footprint dimensions (11.5x13mm). Pin-level compatibility requires verification of signal mapping between MMC and eMMC protocols at the controller interface level. Physical PCB compatibility is confirmed; functional compatibility depends on controller firmware support for eMMC protocol.

Q: What is the primary difference between MMC and eMMC interfaces?

A: eMMC represents an enhanced protocol variant of MMC with additional features including higher clock frequency support (200 MHz specified for the substitute). Both protocols operate within the same electrical and thermal envelope as specified in this comparison.

Q: Are there temperature or compliance differences between the parts?

A: Both parts maintain identical operating temperature ranges (-40°C to 85°C) and compliance certifications (ROHS3, MSL 3). No thermal or regulatory differentiation exists between the original and substitute parts.

Q: Why does the substitute have higher memory capacity?

A: The MTFC64GAZAQHD-IT represents a later-generation product within the Micron eMMC family, incorporating increased storage density. The higher capacity does not increase power consumption or thermal output beyond the specified operating parameters of the original part.

Q: What is the significance of "Last Time Buy" status for the substitute?

A: Last Time Buy designation indicates limited future manufacturing availability. For applications requiring sustained component supply, alternative long-term sourcing strategies should be evaluated beyond the substitute part lifecycle.

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