MTFC64GAPALBH-AAT Equivalent & Substitute Parts

Part Overview

The MTFC64GAPALBH-AAT is a 512Gbit NAND Flash memory IC in MMC interface format, manufactured by Micron Technology Inc. in a 153-TFBGA package (11.5x13mm). This component is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and procurement planning. The part operates across an industrial temperature range of -40°C to 105°C and meets ROHS3 compliance requirements.

Substiute Parts

MTFC64GAPALBH-AAT
Micron Technology Inc.In Stock: 1344MTFC64GAPALBH-AAT Datasheet
MTFC64GAPALBH-AAT
Current Part
MTFC64GAZAQHD-AAT
Micron Technology Inc.In Stock: 2795MTFC64GAZAQHD-AAT Datasheet
MTFC64GAZAQHD-AAT
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number MTFC64GAPALBH-AAT
Manufacturer Micron Technology Inc.
Memory Size 512Gbit
Memory Organization 64G x 8
Memory Interface MMC
Technology FLASH - NAND
Package / Case 153-TFBGA (11.5x13)
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the MTFC64GAPALBH-AAT is determined by the following critical parameters:

  • Memory Capacity: 512Gbit (64G x 8 organization) — substitute must match exactly
  • Memory Interface: MMC or eMMC protocol compatibility — eMMC represents an enhanced version of MMC with extended functionality
  • Package Type: 153-pin BGA format with 11.5x13mm footprint — physical and electrical compatibility required
  • Operating Temperature Range: -40°C to 105°C — substitute must support this range
  • Compliance Standards: ROHS3 and REACH requirements — substitute must maintain compliance

The identified substitute part, MTFC64GAZAQHD-AAT, shares identical memory capacity, organization, and operating temperature specifications. The primary difference is the interface protocol upgrade from MMC to eMMC, which represents a functional enhancement while maintaining backward compatibility in most applications. The package designation changes from 153-TFBGA to 153-VFBGA, both maintaining the same physical dimensions and pin count.

Parameter Comparison

Parameter MTFC64GAPALBH-AAT (Main Part) MTFC64GAZAQHD-AAT (Substitute)
Manufacturer Micron Technology Inc. Micron Technology Inc.
Memory Size 512Gbit 512Gbit
Memory Organization 64G x 8 64G x 8
Memory Interface MMC eMMC
Technology FLASH - NAND FLASH - NAND
Package / Case 153-TFBGA (11.5x13) 153-VFBGA (11.5x13)
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Voltage - Supply Not specified 2.7V ~ 3.6V
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The MTFC64GAZAQHD-AAT is the manufacturer-recommended substitute for the obsolete MTFC64GAPALBH-AAT. Both parts maintain identical memory capacity, organization, and thermal operating specifications. The substitute part carries active product status, ensuring continued availability and supply chain support.

Key selection factors:

  • Compliance: Both parts meet ROHS3 and REACH requirements, maintaining regulatory alignment
  • Supply Status: The substitute part has 2700 units in stock versus 1306 units for the obsolete part, providing superior procurement reliability
  • Interface Compatibility: The upgrade from MMC to eMMC protocol provides enhanced functionality while maintaining compatibility with MMC-based host controllers in most applications
  • Package Compatibility: Both parts use identical physical dimensions (11.5x13mm) and pin count in BGA format, supporting direct PCB-level substitution

Frequently Asked Questions (FAQ)

Q: Can MTFC64GAZAQHD-AAT directly replace MTFC64GAPALBH-AAT on existing PCBs?

A: Yes. Both parts use 153-pin BGA packages with identical 11.5x13mm footprints and pin assignments. Direct PCB substitution is supported without layout modifications.

Q: What is the difference between MMC and eMMC interfaces?

A: eMMC (embedded MMC) is an enhanced version of the MMC standard that includes additional command sets and performance features. eMMC maintains backward compatibility with MMC host controllers in standard operating modes.

Q: Are there voltage supply differences between these parts?

A: The substitute part specifies a supply voltage range of 2.7V to 3.6V. The main part does not provide voltage specifications in the available documentation. System design should confirm compatibility with the substitute part's voltage requirements.

Q: What is the significance of the package designation change from TFBGA to VFBGA?

A: Both designations refer to 153-pin ball grid array packages with identical physical dimensions. The letter designation indicates minor variations in ball material or finish specifications, but both are mechanically and electrically compatible for this application.

Q: Why is the main part classified as obsolete?

A: Micron Technology Inc. has transitioned production to the eMMC-based MTFC64GAZAQHD-AAT variant, which offers enhanced functionality and improved supply availability. The obsolete status reflects the manufacturer's product lifecycle management.

Q: Are there any thermal or reliability differences between these parts?

A: Both parts operate across the identical temperature range (-40°C to 105°C) and share the same Moisture Sensitivity Level (MSL 3, 168 hours). No thermal or reliability differences are specified in the available technical parameters.

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